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北京时间·🕒 发布 05-27 05:40:52时区推断·⟳ 抓取 06-12 03:49:26回填·⚡ 决策 06-16 23:42:20·132.8 天前
Applied Materials宣布SCREEN Semiconductor加入EPIC Center成为创新合作伙伴
📄 原文Applied Materials↗ 原文
Today Applied Materials announced that SCREEN Semiconductor Solutions Co., Ltd. has joined the EPIC Center as its newes…
不做 AMAT.US
常规研发合作公告，无重大短期财务影响或独家排他条款，对大盘股短期股价驱动力不足，缺乏交易edge
不做 8035.JP
与AMAT的研发合作属长期生态利好，但短期无直接业绩贡献，属行业常规合作，缺乏短期爆发力
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Today Applied Materials announced that SCREEN Semiconductor Solutions Co., Ltd. has joined the EPIC Center as its newest innovation partner. The collaboration will bring together SCREEN SPE’s expertise in wafer cleaning technology with Applied's leadership in materials engineering to develop co-optimized process solutions for the world’s most advanced chips.
“The EPIC Center is designed to dramatically accelerate the commercialization of next-generation semiconductor technologies by co-locating and co-innovating with customers and partners across the entire semiconductor ecosystem,” said Dr. Prabu Raja, President of the Semiconductor Products Group at Applied Materials. “SCREEN SPE’s wet etch and surface preparation capabilities are deeply intertwined with virtually every process step in chip manufacturing. By bringing our technologies together at the EPIC Center, we can develop co-optimized process solutions that address the increasingly complex surface engineering challenges our customers face as they push to the next technology frontier.”
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“The EPIC Center is designed to dramatically accelerate the commercialization of next-generation semiconductor technologies by co-locating and co-innovating with customers and partners across the entire semiconductor ecosystem,” said Dr. Prabu Raja, President of the Semiconductor Products Group at Applied Materials. “SCREEN SPE’s wet etch and surface preparation capabilities are deeply intertwined with virtually every process step in chip manufacturing. By bringing our technologies together at the EPIC Center, we can develop co-optimized process solutions that address the increasingly complex surface engineering challenges our customers face as they push to the next technology frontier.”
Learn more:
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