🐦 推特SemiAnalysisV1 · 实盘不做把握 8/10
北京时间·🕒 发布 05-31 09:00:28时区推断·⟳ 抓取 06-08 14:36:03回填·⚡ 决策 06-16 21:33:30·133.0 天前
SemiAnalysis称华为先进封装(Hybrid Bonding)技术超越TSMC与Intel
📄 原文SemiAnalysis↗ 原文
Necessity is the mother of innovation. In one fell swoop, Huawei overtakes all in advanced Hybrid Bonding technology, w…
不做 2330.TW
华为手机芯片封装突破属特定场景(弥补制程劣势)应用，与TSMC主攻的HPC/AI先进封装(CoWoS/SoIC)场景不同，对TSMC基本面与营收无实质冲击，属情绪噪音，无交易edge。
不做 INTC.US
华为手机SoC封装进展对Intel Foveros(HPC/服务器为主)基本盘无实质影响，应用场景不同，市场不会因此重新定价，无交易价值。
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Necessity is the mother of innovation.
In one fell swoop, Huawei overtakes all in advanced Hybrid Bonding technology, with 2026 Kirin smartphones featuring 1.5 µm bond pitch 3D-stacked architecture.
Next year's Kirin chips will go down 1 µm pitch!
TSMC has only just moved to 6 µm SoIC, with their next step to 4.5 µm for 2030 products.
Intel's Foveros Direct is at 9 µm with Clearwater Forest this year.
16-36x denser interconnect enables Huawei's LogicFolding design, with more granular architectural splitting across the dies to optimize routing and shorten critical paths.
In one fell swoop, Huawei overtakes all in advanced Hybrid Bonding technology, with 2026 Kirin smartphones featuring 1.5 µm bond pitch 3D-stacked architecture.
Next year's Kirin chips will go down 1 µm pitch!
TSMC has only just moved to 6 µm SoIC, with their next step to 4.5 µm for 2030 products.
Intel's Foveros Direct is at 9 µm with Clearwater Forest this year.
16-36x denser interconnect enables Huawei's LogicFolding design, with more granular architectural splitting across the dies to optimize routing and shorten critical paths.
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