Jukan转述ASML涨价、苹果寻AI芯片收购和三星P5设备订单等半导体新闻汇总

Daily News Recap

The Information: ASML Plans Price Increases for Chipmaking Equipment, Despite TSMC Resistance

Article Summary:

- ASML is considering raising the prices of its EUV systems, citing surging demand from the AI and memory semiconductor markets. It has also notified some customers that it plans to increase DUV equipment prices by 10%.
- TSMC, ASML’s largest customer, is pushing back against price increases for both EUV and DUV systems. However, some Chinese semiconductor companies have accepted the higher DUV prices.
- ASML has raised its 2026 revenue outlook to €43 billion–€45 billion and plans to increase annual production capacity for two of its key systems by 30% this year.
- TSMC faces a dilemma: ASML’s equipment is essential for expanding its AI chip and advanced CoWoS packaging capacity, but the company also wants to keep costs under control while securing additional systems.
- China is likely to be hit hardest by the DUV price increases because export restrictions prevent Chinese companies from purchasing EUV systems and certain advanced DUV systems, while alternative suppliers remain limited.

Jukan’s Take:

TEL and other equipment makers are already pursuing aggressive price increases. In meetings with the media and sell-side analysts, TEL said it is seeking to raise equipment prices by as much as 50% over the long term.

Lead times across the semiconductor equipment industry have already increased significantly. Given the circumstances, it is only natural that toolmakers would want to raise prices. Still, it is somewhat surprising that TSMC is already pushing back. TSMC appears to be extremely focused on protecting its margins.

The Information: Apple Hunts for AI Chip Acquisitions

- Apple is actively searching for acquisition targets, including semiconductor startups, to strengthen its in-house AI server chip capabilities.
- Its current M2 Ultra-based servers have limitations when processing large AI models, forcing Apple to run some features of the new Siri on Nvidia chips hosted in Google Cloud.
- Delays to Apple’s next-generation AI server chip, “Baltra,” have also fueled concerns that the company’s semiconductor design expertise remains too heavily focused on mobile applications.
- Apple is seeking to reduce its dependence on Nvidia through M5 and M7 Ultra-based server chips and a joint development project with Broadcom. However, the M7 Ultra-based product is not expected until 2029.
- Given Apple’s recent consideration of major acquisitions, potential changes to its cash policy, and an eventual CEO transition, the company may be more willing than in the past to pursue a large-scale acquisition of a semiconductor or AI company.

Jukan’s Take:

The delay to Baltra, combined with Apple’s search for semiconductor startup acquisitions, raises the question of whether Apple is effectively admitting that it lacks sufficient expertise in server chips.

ETNews: Samsung’s Pyeongtaek Plant 5 Poised to Place More Than KRW 10 Trillion in Semiconductor Equipment Orders

- Samsung Electronics has nearly completed the selection of equipment suppliers for Phase 1, the first production line at its Pyeongtaek Plant 5 (P5), and is expected to begin issuing purchase orders shortly. Supplier selection for Phase 2 is also underway, meaning the total order value is expected to significantly exceed KRW 10 trillion.

- P5 will be a massive fab featuring six cleanrooms across three floors, with a target of increasing production capacity by more than 50% compared with Samsung’s existing Pyeongtaek fabs.
- Its main products will be advanced DRAM, including HBM. Samsung is also considering adding foundry lines depending on market conditions.
- The entire facility is scheduled to become operational by 2028, but Phase 1 could begin operations as early as next year if equipment deliveries proceed smoothly.
- To address the global memory shortage and expanding AI infrastructure demand, Samsung has asked equipment suppliers to shorten their delivery lead times.
- Because equipment purchases account for approximately 70%–80% of total fab construction costs, domestic and international semiconductor equipment companies with strong technological capabilities could be major beneficiaries.

iNews24: Omdia Says HBM Prices Will Begin Declining in 2030, With New Fabs as the Key Variable

High-bandwidth memory prices are expected to begin declining in 2030. However, supply shortages are likely to persist until new production facilities come fully online.