📰 The InformationThe InformationCodex · 实盘可交易 · 做多市场:A股▼ 亏 -11.73% · 已结算 · 2 腿均把握 5/10🔁 +1 同一事件
北京时间·🕒 发布 21:01:00时区推断·待核·⟳ 抓取 20:58:55·⚡ 决策 07-27 21:08:57 +10m02s·91.8 天前
The Information称中国国产浸没式DUV光刻机已开始小批量生产并拟交付本土晶圆厂
这不是泛政策表态,而是The Information报道称国产浸没式DUV从原型验证推进到今年约5台、2027年约20台的小批量生产,并拟交付中芯国际、华虹、长鑫等客户测试。
📄 原文The Information↗ 原文
China Starts Mass-Producing Homegrown DUV Chipmaking Tools, An Advance for Local Chip Industry
The people asked that the company not be identified because of the sensitivity surrounding China’s lithography program.…
▼ 亏 -12.29%入场 07-28 开盘 @430.00 → 离场 07-29 开盘 @378.81
日 K 取自复盘打分切片 · 蓝点/蓝虚线 = 纸面入场价 · 灰虚线 = 纸面离场 · 持有期红底 = 赚(价格在入场线上方)、绿底 = 亏
💡 交易逻辑国产DUV小批量生产,光学零部件弹性最大
怎么买 限价买入 不高于昨收 +3%、2 个交易日内有效
怎么卖 止盈 +6%(半仓)/+12%(清仓) · 止损 -7% · 时间止损 3日
▼ 亏 -11.17%入场 07-28 开盘 @204.00 → 离场 07-29 开盘 @182.00
日 K 取自复盘打分切片 · 蓝点/蓝虚线 = 纸面入场价 · 灰虚线 = 纸面离场 · 持有期红底 = 赚(价格在入场线上方)、绿底 = 亏
💡 交易逻辑国产整机放量验证,零部件国产替代受益
怎么买 限价买入 不高于昨收 +3%、2 个交易日内有效
怎么卖 止盈 +5%(半仓)/+10%(清仓) · 止损 -6% · 时间止损 3日
不做 张江高科(600895.SH)
更多是上海微电子/国产光刻机概念映射,主营与本次DUV小批量生产的收入传导太间接,不作为主腿。
不做 芯源微(688037.SH)
涂胶显影与光刻工艺相关但非本次DUV整机突破直接环节,且近5日已涨约16.9%,追高性价比弱。
不做 ASML(ASML.US)
报道本身称国产DUV产量很小且仍落后ASML,短期难构成强空催化;未满足做空红线。
展开详情(成交明细 / 研究档案 / 原文全文 / 决策记录链)
分时走势
做多 688502.SH 茂莱光学
建仓日早于近 30 天,只有日线图
做多 688409.SH 富创精密
建仓日早于近 30 天,只有日线图
成交明细 · 纸面
做多 688502.SH 茂莱光学
| 收益状态 | -12.29% 已平仓 |
|---|---|
| 进场成交 | 2026-07-28 · 开盘 · @430 |
| 离场成交 | 2026-07-29 · 开盘 · @378.81 |
| 毛收益 | -11.90% |
| 成本 | +0.39% |
| 净收益 | -12.29% |
| 计入收益 | -12.29% |
| 建仓日 | 2026-07-28 · 进场不早于新闻时刻 + 2 分钟 |
做多 688409.SH 富创精密
| 收益状态 | -11.17% 已平仓 |
|---|---|
| 进场成交 | 2026-07-28 · 开盘 · @204 |
| 离场成交 | 2026-07-29 · 开盘 · @182 |
| 毛收益 | -10.78% |
| 成本 | +0.39% |
| 净收益 | -11.17% |
| 计入收益 | -11.17% |
| 建仓日 | 2026-07-28 · 进场不早于新闻时刻 + 2 分钟 |
收益口径 event_time_plus_2min_10min_walk_open_topup_to_next_open_exchange_calendar_fill_model_local_notional_v9 · method_id m8db1cbc8f2d · 截至 2026-10-27 15:33
研究档案
🔎 新鲜度:最早出现 2026-07-27 · 扩散 low · price-in 风险 medium ↗
消息传播链
- 行业媒体援引知情人士称上海相关公司已开始生产国产浸没式DUV,计划今年约5台、2027年约20台,并拟交付中芯国际、华虹、长鑫等本土芯片厂。市场反应:A股已收盘,美股盘前;A股映射标的尚未就该报道开下一交易时段。
- 2026-07-27其它内部KB非一手内部库此前已有MATCH法案和光刻胶/设备国产替代讨论,但未命中同一条国产DUV小批量生产并交付客户的旧闻。
关键理由
- 这不是泛政策表态,而是The Information报道称国产浸没式DUV从原型验证推进到今年约5台、2027年约20台的小批量生产,并拟交付中芯国际、华虹、长鑫等客户测试。
- 国产光刻机本体未找到可直接交易主体,A股短线更可能交易光学/精密零部件与国产设备替代标签;茂莱光学(688502.SH)市值约202亿元、富创精密(688409.SH)市值约609亿元,弹性明显高于ASML或晶圆厂主标的。
- 量级上,5台/20台产出相对ASML去年131台浸没式DUV出货仍很小,商业化收入暂无法可靠拆到具体A股公司,因此只适合按新鲜主题验证做probe篮子,不适合重仓。
主要风险
- 报道明确称设备仍落后ASML、导入量产线可能需要数月或更久,且部分关键零部件仍来自日本,基本面兑现不确定。
- 多只国产设备/材料映射股7月已大幅波动且7月21日前后已有主题急拉,次日若高开超过限价容易高开低走,买不到或买后回撤都要接受。
反向证据
- 做多前查反向 · 来源 kb_search · 日期 2026-07-27 · 影响 weakens
内部KB未命中同一条小批量生产旧闻,但显示光刻胶/设备国产替代和MATCH法案已被机构持续讨论,说明主题并非低认知。
检索:国产 DUV 光刻机 量产 御量晟 上海微电子 张江高科 茂莱光学 富创精密 敞口 - 做多前查反向 · 来源 kb_search · 日期 2026-07-27 · 影响 weakens
未找到茂莱光学被一手披露为本次国产DUV供应商的证据,映射更偏主题标签而非确认订单。
检索:茂莱光学 光刻机 物镜 DUV 光刻机 年报 客户 上海微电子 - 做多前查反向 · 来源 kb_search · 日期 2026-07-01 · 影响 weakens
内部专家交流显示富创精密属国内半导体零部件头部厂商且行业交期延长,但未坐实其直接供给本次DUV整机。
检索:富创精密 光刻机 零部件 国产光刻机 上海微电子 敞口 原文 ↗ - 做空前查反向 · 来源 web · 日期 2026-07-27 · 影响 invalidates
原文明确称国产DUV产量很小且性能/可靠性仍落后,ASML短期威胁有限,不满足强空催化。
检索:ASML China domestic DUV mass production immediate threat 原文 ↗
历史先例(按相似度)
- 相似度 8/10 688037 2025-09-22 芯源微披露前道化学清洗机通过国内领先客户工艺验证并获重复批量订单,新一代前道涂胶显影机预计Q4发机验证。 原文 ↗
事件后 +1日 +2.1% · +2日 +12.9% · +3日 +7.6% · +4日 +7.3% · +5日 +9.8%
相似度依据:同为A股半导体前道设备国产替代,从客户验证/发机走向订单或交付,相位接近但不是光刻整机光学件。 - 相似度 8/10 300331 2023-09-06 华为国产芯片突破与上海微电子28nm浸没式光刻机交付预期扩散,苏大维格作为光刻设备/微纳光学相关标的被资金交易。 原文 ↗
事件后 +1日 +4.1% · +2日 +8.9% · +3日 +6.3% · +4日 +11.6% · +5日 +9.5%
相似度依据:同市场、同国产光刻机链条扩散,微纳光学/光刻设备属性接近,但锚点偏传闻发酵而非明确小批量交付。 - 相似度 7/10 002222 2023-09-06 荷兰出口管制生效叠加上海微电子28nm浸没式光刻机年底交付预期,光刻机/光刻胶方向领涨,福晶科技作为光源系统链条标的被交易。 原文 ↗
事件后 +1日 -1.8% · +2日 -0.3% · +3日 +0.9% · +4日 -0.8% · +5日 -3.2%
相似度依据:同为A股国产光刻机零部件/光源链交易,但福晶科技更多是光源材料链,和茂莱光学精密光学部件弹性不完全一致。 - 相似度 7/10 600895 2023-12-20 张江集团公众号披露上海微电子已成功研制28nm光刻机,张江高科为上海微电子股东方,属于国产前道光刻机突破的直接A股映射。 原文 ↗
事件后 +1日 -2.1% · +2日 -6.0% · +3日 -6.0% · +4日 -9.4% · +5日 -7.1%
相似度依据:同市场且直接映射上海微电子28nm光刻机突破,但张江高科是股权/园区映射,非光学零部件供应商。 - 相似度 7/10 ASML 2024-01-24 ASML在2023Q4财报中披露已在年末向客户发出首台High NA EUV EXE:5000模块,同时Q4订单强劲。 原文 ↗
事件后 +1日 +2.6% · +2日 +2.4% · +3日 +4.2% · +4日 +2.5% · +5日 +2.7%
相似度依据:同为先进光刻机交付兑现,产品层级更高且是全球整机龙头财报节点,跨市场且非国产替代。 - 相似度 7/10 ASML 2015-04-22 ASML宣布与美国大客户签署至少15台EUV光刻系统交付协议,首两台预计2015年底前交付。 原文 ↗
事件后 +1日 +0.9% · +2日 -0.0% · +3日 +2.6% · +4日 +2.7% · +5日 +0.5%
相似度依据:同为先进光刻机从研发走向客户导入/批量交付的大额订单节点,但测的是海外整机厂而非中国零部件。 - 相似度 6/10 CAJPY 2023-10-13 Canon发布FPA-1200NZ2C纳米压印半导体制造系统,称其覆盖多类应用并以非投影曝光机制实现图形转移。 原文 ↗
事件后 +1日 +2.2% · +2日 +2.6% · +3日 +2.1% · +4日 +4.5% · +5日 +1.8%
相似度依据:同属光刻设备新品商业化发布,但Canon纳米压印与浸没式DUV机制不同,且OTC ADR流动性较弱。 - 相似度 6/10 CAJPY 2024-10-01 Canon宣布FPA-1200NZ2C纳米压印光刻系统已于2024-09-26发货给Texas Institute for Electronics。 原文 ↗
事件后 +1日 -0.9% · +2日 -0.8% · +3日 +0.6% · +4日 -0.7% · +5日 +2.1%
相似度依据:同为光刻新品交付兑现,但品类是纳米压印且交易在OTC ADR,和A股国产替代链弹性差异较大。 - 相似度 5/10 002428.SZ 2026-06-16 JX金属InP衬底扩产至7-10倍,境外供给变化点燃国产替代材料主题。 原文 ↗
事件后 +1日 -1.9% · +2日 -0.8% · +3日 +9.2% · +4日 +10.6% · +5日 +21.6%
相似度依据:同为A股国产替代主题的供给侧事件,但不是光刻机本体,适合看主题扩散不适合定幅度。 - 相似度 5/10 603065.SH 2026-06-16 JX金属InP衬底扩产后相关材料链被资金交易。 原文 ↗
事件后 +1日 +2.5% · +2日 +8.1% · +3日 +18.9% · +4日 +23.9% · +5日 +26.6%
相似度依据:同为国产替代链条的主题扩散,标的与当前光刻机映射不完全一致。 - 相似度 5/10 688146.SH 2026-06-16 日本关东电化/中央硝子永久停产WF6,供给短缺主题扩散。 原文 ↗
事件后 +1日 +5.2% · +2日 +12.8% · +3日 +20.8% · +4日 +19.4% · +5日 +14.6%
相似度依据:同为半导体材料国产替代事件,能够提示主题上半程可能延续,但非光刻机设备。 - 相似度 5/10 688268.SH 2026-06-16 日本关东电化/中央硝子永久停产WF6,供给短缺主题扩散。 原文 ↗
事件后 +1日 +1.4% · +2日 +1.9% · +3日 +18.6% · +4日 +34.8% · +5日 +28.6%
相似度依据:同为半导体国产替代主题,但不是光刻机零部件,不能用于精确定价。 - 相似度 5/10 NINOY 2024-10-22 Nikon宣布开发1.0微米分辨率数字光刻系统,计划2026财年发布,用于先进封装大尺寸基板曝光。 原文 ↗
事件后 +1日 +4.9% · +2日 +0.0% · +3日 -3.8% · +4日 +2.4% · +5日 +2.8%
相似度依据:同为光刻相关设备技术发布,但主要面向先进封装数字光刻且计划发布期较远,和DUV整机小批量生产相位较弱。 - 相似度 4/10 INTC 2024-04-18 Intel披露已接收并组装全球首台商业High-NA EUV光刻系统并开始校准。 原文 ↗
事件后 +1日 -2.4% · +2日 -1.8% · +3日 -2.2% · +4日 -1.5% · +5日 +0.2%
相似度依据:同为先进光刻工具到厂兑现,但测的是晶圆厂客户而非设备或零部件供应商,映射关系弱。
工具调用 · 历史记录,结果未知(7 种)
- search_processed_events · 结果未知
- normalize_ticker · 结果未知
- price_snapshot · 结果未知
- kb_search · 结果未知
- query_modeling_kb · 结果未知
- stock_quote · 结果未知
- event_study · 结果未知
原文全文
展开原文 · 5,467 字
The people asked that the company not be identified because of the sensitivity surrounding China’s lithography program. The company brought together immersion DUV development teams from other Chinese companies, including a state-backed chip equipment startup called Shanghai Yuliangsheng Technology, the people said.
If the Chinese-developed DUV machine is successfully put into mass production at Chinese chipmakers, it would replace equipment from Dutch company ASML, which is now the primary supplier of chipmaking equipment in the world.
This development also signals that Washington’s efforts to contain China’s homegrown chip industry by limiting its access to state-of-the-art equipment are not succeeding. Export rules imposed by the U.S. government currently bar Chinese chipmakers from buying ASML’s cutting-edge extreme ultraviolet lithographies, forcing them to depend on ASML’s older immersion DUV tools. But legislation now going through Congress, the bipartisan Match Act, would widen restrictions on immersion DUV equipment and also curb servicing of the tools at some Chinese chip plants,
Both EUV and DUV lithography machines are essential in chipmaking for printing circuit patterns onto silicon wafers. EUV is used primarily to produce the most cutting-edge chips.
In addition to achieving the DUV breakthrough, China is also developing a domestic EUV machine, but the project remains at the prototype stage and is likely years away from producing working chips, according to two separate people familiar with the situation. Reuters first reported in December that China had produced a EUV prototype.
The DUV advances are still at an early stage, however. The Shanghai company plans to manufacture about five DUV machines this year, and roughly 20 in 2027, the two people said. That output is tiny compared with ASML, which shipped 131 immersion DUV systems last year.
The DUV systems are slated for delivery this year to local chipmakers including Semiconductor Manufacturing International, Hua Hong Semiconductor and memory maker ChangXin Memory Technologies, according to the two people. Yuliagsheng, SMIC, Hua Hong and CXMT didn’t respond to requests for comment.
Much still has to be done before the Chinese-made equipment is deemed a success. Moving the Chinese DUV machines onto mass-production lines could take many months or longer as chipmakers test their accuracy, reliability and compatibility with other equipment. Customer feedback should help fix problems and refine the machines, which still trail ASML’s products in performance and build quality, the two people said.
While less complex than EUV, immersion DUV machines have traditionally relied on a global network of specialized suppliers. The Chinese DUV uses mostly domestic components, though some key parts come from Japan, the two people said. Delays from local suppliers have held back production this year, they added.
ASML therefore faces little immediate threat. But rising domestic output could gradually erode its market position in the country, particularly if tighter Western restrictions accelerate Chinese chipmakers’ shift to local equipment.
Meanwhile, the global AI boom is straining chip supply, pushing manufacturers to race to expand capacity—and increasing demand for ASML’s products. SMIC CEO Zhao Haijun said on an earnings call in May that overseas customers were looking to make chips in China because capacity was tight elsewhere. That expansion will require more lithography machines, essential equipment that prints circuit patterns onto silicon wafers.
ASML has recently taken steps to raise prices. Several Chinese customers have agreed to pay about 10% more for some less-advanced DUV product lines, [The Information reported](https://www.theinformation.com/articles/asml-plans-price-increases-chipmaking-equipment-despite-tsmc-resistance). Domestic DUV production could eventually give the Chinese buyers another source of equipment.
The China DUV machines could initially help expand production of mature chips, including power-management components essential to AI servers and data centers. These chips are less sophisticated than AI processors, but shortages can still hold up the construction of entire computing systems.
Immersion DUV can also be pushed to manufacture more-advanced semiconductors by printing some layers repeatedly, a costly and difficult process known as multiple patterning. SMIC has used that approach to produce advanced chips for smartphones and AI systems despite lacking access to EUV equipment.
China made lithography a national priority in 2002, the same year TSMC proposed immersion lithography, which uses water between a machine’s lens and the wafer to print smaller circuits. ASML turned the approach into commercial systems that allowed chipmakers to produce smaller and more powerful chips for years.
The U.S.’s sweeping controls on advanced chipmaking technology in 2022 pushed Beijing to overhaul the DUV research effort, shifting from state-led research toward commercial execution, with Huawei Technologies coordinating industry resources.
This Shanghai company is part of a nationwide, state-backed effort that brings together Chinese companies, research institutes and suppliers to develop domestic lithography machines. The company sent prototypes to some chipmakers last year, the two people said. Encouraging test results paved the way for production to begin this year, they added.
If the Chinese-developed DUV machine is successfully put into mass production at Chinese chipmakers, it would replace equipment from Dutch company ASML, which is now the primary supplier of chipmaking equipment in the world.
This development also signals that Washington’s efforts to contain China’s homegrown chip industry by limiting its access to state-of-the-art equipment are not succeeding. Export rules imposed by the U.S. government currently bar Chinese chipmakers from buying ASML’s cutting-edge extreme ultraviolet lithographies, forcing them to depend on ASML’s older immersion DUV tools. But legislation now going through Congress, the bipartisan Match Act, would widen restrictions on immersion DUV equipment and also curb servicing of the tools at some Chinese chip plants,
Both EUV and DUV lithography machines are essential in chipmaking for printing circuit patterns onto silicon wafers. EUV is used primarily to produce the most cutting-edge chips.
In addition to achieving the DUV breakthrough, China is also developing a domestic EUV machine, but the project remains at the prototype stage and is likely years away from producing working chips, according to two separate people familiar with the situation. Reuters first reported in December that China had produced a EUV prototype.
The DUV advances are still at an early stage, however. The Shanghai company plans to manufacture about five DUV machines this year, and roughly 20 in 2027, the two people said. That output is tiny compared with ASML, which shipped 131 immersion DUV systems last year.
The DUV systems are slated for delivery this year to local chipmakers including Semiconductor Manufacturing International, Hua Hong Semiconductor and memory maker ChangXin Memory Technologies, according to the two people. Yuliagsheng, SMIC, Hua Hong and CXMT didn’t respond to requests for comment.
Much still has to be done before the Chinese-made equipment is deemed a success. Moving the Chinese DUV machines onto mass-production lines could take many months or longer as chipmakers test their accuracy, reliability and compatibility with other equipment. Customer feedback should help fix problems and refine the machines, which still trail ASML’s products in performance and build quality, the two people said.
While less complex than EUV, immersion DUV machines have traditionally relied on a global network of specialized suppliers. The Chinese DUV uses mostly domestic components, though some key parts come from Japan, the two people said. Delays from local suppliers have held back production this year, they added.
ASML therefore faces little immediate threat. But rising domestic output could gradually erode its market position in the country, particularly if tighter Western restrictions accelerate Chinese chipmakers’ shift to local equipment.
Meanwhile, the global AI boom is straining chip supply, pushing manufacturers to race to expand capacity—and increasing demand for ASML’s products. SMIC CEO Zhao Haijun said on an earnings call in May that overseas customers were looking to make chips in China because capacity was tight elsewhere. That expansion will require more lithography machines, essential equipment that prints circuit patterns onto silicon wafers.
ASML has recently taken steps to raise prices. Several Chinese customers have agreed to pay about 10% more for some less-advanced DUV product lines, [The Information reported](https://www.theinformation.com/articles/asml-plans-price-increases-chipmaking-equipment-despite-tsmc-resistance). Domestic DUV production could eventually give the Chinese buyers another source of equipment.
The China DUV machines could initially help expand production of mature chips, including power-management components essential to AI servers and data centers. These chips are less sophisticated than AI processors, but shortages can still hold up the construction of entire computing systems.
Immersion DUV can also be pushed to manufacture more-advanced semiconductors by printing some layers repeatedly, a costly and difficult process known as multiple patterning. SMIC has used that approach to produce advanced chips for smartphones and AI systems despite lacking access to EUV equipment.
China made lithography a national priority in 2002, the same year TSMC proposed immersion lithography, which uses water between a machine’s lens and the wafer to print smaller circuits. ASML turned the approach into commercial systems that allowed chipmakers to produce smaller and more powerful chips for years.
The U.S.’s sweeping controls on advanced chipmaking technology in 2022 pushed Beijing to overhaul the DUV research effort, shifting from state-led research toward commercial execution, with Huawei Technologies coordinating industry resources.
This Shanghai company is part of a nationwide, state-backed effort that brings together Chinese companies, research institutes and suppliers to develop domestic lithography machines. The company sent prototypes to some chipmakers last year, the two people said. Encouraging test results paved the way for production to begin this year, they added.
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