📰 DigiTimesDigiTimesCodex · 实盘不做把握 5/10
北京时间·🕒 发布 10:53:35时区推断·⟳ 抓取 11:02:38回填·⚡ 决策 07-03 11:09:23·116.2 天前
清华芯片专家魏少军旗下3D AI芯片初创公司东方计算核心完成高估值融资并公开亮相
事件核心主体东方计算核心为未上市初创公司，文章披露的是公司官网/公众号公开亮相、融资背景和技术路线，并非上市公司订单、收入确认或可交易股权重估。
📄 原文DigiTimes↗ 原文
Tsinghua chip veteran’s US$1.8bn 3D AI chip startup targets China’s GPU gap
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不做 张江高科（600895.SH）
不做张江高科（600895.SH）：事件只披露其参与初创公司融资链条，未披露持股比例和投资收益，无法证明短期收入、利润或NAV有可交易级增量。
不做 寒武纪（688256.SH）
不做寒武纪（688256.SH）：东方计算核心仍是未上市初创公司公开亮相，未形成对寒武纪订单、份额或定价的明确负面催化，也不适合因国产AI芯片主题反手做多。
不做 英伟达（NVDA.US）
不做英伟达（NVDA.US）：对超大市值公司而言，一个中国未上市AI芯片初创公司的技术路线和融资报道不足以构成市值级收入或利润冲击。
展开详情(成交明细 / 研究档案 / 原文全文 / 决策记录链)
研究档案
🔎 新鲜度:最早出现 2026-07-03 · 扩散 medium · price-in 风险 medium ↗
消息传播链
- 东方计算核心在2026年2月完成A+轮后估值达122.75亿元，融资和估值事实早于本次媒体报道。
- DigiTimes称公司7月1日上线官网和微信公众号，结束此前低调运营状态，这是本次可确认的新公开节点。
- DigiTimes发布英文行业报道，系统梳理东方计算核心技术路线、融资方和魏少军背景，形成对海外供应链读者的扩散。
- 2026-07-03 11:04 中国市场反应外层行情补充非一手A股盘中可交易，但 dossier 给出的相关标的截至前一交易日走势并未证明本事件已带来明确同向重定价；问题在于缺乏上市公司可量化敞口，而非单纯涨跌幅。市场反应:寒武纪（688256.SH）截至2026-07-02近1日-7.6%，张江高科（600895.SH）近1日-5.5%。
关键理由
- 事件核心主体东方计算核心为未上市初创公司，文章披露的是公司官网/公众号公开亮相、融资背景和技术路线，并非上市公司订单、收入确认或可交易股权重估。
- 对寒武纪（688256.SH）和英伟达（NVDA.US）的影响更多是长期国产AI芯片竞争叙事，短期没有明确客户迁移、订单流失或收入替代证据。
- 张江高科（600895.SH）虽被提及为早期投资方/园区相关方，但未披露持股比例、投资成本和可确认公允价值增量，按其收入与资产基数看难以形成可回测的短周期业绩催化。
主要风险
- 若后续东方计算核心披露上市公司持股比例、重大客户订单或被纳入国家级采购/算力平台，张江高科（600895.SH）等相关投资方可能出现主题重估。
- 国产AI芯片主题情绪较强时，未披露量级的初创公司新闻也可能带动张江/国产算力概念短线波动，但这属于主题联动而非确定收益传导。
反向证据
- 做多前查反向 · 来源 kb_search · 日期 2026-04-03 · 影响 weakens
外层KB仅命中张江高科地产结算和科技产业投资扩容类研报，未给出东方计算核心持股比例、投资成本或可确认收益。
检索:张江高科 600895.SH 东方计算核心 持股比例 投资收益 原文 ↗ - 做多前查反向 · 来源 kb_search · 日期 2026-05-05 · 影响 none
外层KB命中寒武纪自身业绩拐点和国产算力龙头研报，但没有显示东方计算核心已对寒武纪订单或份额形成短期冲击。
检索:寒武纪 688256.SH 东方计算核心 3D AI芯片 替代 GPU 订单 原文 ↗ - 做空前查反向 · 来源 kb_search · 日期 2026-05-15 · 影响 none
外层KB有英伟达相关研报和融资文件，但未见东方计算核心对英伟达中国收入形成可量化冲击的证据。
检索:NVDA.US 东方计算核心 中国 GPU gap revenue impact
工具调用 · 历史记录,结果未知(4 种)
- kb_search · 结果未知
- normalize_ticker · 结果未知
- stock_quote · 结果未知
- query_modeling_kb · 结果未知
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Tsinghua chip veteran’s US$1.8bn 3D AI chip startup targets China’s GPU gap
Staff reporter, Taipei
Jul 3, 2026, 10:53 , Updated: Jul 3, 2026, 10:58
0
Credit: Shanghai Orient Computing Core Technology
China's AI chip sector has a heavyweight new entrant: veteran semiconductor figure Shaojun Wei has formally unveiled Shanghai Orient Computing Core Technology Co., a 3D AI compute chip startup now valued at CNY12.2 billion (approx. US$1.8 billion), just two years after it was founded.
Orient Computing Core, which Wei chairs and leads as CEO, launched its official website and WeChat account on July 1, ending months spent operating largely under the radar. The company is being closely watched as China looks beyond GPUs and ASICs for new AI compute architectures that can reduce reliance on foreign advanced chips.
The startup has drawn backing from the National AI Industry Investment Fund, Shanghai state capital, and several major venture investors, while funds linked to Meituan, Xiaomi, JD.com, and DiDi have also invested — underscoring rising interest from China's internet giants in domestic AI inference computing.
3D AI chip path
Founded in May 2024 and headquartered in Shanghai's Zhangjiang technology hub, Orient Computing Core has since established research and development bases in Beijing, Xi'an, and Nanjing, growing its team to more than 500 people.
The company traces its technical roots to the Mobile Computing Research Center at Tsinghua University's School of Integrated Circuits, established in 2006, which gives it nearly two decades of accumulated work in reconfigurable computing and specialised computing architectures.
What sets the company apart is its decision to sidestep a direct race against mainstream GPUs. Orient Computing Core is instead building around software-defined chips and 3D-stacked near-memory computing, arguing that architecture innovation can improve AI computing performance and energy efficiency without relying solely on advanced process nodes.
The company said its software-defined and 3D-stacked near-memory architecture places computing units and memory in a vertical stack to cut data movement costs. Combined with software-hardware co-design, the approach is aimed at improving compute utilisation and building a controllable large-scale AI computing platform without depending on the most advanced overseas processes.
The strategy reflects a broader shift in China's semiconductor sector: using architecture innovation to offset restrictions in advanced manufacturing. As the US expands export controls on advanced AI chips and EDA tools, 3D packaging, near-memory computing, and reconfigurable architectures are emerging as alternative paths for China's high-end AI compute ambitions.
Shaojun Wei brings state project pedigree
Orient Computing Core is drawing attention not only for its technology route, but also for Wei's role at the helm.
Wei, 70, is one of China's most prominent IC design figures. He is a tenured professor at Tsinghua University, vice chairman of the China Semiconductor Industry Association, and chairman of its IC design branch. He previously led microelectronics research under China's 863 Program and served as chief technologist and expert group leader for the national "Core Electronic Devices, High-end General Chips and Basic Software Products" major project, commonly known as He Gao Ji.
Wei also served as president of Datang Telecom and has been involved in China's communications chip sector and IC design policy for years. His move directly into entrepreneurship is therefore seen as a rare case of a state-linked technology veteran leading a commercial semiconductor startup.
That profile has helped give Orient Computing Core a level of policy credibility unusual for a company founded only in 2024. In a race where technology, funding, and state priorities increasingly overlap, Wei's involvement makes the startup a bellwether for the next stage of China's domestic compute architecture.
Funding speed signals AI inference bet
Capital has moved quickly: public information shows Orient Computing Core has completed angel, Series A, and Series A+ rounds in under two years.
Its 2024 angel round brought in Leaguer Capital, Hillhouse Investment, SummitView Capital, Zhangjiang Hi-Tech Park, and the Shanghai Integrated Circuit Industry Investment Fund. The 2025 Series A round then added the National AI Industry Investment Fund and SSCI Leading Fund.
After completing its Series A+ round in February 2026, the company reached a valuation of CNY12.275 billion and plans to launch a Series B round in the fourth quarter.
The participation of Meituan, Xiaomi, JD.com, and DiDi-linked investment platforms points to expectations that Orient Computing Core could play a role in China's AI inference market, where large internet platforms need cheaper, more available, and more controllable computing power.
The company's rise also reflects a new direction in China's AI compute race: in May 2026, Huawei HiSilicon chip chief He Tingbo proposed "Tao Law," or τ Law, arguing that architecture innovation, 3D stacking, and software-hardware co-design could help overcome the slowdown of traditional Moore's Law.
Industry observers say three forces are now pushing China toward a new generation of AI compute chips: restricted access to advanced process technology, surging AI computing demand, and Beijing's drive for domestic substitution. Under this pressure, 3D stacking, near-memory computing, and reconfigurable architecture have become one of the most closely watched battlegrounds in China's AI semiconductor industry.
Article
translated by Levi Li and edited by Jerry Chen
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Exclusive: Chinese automakers pursue overseas production to shape future vehicle standards
Tomorrow's Headlines
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Analysis: China moves against oversized EV batteries amid fiscal and supply-chain concerns
Tomorrow's Headlines
Jul 2, 18:37
Home
Tech
Semiconductors
Tsinghua chip veteran’s US$1.8bn 3D AI chip startup targets China’s GPU gap
Staff reporter, Taipei
Jul 3, 2026, 10:53 , Updated: Jul 3, 2026, 10:58
0
Credit: Shanghai Orient Computing Core Technology
China's AI chip sector has a heavyweight new entrant: veteran semiconductor figure Shaojun Wei has formally unveiled Shanghai Orient Computing Core Technology Co., a 3D AI compute chip startup now valued at CNY12.2 billion (approx. US$1.8 billion), just two years after it was founded.
Orient Computing Core, which Wei chairs and leads as CEO, launched its official website and WeChat account on July 1, ending months spent operating largely under the radar. The company is being closely watched as China looks beyond GPUs and ASICs for new AI compute architectures that can reduce reliance on foreign advanced chips.
The startup has drawn backing from the National AI Industry Investment Fund, Shanghai state capital, and several major venture investors, while funds linked to Meituan, Xiaomi, JD.com, and DiDi have also invested — underscoring rising interest from China's internet giants in domestic AI inference computing.
3D AI chip path
Founded in May 2024 and headquartered in Shanghai's Zhangjiang technology hub, Orient Computing Core has since established research and development bases in Beijing, Xi'an, and Nanjing, growing its team to more than 500 people.
The company traces its technical roots to the Mobile Computing Research Center at Tsinghua University's School of Integrated Circuits, established in 2006, which gives it nearly two decades of accumulated work in reconfigurable computing and specialised computing architectures.
What sets the company apart is its decision to sidestep a direct race against mainstream GPUs. Orient Computing Core is instead building around software-defined chips and 3D-stacked near-memory computing, arguing that architecture innovation can improve AI computing performance and energy efficiency without relying solely on advanced process nodes.
The company said its software-defined and 3D-stacked near-memory architecture places computing units and memory in a vertical stack to cut data movement costs. Combined with software-hardware co-design, the approach is aimed at improving compute utilisation and building a controllable large-scale AI computing platform without depending on the most advanced overseas processes.
The strategy reflects a broader shift in China's semiconductor sector: using architecture innovation to offset restrictions in advanced manufacturing. As the US expands export controls on advanced AI chips and EDA tools, 3D packaging, near-memory computing, and reconfigurable architectures are emerging as alternative paths for China's high-end AI compute ambitions.
Shaojun Wei brings state project pedigree
Orient Computing Core is drawing attention not only for its technology route, but also for Wei's role at the helm.
Wei, 70, is one of China's most prominent IC design figures. He is a tenured professor at Tsinghua University, vice chairman of the China Semiconductor Industry Association, and chairman of its IC design branch. He previously led microelectronics research under China's 863 Program and served as chief technologist and expert group leader for the national "Core Electronic Devices, High-end General Chips and Basic Software Products" major project, commonly known as He Gao Ji.
Wei also served as president of Datang Telecom and has been involved in China's communications chip sector and IC design policy for years. His move directly into entrepreneurship is therefore seen as a rare case of a state-linked technology veteran leading a commercial semiconductor startup.
That profile has helped give Orient Computing Core a level of policy credibility unusual for a company founded only in 2024. In a race where technology, funding, and state priorities increasingly overlap, Wei's involvement makes the startup a bellwether for the next stage of China's domestic compute architecture.
Funding speed signals AI inference bet
Capital has moved quickly: public information shows Orient Computing Core has completed angel, Series A, and Series A+ rounds in under two years.
Its 2024 angel round brought in Leaguer Capital, Hillhouse Investment, SummitView Capital, Zhangjiang Hi-Tech Park, and the Shanghai Integrated Circuit Industry Investment Fund. The 2025 Series A round then added the National AI Industry Investment Fund and SSCI Leading Fund.
After completing its Series A+ round in February 2026, the company reached a valuation of CNY12.275 billion and plans to launch a Series B round in the fourth quarter.
The participation of Meituan, Xiaomi, JD.com, and DiDi-linked investment platforms points to expectations that Orient Computing Core could play a role in China's AI inference market, where large internet platforms need cheaper, more available, and more controllable computing power.
The company's rise also reflects a new direction in China's AI compute race: in May 2026, Huawei HiSilicon chip chief He Tingbo proposed "Tao Law," or τ Law, arguing that architecture innovation, 3D stacking, and software-hardware co-design could help overcome the slowdown of traditional Moore's Law.
Industry observers say three forces are now pushing China toward a new generation of AI compute chips: restricted access to advanced process technology, surging AI computing demand, and Beijing's drive for domestic substitution. Under this pressure, 3D stacking, near-memory computing, and reconfigurable architecture have become one of the most closely watched battlegrounds in China's AI semiconductor industry.
Article
translated by Levi Li and edited by Jerry Chen
AI Search
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SenseTime narrows losses 50% as '1+X' strategy targets profitability
Zhipu AI obtains over US$140 million in latest financing round
Show more
Categories
Chips + components IC design, distribution
Tags
2024 3D AI chip AI inference China IC design Shanghai startup technology
Share this article
Other links
Related topics
Global supply chain: Key components
Global supply chain: China market
Asia
Innovations
Startups and innovations
Regions
BIZ FOCUS
Jun 1, 08:00
LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE
Friday 29 May 2026
Datotek Introduces AI PSSD Sustainable Storage Solutions at COMPUTEX 2026
Thursday 28 May 2026
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Thursday 28 May 2026
Retronix Launches Sparrow Hawk Edge AI Computing Platform Worldwide
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