英伟达GTC柏林官宣与六家供应商扩产基板/先进封装/测试/CPO光引擎，DigiTimes为滞后转述无新增事实

Nvidia said on October 21 that it is working with six supply chain partners to expand manufacturing capacity for substrates, advanced packaging, testing, and optical engines to meet growing demand for its accelerated computing and AI factory platforms.

The plans, announced at GTC Berlin, involve Amkor Technology, IBIDEN, King Yuan Electronics (KYEC), Samsung Electro-Mechanics, Siliconware Precision Industries (SPIL), and Unimicron Technology. Nvidia said the agreements enable both new and existing suppliers to expand and are meant to strengthen the resiliency and redundancy of its global supply chain.
"We are in the midst of the largest infrastructure buildout in human history. Demand is extraordinary. Capacity is the constraint," said Jensen Huang, founder and CEO of Nvidia.
Substrate capacity to rise 2.5x in three years
Nvidia plans to increase substrate capacity for its products by 2.5x over the next three years, with further agreements underway beyond those announced.
Under an agreement IBIDEN announced earlier this year, Nvidia is providing a multibillion-dollar capacity reservation advance to support IBIDEN's Ono Plant in Japan, where capacity is targeted to reach three times current levels. The additional capacity is expected to begin ramping in the first quarter of 2028.
Samsung Electro-Mechanics is joining Nvidia's substrate supply chain, bringing immediate capacity from its existing operations in South Korea. The collaboration also supports facility upgrades and new factories in Sejong and Busan. By 2028, production allocated to Nvidia is projected to account for a significant portion of Samsung Electro-Mechanics' total annual package substrate capacity.
In Taiwan, Nvidia is backing Unimicron's KF substrate expansion with a capacity reservation agreement. The expansion is expected to begin adding capacity in the second quarter of 2027 and reach full capacity by mid-2028.
Packaging and testing capacity to scale across Asia and the US
Nvidia and Amkor plan to expand advanced packaging capacity in South Korea, targeting an increase of more than 300% in interposer wafer capacity by the end of 2028. Together with Amkor's development of new manufacturing facilities in the country, the expansion will support higher volumes of Nvidia's current and next-generation platforms.
Nvidia expects its total semiconductor testing capacity to double from calendar 2026 to calendar 2027, supported by buildouts in the US, Taiwan, and Singapore. A US$1.1 billion capacity reservation advance to KYEC will support new US testing facilities and equipment, with high-volume production targeted for April 2027. In Singapore, expanded testing operations are expected to begin high-volume production in February 2027.
Optical engine capacity to grow 15-fold by mid-2027
Nvidia and SPIL plan to expand manufacturing capacity in Taiwan for the optical engines used in co-packaged optics, which Nvidia said will support the growing connectivity requirements of large-scale computing infrastructure. The expansion targets a 15-fold increase by mid-2027, with the aim of doubling capacity again by the end of 2028.