📰 DigiTimesDigiTimesCodex · 实盘不做把握 5/10
北京时间·🕒 发布 06-29 07:51:51时区推断·⟳ 抓取 06-29 08:00:57回填·⚡ 决策 07-05 18:41:57·113.9 天前
DigiTimes称力积电与爱普科技加入Intel、SoftBank的后HBM/ZAM九层3D DRAM研发阵营
事件核心是后HBM/ZAM早期研发与演示，官方路线仍指向FY2027原型、FY2029商业化，不是短周期订单或收入催化。
📄 原文DigiTimes↗ 原文
Taiwan joins post-HBM memory race with Intel, SoftBank
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不做 爱普科技（6531.TW）
虽然被DigiTimes直接点名，但公开证据只支持研发演示叙事，缺少订单、量产、商业化收入或利润分成，无法形成短周期正期望交易。
不做 力积电（6770.TW）
事件是早期后HBM研发演示，力积电可能只是试产/制造参与方，缺少可量化短期收入和利润增量。
不做 Intel（INTC.US）
Intel-SoftBank合作已是2月旧闻，本次台湾生态参与不构成Intel市值级新增收入或利润催化。
展开详情(成交明细 / 研究档案 / 原文全文 / 决策记录链)
研究档案
消息传播链
- SAIMEMORY与Intel官宣合作开发ZAM，目标FY2027做出原型、FY2029商业化，说明该主线不是6月首次出现。
- HPCwire已报道ZAM的九层堆叠、VLSI论文与NEDO支持，技术叙事在6月前已有扩散。
- DigiTimes称力积电与爱普科技出现在Intel、SAIMEMORY九层3D高带宽DRAM演示中，但全文付费且未公开订单或量产金额。市场反应:6531.TW在6月29日至7月3日累计约小幅回落，6770.TW同期也未出现持续同向重定价。
关键理由
- 事件核心是后HBM/ZAM早期研发与演示，官方路线仍指向FY2027原型、FY2029商业化，不是短周期订单或收入催化。
- DigiTimes新增点名台湾生态中的力积电与爱普科技，但未披露订单、量产客户、采购金额或利润分成，难以形成可回测的业绩增量。
- 量级句：现有ZAM项目处于研发/原型前阶段，当前可确认新增收入≈0；即便未来商业化，时间点在2029附近，无法对应6531.TW或6770.TW未来数日到数周收入/利润占比。
主要风险
- 爱普科技和力积电属于直接点名的小盘/高波动台湾标的，后续若公司公告量产合作、客户导入或补助金额，可能重新变成可交易催化。
- 事件已距DigiTimes发布时间约6天，且Intel-SoftBank ZAM合作在2026-02-03已官宣，当前边际新鲜度不足。
反向证据
- 做多前查反向 · 来源 kb_search · 影响 weakens
内部库未找到量产订单、收入占比或客户导入证据，命中更多是ZAM旧叙事与相关存储行业材料。
检索:PSMC AP Memory ZAM SAIMEMORY Intel 3D DRAM pilot production revenue exposure - 做多前查反向 · 来源 query_modeling_kb · 影响 weakens
定量库显示HBM仍由SK海力士、三星、美光等主导且AI HBM约束明确，但未能把ZAM台湾参与方转化为短期收入数字。
检索:post-HBM memory Intel SoftBank PSMC AP Memory SAIMEMORY 3D DRAM HBM - 做多前查反向 · 来源 web · 日期 2026-02-03 · 影响 weakens
官方原始合作已在2月发布，本次6月底报道边际增量偏小且商业化时间远。
检索:SoftBank SAIMEMORY Intel next-generation memory technology February 2026 原文 ↗
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Taiwan joins post-HBM memory race with Intel, SoftBank
Sherri Wang
, DIGITIMES, Taipei
Jun 29, 2026, 07:51
0
Credit: AFP
Taiwan's semiconductor ecosystem has entered the race to develop a possible post-HBM memory architecture, with Powerchip Semiconductor Manufacturing Corp. (PSMC) and AP Memory appearing alongside Intel and SoftBank subsidiary SAIMEMORY in a nine-layer 3D...
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繁體
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SUBSCRIBE
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Trending HBM
South Korea
AI Search
NTN Convergence
Inference Era AI
Advanced Packaging
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SUBSCRIBE
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Home
Tech
Semiconductors
Taiwan joins post-HBM memory race with Intel, SoftBank
Sherri Wang
, DIGITIMES, Taipei
Jun 29, 2026, 07:51
0
Credit: AFP
Taiwan's semiconductor ecosystem has entered the race to develop a possible post-HBM memory architecture, with Powerchip Semiconductor Manufacturing Corp. (PSMC) and AP Memory appearing alongside Intel and SoftBank subsidiary SAIMEMORY in a nine-layer 3D...
The article requires paid subscription.
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Leverage AI summaries for instant insights.
Receive tech briefings & newsletters.
Track financials & stock data of Taiwan tech.
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Share this article
BIZ FOCUS
Jun 1, 08:00
LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE
Friday 29 May 2026
Datotek Introduces AI PSSD Sustainable Storage Solutions at COMPUTEX 2026
Thursday 28 May 2026
Retronix Launches Sparrow Hawk Edge AI Computing Platform Worldwide
Thursday 28 May 2026
AGI Debuts DDR5 R-DIMM and Smart Industrial Solutions at COMPUTEX 2026
MOST-READ
7 DAYS NEWS
TSMC 3nm lead times surpass one year as Samsung faces Intel in foundry push
Samsung Foundry turns to 5nm, 8nm orders as 2nm comeback takes shape
Kioxia sees Apple fuel NAND memory supercycle, sets sights on US market
Intel deepens ties with Taiwan's chip supply chain as October talks expand
MediaTek issues official price hike notice, products facing supply constraints likely to increase first
Rakuten, AST SpaceMobile JV aims to break Starlink's grip on Japan's satellite market
LG Chem weighs CCL expansion as AI chip demand strains supply
Kaori fuel cell orders extend to 1 year; expanding capacity in Taiwan and overseas
Apple's first foldable iPhone reportedly on track for September 2026 launch
2nm advanced process waste surges 13x, Techzone targets semiconductor ESG waste treatment market
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