DigiTimes 转述 BOS半导体与 LG电子、Hana Micron 的车规 Chiplet 合作 MOU，系 10月20日已报道旧闻且无新增事实

BOS Semiconductors is partnering with LG Electronics and HANA Micron to develop and commercialize chiplet-based automotive semiconductors in South Korea, connecting domestic AI chip design with packaging and vehicle testing. ChosunBiz and ZDNet Korea reported the collaboration on October 20.

Dividing the work
BOS will develop neural processing unit chiplets for autonomous driving and onboard AI. LG will supply the base chiplet for core vehicle functions, while HANA Micron will handle multi-chiplet packaging and performance validation.
According to the company announcement carried by Design & Reuse , the partners signed a memorandum of understanding on September 30 alongside four automotive and industrial technology organizations. The agreement falls under the trade ministry's M.AX Alliance and covers development, integration, testing, and commercialization.
The announcement does not specify a production start date, customer orders, or investment commitments.
Modular by design
Chiplets split computing functions among smaller pieces of silicon connected within a package, allowing components to be combined and reused. Research institute imec says this approach can help manufacturers adapt computing platforms across vehicle models and generations, rather than redesigning a large, integrated chip for each application.
BOS says it is developing a modular automotive platform around its Eagle-A system-on-chip and Eagle-N AI accelerator. Its announcement also notes its participation in the UCIe interconnect consortium and the Open chiplet Atlas ecosystem, as well as a chiplet research and prototyping relationship with Japan's MIRISE Technologies.
In separate commentary published by imec, Bart Placklé, its vice president of automotive technologies, describes chiplets as specialized building blocks that can be combined into computing platforms tailored to future vehicles. His comments address the broader technology rather than the Korean partnership.
Reliability and standards in focus
Imec cautions that automotive applications impose stricter quality and reliability demands than many existing chiplet markets. Its research program examines how interconnects withstand temperature cycling and vibration, using physical test structures to assess reliability under demanding conditions.
The institute also identifies standardized interfaces and shared architecture specifications as essential to making separately developed chiplets work together. LG is among the participants listed in imec's chiplet research program, alongside automotive and semiconductor companies, including BMW, Bosch, and Arm.
Commercialization remains an objective of the Korean agreement, but the announcement does not disclose a delivery timetable.