DigiTimes转述京东方玻璃基封装载板进展：24层样品送样验证，实为9月已披露信息的再传播

Chinese display manufacturer BOE has made further progress in advanced semiconductor packaging, extending its panel manufacturing expertise to glass-core packaging substrates. At an investor relations event on October 15, BOE said it had completed the full manufacturing process for glass-core substrates, producing 24-layer samples measuring more than 100 × 100mm. The samples have been delivered to customers and passed multiple reliability tests, with further validation underway.

BOE said it had mastered key processes including high-aspect-ratio through-glass via (TGV) fabrication, deep-hole copper filling, low-stress metal interconnects, multilayer lamination, high-density routing, and low-stress cutting. Its 24-layer (11-2-11) substrates have passed preconditioning (Pre-con), 1,000 thermocompression bonding (TCB) cycles, and reliability tests including UHAST, BHAST, high-temperature storage life (HTSL), and low-temperature storage life (LTSL).
According to Chinese media outlets IT Home and Cailian Press , BOE has completed automated equipment integration at its glass-core substrate pilot line and is advancing from process development towards chip packaging and application-level validation. A critical step involves integrating the substrates with CPUs and GPUs, followed by electrical performance testing in operating servers.
Glass substrates are considered a potential material for advanced AI chip and high-performance computing (HPC) packaging because of their superior flatness and dimensional stability. However, commercial production still requires customer qualification and solutions to challenges involving TGV fabrication, copper filling, material stress, and manufacturing yields. BOE remains at the pilot-line and sampling stage, with customer adoption and mass-production readiness yet to be established.
Beyond semiconductor packaging, BOE continues to increase capacity and improve yields at its Gen 8.6 AMOLED production line while developing perovskite solar technologies. Its research covers rigid, flexible, and tandem solar modules, with conversion efficiencies of 27.94% for small-area cells on its glovebox research platform, 21.39% on laboratory production lines, and 20.11% on pilot lines. Flexible modules have achieved 16.6% efficiency.
BOE expects overall depreciation expenses and capital expenditure to decline gradually from 2025 levels, reflecting reduced depreciation from existing production lines and lower investment requirements as the display industry matures.