Hanmi Semiconductor 在硅谷设立美国子公司 Hanmi USA 强化本地先进封装设备支持

Hanmi Semiconductor has established a US subsidiary in Silicon Valley as it seeks to capitalize on growing demand for advanced semiconductor packaging equipment driven by the expansion of AI chip production in the country.

According to ChosunBiz , Hanmi USA officially opened its San Jose office on October 16, 2026, and will serve as the company's integrated US operations hub. The company plans to deploy experienced engineers locally according to the ramp-up schedules of new semiconductor facilities, providing customers with technical support, equipment operation, and maintenance services.
ZDNet Korea reported that Hanmi USA will support semiconductor companies and big-tech customers in the US, making it Hanmi Semiconductor's fourth overseas subsidiary after operations in Taiwan, China, and Singapore. The US expansion comes 46 years after Hanmi Semiconductor was founded in South Korea.
The move reflects rising investment in US semiconductor manufacturing and advanced packaging. Intel has begun 18A process and advanced packaging production in Arizona, while Micron is building new dynamic random access memory (DRAM) and high-bandwidth memory (HBM) facilities in Idaho and New York. SK Hynix is constructing an HBM packaging plant in Indiana, while Amkor Technology is developing a large advanced packaging facility in Arizona.
Hanmi Semiconductor's key products include thermocompression (TC) bonders for HBM manufacturing, as well as Micro Saw & Vision Placement equipment for chip dicing, inspection, and placement. The company also supplies 2.5D TC and flip-chip bonders to foundries and outsourced semiconductor assembly and test (OSAT) providers.
Hanmi chairman Dong-shin Kwak said the US is a key market for the global AI industry and advanced semiconductor technologies, adding that the new subsidiary will strengthen technical support for local customers and collaboration with global semiconductor companies.