📰 DigiTimesDigiTimesDoubao · 实盘不做把握 8/10不做原因:无增量信息
北京时间·🕒 发布 09-11 16:41:32·⟳ 抓取 09-11 17:02:34 +21m02s·⚡ 决策 09-15 13:06:22 +3d20h·42.6 天前
DigiTimes 综述 KPCA Show 2026：三星电机与 LG Innotek 展示 AI 封装基板技术，无新增订单或财务增量
这是一篇展会技术综述：三星电机与 LG Innotek 的参展内容在 9 月 9–10 日已由公司 IR 新闻稿及十余家韩媒首发扩散，DigiTimes 9 月 11 日报道无订单、定点、金额或指引等新增事实；玻璃基板仅送样、LG ABF 2027 才量产，均不构成已验证需求。距事件已约 92 小时（韩股已交易数日），预期差与时效均不支持短线开仓。
📄 原文DigiTimes↗ 原文
Samsung Electro-Mechanics, LG Innotek vie in AI package substrates
中文網 繁體 简体 SUBSCRIBE My account Sign out SUBSCRIBE Trending Apple Huawei Nvidia AI Search Scaling AI Glasses Inference E…
不做 三星电机（009150.KS）
KPCA 技术展示内容公司 IR 与韩媒 9 月 9–10 日已充分披露，DigiTimes 综述无订单/金额/指引增量；玻璃基板仅送样、2.1D 无量产时间表，事件已过去约 92 小时，无预期差与时效 edge
不做 LG Innotek（011070.KS）
100mm AI ABF 基板为首展、2027 年才量产且仍在客户测试，属能力展示而非需求验证；消息 9 月 9 日已高扩散，无新增事实，短线不做
展开详情(成交明细 / 研究档案 / 原文全文 / 决策记录链)
研究档案
结论摘要
KPCA 2026 展会技术展示，证明三星电机与 LG Innotek 在大尺寸 ABF/2.1D/玻璃基板的供给能力，但客户采用、定点与量产订单均未落地；信息已于 9 月 9–10 日官方与韩媒充分传播，DigiTimes 综述无增量且已过 4 天，不做。
消息传播链
- KPCA 开幕日上午即报道三星电机与 LG Innotek 同台展示 AI 封装基板技术及各自路线，时间早于 DigiTimes 两天
- 当天韩媒广泛报道 LG Innotek 100mm FC-BGA 首展、2027 量产目标，信息已高扩散
- 公司官方发布 KPCA Show 2026 展出 2.5D、2.1D、玻璃基板等五类产品的新闻稿，确认 DigiTimes 所述内容均来自公开展会与官方口径
- 滞后约两天的英文展会综述，无新增订单、客户或财务事实；研判时距该文已约 92 小时
关键理由
- 技术展示仅证明供给能力，客户点名、设计定点、绑定采购或收入里程碑等需求验证全部缺失（玻璃基板送样阶段、ABF 2027 量产）
- 首发为 9 月 9–10 日公司新闻稿与韩媒，DigiTimes 9 月 11 日为二手综述，9 月 15 日研判时已过去约 92 小时，无新鲜度与预期差
主要风险
- 若后续出现台积电等客户对玻璃基板的正式定点或订单，将构成新增利好，需另行研判，本结论不覆盖该后续事件
- 封装基板供给紧张的定性表态若伴随后续涨价/长协披露，可能重新定价板块
反向证据
- 做多前查反向 · 来源 web · 日期 2026-09-15 · 影响 invalidates
未发现与本展会相关的新订单、客户定点或财务上修；相关延伸报道（住友化学合资、台积电 CoPoS 合作）均为此前已存在的独立事件
检索:Samsung Electro-Mechanics LG Innotek substrate order win customer designation September 2026 原文 ↗
先例如何影响了这次决策
方向:无可用于定价的高相似先例；展会技术展示类事件本身不具备明确的事件后收益锚
涨幅量级:未做幅度校准：本条无订单/金额且为旧闻扩散，不进入交易，先例幅度不影响结论
形态:未发现需要据此交易的见光死模式；回避基于信息增量与时效而非价格模式
工具执行结果 · 成功 2 · 降级 0 · 失败 0 · 取消 0
- search_processed_events 成功 stock_tools HTTP · 55 ms
{"result": "search_processed_events:agent query=`lg innotek abf substrate ai accelerator mass production 2027 | samsung electro-mechanics glass substrate samples tsmc reliability testing | samsung electro-mechanics lg innotek kpc`；结构化索引覆盖完整 72 小时；旧记录兼容扫描近 0.0/72 小时、0 条本臂决策(完整)，返回 0 条候选。未命中只表示这些 agen - web_search 成功 doubao_search · 1,597 ms
豆包搜索结果（原始查询:Samsung Electro-Mechanics LG Innotek KPCA 2026 AI package substrate glass 2.1D order；API SearchType:web）
原文全文
展开原文 · 7,090 字
中文網
繁體
简体
SUBSCRIBE
My account
Sign out
SUBSCRIBE
Trending Apple
Huawei
Nvidia
AI Search
Scaling AI Glasses
Inference Era AI
Advanced Packaging
Trending
SUBSCRIBE
CONNECT WITH US
Sign out
REALTIME NEWS
Corning sees CPO and glass core as new semiconductor battlegrounds
Tomorrow's Headlines
Sep 14, 18:47
China optical transceivers avoid US FCC curbs as NPO and CPO compete in high-speed links
Tomorrow's Headlines
Sep 14, 18:46
China's AIDC token costs hinge on access to advanced GPUs
Tomorrow's Headlines
Sep 14, 18:46
Home
Regions
Samsung Electro-Mechanics, LG Innotek vie in AI package substrates
Daniel Chiang, Incheon
Sep 11, 2026, 16:41
0
Credit: DIGITIMES
At South Korea's recent KPCA Show 2026, Samsung Electro-Mechanics and LG Innotek showcased their next-generation package substrate technologies. As AI semiconductors evolve toward higher performance, increased density, and larger footprints, both companies are competing for dominance in this high-value-added advanced packaging market.
Bigger substrates, bigger engineering headaches
The KPCA Show 2026 attracted over 350 domestic and international exhibitors, with AI-driven demand for high-density packaging taking center stage. As package substrates require finer routing and higher interconnect density, their physical dimensions are expanding in tandem. As a result, managing warpage, maintaining dimensional stability, and optimizing manufacturing yields in large-area substrates have become critical points of differentiation.
Samsung bets on a broad substrate portfolio
Samsung Electro-Mechanics showcased a broad portfolio, including 2.5D and 2.1D package substrates, glass substrates, automotive ABF substrates, and ultra-thin chip-scale packaging (UTCSP). Its 2.5D offerings prioritize warpage control across large-area, high-layer-count substrates while preserving high-speed signal integrity and interconnect density.
The company's 2.1D architecture eliminates the silicon interposer required in 2.5D setups, connecting chips directly. This design thins the overall package, shortens signal transmission paths, and offers clear cost-reduction potential. Samsung Electro-Mechanics is currently developing 2.1D solutions using both bridge embedding and redistribution layer (RDL) methods, though it has not yet disclosed a mass-production timeline.
Glass substrates emerge as the next frontier
Glass substrates also featured prominently as a pivotal next-generation technology. Samsung Electro-Mechanics highlighted precision surface processing and through-glass via (TGV) techniques that create ultrafine interconnect channels filled with metal.
Compared to traditional organic materials, glass offers superior flatness and thermal stability, mitigating warpage and thermal deformation in large-format, high-density packages. This positions glass as a critical material for the next phase of AI server deployment and advanced packaging.
Samsung Electro-Mechanics has already supplied glass substrate samples to customers for reliability testing. Its commercial strategy extends beyond the internal Samsung ecosystem, actively courting major external foundries including TSMC.
LG Innotek debuts AI-focused ABF substrates
Meanwhile, LG Innotek unveiled its ABF substrates for AI accelerators for the first time. Featuring single-side dimensions exceeding 100mm, these large-format substrates incorporate ultrafine pitch routing and high-layer-count architectures optimized for AI training and inference. Targeted for mass production in 2027, the product is currently undergoing customer testing and evaluation.
Engineers note that as substrate surface areas expand, thermal shrinkage disparities across material layers accumulate more aggressively during thermal processing, leading to structural deformation—one of the primary engineering bottlenecks in development.
To demonstrate its large-area manufacturing capabilities, LG Innotek also displayed an 85mm x 85mm ABF substrate alongside an oversized variant offering roughly 40% more surface area. The company also highlighted its chip embedding technology, which places components inside the substrate to reduce interconnect distances and maximize layout density within space-constrained designs.
Copper-post technology shrinks the footprint
Additionally, LG Innotek showcased its proprietary copper post (Cu-Post) interconnect technology. By replacing traditional direct solder-ball connections with micro-scale copper pillars paired with smaller solder balls, Cu-Post reduces pitch distances, increases wiring density, and improves thermal dissipation during peak operation.
An LG Innotek representative noted that under identical performance requirements, Cu-Post technology enables up to a 20% reduction in total substrate area.
Supply stays tight as demand outlook holds firm
Addressing the broader market outlook, a Samsung Electro-Mechanics official stated that both its MLCC and package substrate divisions are operating under severe supply constraints. Future substrate capacity is nearly fully committed under long-term contracts, with demand expected to remain robust for at least the next three years.
Article
translated by Yunnie Cheng and edited by Jerry Chen
AI Search
Related stories
Samsung Electro-Mechanics, Sumitomo Chemical to form glass-core venture for chip substrates
TSMC reportedly teams with Ibiden, Innolux to push CoPoS, glass substrates
LG Innotek targets Intel EMIB substrate chain with SK Hynix samples
Tesla AI5 ignites Samsung-LG race for ABF substrates, robot parts
Samsung Electro-Mechanics to supply glass substrate samples to US firms, Korean giants target TSMC's packaging lead
Show more
Tags
2026 LG Innotek market performance Semco South Korea substrate technology
Share this article
Other links
Print
BIZ FOCUS
Sep 14, 08:00
Hauman Unveils Micro LED Testing Breakthrough for AI Optical Interconnects
Monday 14 September 2026
Scaling Photonics: Assembly, Test and Fiber Automation at SEMICON Taiwan
Friday 11 September 2026
DAS Expands in Taiwan and Unveils World First at SEMICON
Friday 11 September 2026
Toward Technologies Redefines Relay Solutions at SEMICON Taiwan 2026
MOST-READ
7 DAYS NEWS
Google's v10 TPU opens door to AMD without sidelining Broadcom, MediaTek
Update: ABF substrate maker Unimicron searched in origin-labeling probe
Qualcomm's HBC play pulls Samsung and SK hynix into a new race beyond HBM
SK keyfoundry expands 8-inch capacity as China demand strains supply
Samsung, SK Hynix step up China NAND upgrades as US tool risks grow
Column: When digital trust breaks — quantum risk rewrites supply chain resilience
Wuliangye skips carmaking, turns liquor waste into silicon-carbon anodes
The 1,000-watt problem: a TSMC veteran on the brute force forging Nvidia's AI chips
eCloudvalley expands enterprise AI Agent portfolio
CXMT rides AI boom to 80% operating margin
Full list
Members only
×
Sorry, the page you are trying to open is available only for our paid subscribers.
Please login to read more
New users, please register first
Notification
×
繁體
简体
SUBSCRIBE
My account
Sign out
SUBSCRIBE
Trending Apple
Huawei
Nvidia
AI Search
Scaling AI Glasses
Inference Era AI
Advanced Packaging
Trending
SUBSCRIBE
CONNECT WITH US
Sign out
REALTIME NEWS
Corning sees CPO and glass core as new semiconductor battlegrounds
Tomorrow's Headlines
Sep 14, 18:47
China optical transceivers avoid US FCC curbs as NPO and CPO compete in high-speed links
Tomorrow's Headlines
Sep 14, 18:46
China's AIDC token costs hinge on access to advanced GPUs
Tomorrow's Headlines
Sep 14, 18:46
Home
Regions
Samsung Electro-Mechanics, LG Innotek vie in AI package substrates
Daniel Chiang, Incheon
Sep 11, 2026, 16:41
0
Credit: DIGITIMES
At South Korea's recent KPCA Show 2026, Samsung Electro-Mechanics and LG Innotek showcased their next-generation package substrate technologies. As AI semiconductors evolve toward higher performance, increased density, and larger footprints, both companies are competing for dominance in this high-value-added advanced packaging market.
Bigger substrates, bigger engineering headaches
The KPCA Show 2026 attracted over 350 domestic and international exhibitors, with AI-driven demand for high-density packaging taking center stage. As package substrates require finer routing and higher interconnect density, their physical dimensions are expanding in tandem. As a result, managing warpage, maintaining dimensional stability, and optimizing manufacturing yields in large-area substrates have become critical points of differentiation.
Samsung bets on a broad substrate portfolio
Samsung Electro-Mechanics showcased a broad portfolio, including 2.5D and 2.1D package substrates, glass substrates, automotive ABF substrates, and ultra-thin chip-scale packaging (UTCSP). Its 2.5D offerings prioritize warpage control across large-area, high-layer-count substrates while preserving high-speed signal integrity and interconnect density.
The company's 2.1D architecture eliminates the silicon interposer required in 2.5D setups, connecting chips directly. This design thins the overall package, shortens signal transmission paths, and offers clear cost-reduction potential. Samsung Electro-Mechanics is currently developing 2.1D solutions using both bridge embedding and redistribution layer (RDL) methods, though it has not yet disclosed a mass-production timeline.
Glass substrates emerge as the next frontier
Glass substrates also featured prominently as a pivotal next-generation technology. Samsung Electro-Mechanics highlighted precision surface processing and through-glass via (TGV) techniques that create ultrafine interconnect channels filled with metal.
Compared to traditional organic materials, glass offers superior flatness and thermal stability, mitigating warpage and thermal deformation in large-format, high-density packages. This positions glass as a critical material for the next phase of AI server deployment and advanced packaging.
Samsung Electro-Mechanics has already supplied glass substrate samples to customers for reliability testing. Its commercial strategy extends beyond the internal Samsung ecosystem, actively courting major external foundries including TSMC.
LG Innotek debuts AI-focused ABF substrates
Meanwhile, LG Innotek unveiled its ABF substrates for AI accelerators for the first time. Featuring single-side dimensions exceeding 100mm, these large-format substrates incorporate ultrafine pitch routing and high-layer-count architectures optimized for AI training and inference. Targeted for mass production in 2027, the product is currently undergoing customer testing and evaluation.
Engineers note that as substrate surface areas expand, thermal shrinkage disparities across material layers accumulate more aggressively during thermal processing, leading to structural deformation—one of the primary engineering bottlenecks in development.
To demonstrate its large-area manufacturing capabilities, LG Innotek also displayed an 85mm x 85mm ABF substrate alongside an oversized variant offering roughly 40% more surface area. The company also highlighted its chip embedding technology, which places components inside the substrate to reduce interconnect distances and maximize layout density within space-constrained designs.
Copper-post technology shrinks the footprint
Additionally, LG Innotek showcased its proprietary copper post (Cu-Post) interconnect technology. By replacing traditional direct solder-ball connections with micro-scale copper pillars paired with smaller solder balls, Cu-Post reduces pitch distances, increases wiring density, and improves thermal dissipation during peak operation.
An LG Innotek representative noted that under identical performance requirements, Cu-Post technology enables up to a 20% reduction in total substrate area.
Supply stays tight as demand outlook holds firm
Addressing the broader market outlook, a Samsung Electro-Mechanics official stated that both its MLCC and package substrate divisions are operating under severe supply constraints. Future substrate capacity is nearly fully committed under long-term contracts, with demand expected to remain robust for at least the next three years.
Article
translated by Yunnie Cheng and edited by Jerry Chen
AI Search
Related stories
Samsung Electro-Mechanics, Sumitomo Chemical to form glass-core venture for chip substrates
TSMC reportedly teams with Ibiden, Innolux to push CoPoS, glass substrates
LG Innotek targets Intel EMIB substrate chain with SK Hynix samples
Tesla AI5 ignites Samsung-LG race for ABF substrates, robot parts
Samsung Electro-Mechanics to supply glass substrate samples to US firms, Korean giants target TSMC's packaging lead
Show more
Tags
2026 LG Innotek market performance Semco South Korea substrate technology
Share this article
Other links
BIZ FOCUS
Sep 14, 08:00
Hauman Unveils Micro LED Testing Breakthrough for AI Optical Interconnects
Monday 14 September 2026
Scaling Photonics: Assembly, Test and Fiber Automation at SEMICON Taiwan
Friday 11 September 2026
DAS Expands in Taiwan and Unveils World First at SEMICON
Friday 11 September 2026
Toward Technologies Redefines Relay Solutions at SEMICON Taiwan 2026
MOST-READ
7 DAYS NEWS
Google's v10 TPU opens door to AMD without sidelining Broadcom, MediaTek
Update: ABF substrate maker Unimicron searched in origin-labeling probe
Qualcomm's HBC play pulls Samsung and SK hynix into a new race beyond HBM
SK keyfoundry expands 8-inch capacity as China demand strains supply
Samsung, SK Hynix step up China NAND upgrades as US tool risks grow
Column: When digital trust breaks — quantum risk rewrites supply chain resilience
Wuliangye skips carmaking, turns liquor waste into silicon-carbon anodes
The 1,000-watt problem: a TSMC veteran on the brute force forging Nvidia's AI chips
eCloudvalley expands enterprise AI Agent portfolio
CXMT rides AI boom to 80% operating margin
Full list
Members only
×
Sorry, the page you are trying to open is available only for our paid subscribers.
Please login to read more
New users, please register first
Notification
×
决策记录链 · 只追加
每次领取产生一条记录,重新决策追加一条并以 supersedes 指向被替代的记录(ADR 0014)。
这条决策早于决策账本(2026-10-08 起逐条追加),没有追加记录。