朋傑子公司業信科技10月23日登錄興櫃，8kW TVS打入國際AI伺服器供應鏈、6吋晶圓產能佔比擬由35%升至50%以上

AI servers are driving demand for power components, transient voltage suppressors (TVS), and electrostatic discharge (ESD) protection devices. Yea Shin Technology, a subsidiary of Eris Technology, will begin trading on Taiwan's emerging stock market on October 23 and plans to raise the share of 6-inch wafers in its capacity from 35% to more than 50%, as its TVS products enter the international AI server supply chain.

Yea Shin has upgraded its TVS products from 5kW to 8kW through chip design and stacking technologies, successfully entering the international AI server supply chain. Orders from automotive and energy storage customers, as well as US smartphone brands, are also supporting growth.
Order shifts and edge AI
Following the Dutch government's intervention in Nexperia in 2025, which triggered supply risks, the European Commission has more recently placed Chinese chipmaker Yangjie Electronic Technology on its sanctions list. Eris Chairman Jonathan Chang said that, in addition to order transfers driven by geopolitics, demand for power and protection components is receiving support from AI power management, automotive, energy storage, and industrial control applications.
Chang said the emergence of edge AI will generate even greater business opportunities in the future.
An upstream role in the group
Yea Shin General Manager Huang Chung-yung said that under the group's integrated device manufacturing (IDM) model, Yea Shin focuses on upstream wafer development and manufacturing, while Eris handles back-end packaging and testing.
He said Yea Shin's revenue growth does not depend entirely on orders from Eris or Diodes. After its listing, the company will continue expanding capacity, product technology, and services.
Huang said industrial-control customers have asked Yea Shin to provide standalone financial statements so they can secure capacity and maintain stable supplies when the supply chain tightens, while also enabling long-term cooperation. Automotive applications currently account for 40% of revenue, followed by industrial control at 30% and consumer products at 30%.
A larger 6-inch wafer share
Eris General Manager Chu Hung-chun said that, to meet demand for high-power, automotive, and AI protection components, the company has reserved and expanded equipment to address production bottlenecks in wafer manufacturing, including diffusion furnace tubes.
The company is gradually shifting and upgrading capacity from 4-inch to 6-inch wafers. Six-inch wafers currently account for 35% of capacity, with the company targeting more than 50%. Because the slicing area of a 6-inch wafer is 2.25 times that of a 4-inch wafer, the transition can substantially reduce unit production costs and improve gross margins.
Early orders amid rising costs
Prices for upstream, midstream, and downstream semiconductor materials are rising, with precious metals such as gold, silver, and copper climbing sharply, while wafer capacity has also tightened. Huang said the lead time for some raw materials has lengthened from two months to four or five months.
In addition to placing orders early to lock in prices and secure raw materials, the company can use the Diodes group to flexibly allocate global capacity and resources. Orders have already extended beyond the second quarter of 2027.