DigiTimes 综述 2026 台湾产业周数据中心专区：双鸿、华乐士、东元展示液冷与机电产品，无新增订单或财务信息

As AI server computing density and server rack power consumption rise, data center construction must also take into account cooling, power distribution, energy management, and electromechanical infrastructure. In light of these trends, the 2026 Taiwan Industry Week trade show features a dedicated section for data centers, with Auras Technology, Walrus Pump, and Teco Electric and Machinery among the exhibitors, a sign that AI data center-related opportunities are expanding to other segments of the industrial supply chain.

Compared to traditional data centers, next-generation AI data centers require higher-density cooling, more reliable power supplies, and greater energy efficiency. Data center equipment must also be designed around rack configurations, cooling architectures, and site conditions. Moreover, with customers demanding shorter construction timelines while retaining the flexibility for future expansion, suppliers must now be able to integrate key components, liquid-cooling subsystems, and modular electromechanical infrastructure if they wish to secure orders.
Liquid cooling
In terms of liquid cooling, ever-increasing rack power density has pushed the technology beyond server-level cold plates and manifolds to coolant distribution systems at the rack and facility levels. At the 2026 Taiwan Industry Week, Auras is showcasing coolant distribution units (CDUs) for high-performance computing rooms, with cooling capacities of 1.6MW and 2.0MW. These CDUs feature automatic temperature control, flow and pressure control, leak detection, and 1+1 pump redundancy. Moreover, Auras' move into megawatt-scale CDUs also demonstrates how cooling suppliers are expanding from component supply into liquid-cooling subsystems.
Traditional fluid-equipment suppliers are also entering the market. Walrus Pump is featuring its TPMS, CMP, and TPHK-S series of tech-industry pumps for use in in-row CDUs, in-rack CDUs, and immersion cooling, respectively. The TPMS series uses an ultra-thin, high-efficiency motor to reduce its size; the CMP series features a canned, seal-less structure to address limited space inside racks and leakage-control requirements; the TPHK-S series is designed to transport fluids in immersion-cooling systems.
Since AI servers must operate under heavy, sustained loads, industry experts point out that pumps have now become critical components with a marked impact on the efficiency and reliability of cooling systems, rather than functioning merely as apparatuses for conventional fluid transport. Due to the higher requirements for coolant flow, pressure, and system stability, pumps must now be designed to match different CDU architectures, which has created new opportunities for suppliers with high-efficiency motors and precision fluid-control capabilities.
Power requirements
Meanwhile, electromechanical equipment suppliers are targeting the broader infrastructure market. At the trade show, Teco is focusing on modular AI data centers and smart air-conditioning systems, leveraging its existing capabilities in power, cooling, and electromechanical engineering.
Its solutions cover power distribution, cooling, and energy management, with an emphasis on integrated planning based on customers' site conditions. Modular designs are intended to shorten equipment installation and project-delivery times.
Teco has been actively expanding its AI data center electromechanical engineering business in recent years. By using prefabricated designs, the company completes the assembly and testing of some of its power, cooling, and electromechanical equipment at its factories before transporting it to the site for integration, which helps to reduce on-site construction procedures and coordination among different engineering interfaces.
In contrast with the company's conventional business of selling transformers, air-conditioning systems, and power-distribution equipment, this combined strategy gives Teco an opportunity to pursue data center electromechanical system integration as well as engineering, procurement, and construction (EPC) contracts.
With new opportunities emerging across the market, the AI data center infrastructure supply chain has begun to develop distinct layers of specialization. Under this trend, Auras is expanding from cooling components into megawatt-scale liquid-cooling subsystems, Walrus Pump is leveraging its expertise in fluid equipment to break into liquid-cooling applications, and Teco is integrating power, cooling, and electromechanical engineering to pursue the modular data center market.
Although these companies are each targeting different segments of the supply chain, their strategies all reflect how the surge in AI computing demand is creating new opportunities that go beyond computing equipment and into the surrounding infrastructure. The shift is also pushing suppliers to move toward modular solutions and system integration, rather than centering on demand for individual pieces of equipment.