住友贝克特扩产先进封装塑封材料：MUF产能翻倍、压缩成型颗粒三倍，但产线2028–2030年才投产，短期无业绩增量

Sumitomo Bakelite announced that it is expanding production capacity for encapsulation materials used in advanced chip packaging at its facilities in Singapore and Suzhou, China. This is expected to approximately double its production capacity for mold underfill (MUF) materials and approximately triple that for compression-molding granules.

In an announcement , Sumitomo said that the new production lines across both sites will include its SUMIKON EME MUF materials and compression-molding granules. Production is expected to begin at its Singapore facility at the end of fiscal year 2028 and at its Suzhou, China, plant in fiscal year 2030.
It also plans to grow its capacity through its planned acquisition of Kyocera's chemical business set to take place at the end of October. Sumitomo announced the move in February and its planned investment of JPY30 billion (US$189.45 million) to acquire part of the company's materials operations.
It was noted at the time that by acquiring Kyocera's chemical business, which has a stronger position in materials for discrete and power devices within China, Sumitomo could strengthen its push to expand globally. The company said that this combined with its overseas plant expansions will support its ability to supply advanced semiconductor manufacturing operations across Japan, China, and Southeast Asia.
The company said that the region is seeing accelerating demand for advanced chip applications, such as in AI and communications satellites, even as semiconductor packaging is becoming larger, thinner, and more dense. Sumitomo added that its MUF materials offer excellent filling performance in microscopic gaps and low-warpage characteristics.
As chipmakers reach the limits of semiconductor miniaturization, attention is shifting to advanced packaging to raise chip performance. This is particularly important for data center accelerators, which require efficient packaging of high-bandwidth memory (HBM) with other chips. Japanese companies are key suppliers of packaging materials, with Sumitomo Bakelite estimating its share of the global semiconductor encapsulation materials market at around 40% .