臻鼎科技在TPCA Show 2026展示AI服务器、高速光通讯与AI终端PCB方案，属展会营销与技术能力披露，无订单或财务增量

PCB manufacturer Zhen Ding Technology (ZDT) Group is exhibiting at TPCA Show 2026 under the theme "One ZDT, Next AI," highlighting its latest technology and R&D achievements in AI servers, high-speed optical communications, and AI terminal devices. The company is presenting comprehensive PCB solutions spanning AI infrastructure and smart terminals.

From cloud servers to smart terminals
For AI infrastructure, Zhen Ding is showcasing high-end PCBs for AI server GPUs and ASICs, CPUs, and network switches, along with products for next-generation high-speed optical communications applications, including 800G, 1.6T, XPO, and NPO.
Its AI terminal applications cover AI glasses, foldable smartphones, AI PCs, low-Earth-orbit (LEO) satellites, robots, and advanced driver-assistance systems (ADAS). Together, these products demonstrate the group's product portfolio across cloud computing, communications networks, and smart terminals.
Zhen Ding is also introducing its Advanced R&D Center at the event, highlighting capabilities in signal and power integrity, thermal management, material-property analysis, precision measurement, and AI models. These capabilities form the foundation for the group's continued advancement of high-end PCB technology.
PCBs take on a bigger role
Zhen Ding said ongoing upgrades in AI computing performance and system architecture are placing higher demands on PCB transmission speeds, interconnect density, material performance, and system integration, spanning AI servers, high-speed optical communications, and smart terminals.
PCBs have evolved from conventional electronic interconnects into critical components that affect system performance, signal integrity, and energy efficiency, the company said.
Through its One ZDT platform, the group integrates technologies covering flexible PCBs, high-density interconnect boards, high-multilayer boards, and IC substrates. It also combines cross-disciplinary R&D and manufacturing resources to capture technology-upgrade opportunities across the AI industry, from the cloud and network infrastructure to edge devices.
Integration shapes the next race
As AI drives change in the high-end PCB industry, Zhen Ding said future competition will depend not only on technological breakthroughs but also on the ability to integrate materials, equipment, processes, and digital technologies. The goal is to convert innovation into scalable mass production with strong quality, yield, and delivery capabilities.
The group is continuing to deepen smart manufacturing and digital transformation while working with key materials and equipment suppliers, as well as academic and research partners, on collaborative R&D. These efforts are intended to strengthen its global manufacturing capabilities and supply-chain resilience.
Supply-chain resilience takes the stage
Zhen Ding general manager Aaron Chen will participate in the "AI Empowerment and Global Deployment Trends Forum" on October 21. Under the theme "From Technological Breakthroughs to Global Mass Production: Strengthening Supply-Chain Resilience in the AI Era," Chen will exchange views with representatives from international materials and equipment companies, including Qnity and KLA.
Chen will share how AI empowerment, industry-chain collaboration, and integration of global manufacturing systems can accelerate the mass production of advanced technologies and build long-term competitiveness for the high-end PCB industry in the AI era.