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Semiconductors

Infineon COO leaves a US fab open, says GlobalFoundries, ESMC already cover it

Jay Liu
, Taipei

Sep 8, 2026, 09:17 , Updated: Sep 8, 2026, 09:21

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Credit: DIGITIMES

Infineon COO Alexander Gorski said the company is balancing in-house production, outsourcing, and global expansion as supply-chain resilience becomes a key customer requirement. In an exclusive interview with DIGITIMES at SEMICON Taiwan 2026, he also discussed chip shortages and progress at Infineon's new Dresden fab.

Gorski said Infineon opened the fourth fab module at its Dresden site in July 2026, turning the facility into what he described as the world's most advanced and by far the largest power semiconductor fab, several times bigger than any comparable plant today.
He added that Infineon is also accelerating SiC capacity ramp-up at the new cleanroom in Kulim, Malaysia, and will open its new back-end factory in Samut Prakan, south of Bangkok, on October 1. The Bangkok site is designed to be very large and scalable, while Infineon's capacity footprint also includes ESMC, the joint venture with TSMC in Dresden.
When asked whether Infineon is evaluating a new fab in the US, Gorski said the company keeps discussing local manufacturing needs with customers while also weighing the broader geopolitical and tariff environment to determine what makes business sense.
He said Infineon is already performing well in the US through external manufacturing partners, including GlobalFoundries, which works with the company. Infineon also has one of its own plants there, mainly producing high-reliability products for aerospace, satellites, and defense applications.
Gorski stressed that scale economies remain critical in semiconductors. Over the past few years, Infineon's strategy has been to make already large fabs even bigger to create stronger price competitiveness. He said the company's global footprint is also resilient, with sizable sites in multiple Asian countries, and that customers currently strongly support Infineon's approach.
On outsourcing, Gorski said products made at TSMC do not directly compete with advanced-node chips such as AI processors, and Infineon works with multiple suppliers rather than relying on a single silicon foundry. The company will also produce advanced microcontrollers for software-defined vehicles and autonomous vehicles at ESMC.
Infineon's products typically contain differentiated IP, such as power semiconductors, whose technologies and processes differ greatly from mainstream chips and are best produced internally. By contrast, products such as MCUs and some analog mixed-signal products are outsourced because their differentiation comes more from product design and software than from manufacturing.
Gorski said Infineon does not set a fixed percentage for outsourcing. The decision depends entirely on product characteristics and market demand.
He reiterated that Infineon is well prepared for significant growth in the coming years from AI, data centers, energy infrastructure, and automotive demand. In power semiconductors, where Infineon holds a leading market position with more than 20% market share, the company offers a full portfolio spanning silicon, SiC, and GaN, and plans to double capacity over the next few years to keep pace with the new growth cycle.

Article
translated by Charlene Chen and edited by Ysi Chen

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Chips + components IC manufacturing ICT manufacturing IT + CE

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2026 Bangkok capacity expansion fab Infineon outsourcing production TSMC

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