古河电工拟投1000亿日元扩充光纤和光缆产能以响应数据中心需求

Furukawa Electric to invest JPY100 billion to double rollable ribbon cable capacity in response to data center demand
中文網
繁體
简体
SUBSCRIBE
TECH
Tech Home
Semiconductors
Communications
ICT
Displays
Electric Vehicles
Sustainability
REGIONS
Asia Home
East Asia
Southeast Asia
South Asia
Middle East
RESEARCH
OPINIONS
Opinions Home
Interviews
Commentary
Research Insights
Column
FINANCE
BIZ FOCUS
Biz Focus Home
Trending Issues
COMPUTEX
SEMICON
CES
Electronica
EVENT+
Event+ home
Featured Events
MULTIMEDIA
Trending
AMD
Nvidia
TSMC
AI Search
Scaling AI Glasses
Inference Era AI
Advanced Packaging
CONNECT WITH US
REALTIME NEWS
China halts US-based factory audits for CCC certification amid raging tech feud
2min ago
Home
Tech
Jingyue Hsiao
, DIGITIMES, Taipei
Aug 5, 2026, 16:38
0
Furukawa Electric said on August 4 that it will invest approximately JPY100 billion (approx.US$630 million) in total to expand production capacity for optical fibers and optical fiber cables, citing sustained growth in demand for high-quality optical fiber...
The article requires paid subscription.
Subscribe Now
LOGIN
Email address
Password
Keep me signed in
Some subscribers prefer to save their log-in information so they do not have to enter their User ID and Password each time they visit the site. To activate this function, check the 'Keep me signed in' box in the log-in section. This will save the password on the computer you're using to access the site.
Note:
If you choose to use the log-out feature, you will lose your saved information. This means you will be required to log-in the next time you visit our site.
SIGN IN
OR
Enterprise first-time login?
Forgot your password?
Create your free account
Select premium stories & daily editor picks.
Leverage AI summaries for instant insights.
Receive tech briefings & newsletters.
Track financials & stock data of Taiwan tech.
Register for FREE
No credit card required
Share this article
Jul 30, 08:00
EDOM Accelerates Edge AI Deployment with NVIDIA Technologies
Monday 1 June 2026
LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE
Thursday 30 July 2026
ACCM Introduces Celeritas SMC: A Production-Ready, Silicon-Matched Core for Advanced Packaging
Wednesday 29 July 2026
Arrow Drives System-Level Design, Turning Complexity into Competitive Advantage
MOST-READ
7 DAYS NEWS
Haesung DS lands CXMT as DDR5 substrate customer, weighs panel production for DDR6
Samsung struggles to secure AI chip substrates, report says
Memory shortage could turn into a glut by 2028 as chipmakers expand
Samsung, SK Hynix prioritize DDR5 as margins near HBM levels
TSMC's AI bottleneck spills demand across the semiconductor supply chain
AMD leans on Helios and hyperscaler deals to press its case against Nvidia in AI chips
SpaceX's first earnings as a public company show an AI bet outrunning its cash generation
Analysis: AMD and Nvidia take opposite paths to capture next wave of AI infrastructure spending
Research Insight: Samsung indicates diversification in AI memory demand, LTA reshapes supply
Full list
Join our mailing list
DIGITIMES
About
Advertising
Membership
Terms & conditions
Privacy policy
Copyright policy
Contact us
Notes & corrections
Site map
中文網繁體
中文网简体
TOOLS & SERVICES
Tomorrow's Headlines
7 days news
Topics
RSS
© 2026 DIGITIMES Inc. All rights reserved.
Please do not republish, publicly broadcast or publicly transmit content from this website without written permission from DIGITIMES Inc. Please contact us if you have any questions.
Members only
×
Sorry, the page you are trying to open is available only for our paid subscribers.
Please
login
to read more
New users, please
register
first
Notification