华虹集团与北方华创、中微、盛美上海、华海清科签署国产设备战略合作协议

Hua Hong Group signed strategic agreements with four Chinese semiconductor equipment suppliers at the inaugural 2026 China Integrated Circuit Exhibition (China Chip Exhibition) in Shanghai, strengthening cooperation on domestic manufacturing technologies. The event also showcased advances in chipmaking equipment, AI accelerators, and electronic design automation (EDA).

Held on October 12 as part of the 26th China International Industry Fair (CIIF), the exhibition brought together more than 300 companies across 30,000 square meters, spanning chip design, manufacturing, packaging, equipment and materials.
According to STAR Market Daily , Hua Hong signed agreements with Naura Technology, AMEC, ACM Research (Shanghai) and Hwatsing. The four suppliers specialise in critical front-end processes, including deposition, etching, single-wafer cleaning and chemical mechanical planarisation (CMP). The partnerships aim to accelerate equipment qualification, process optimisation and domestic tool adoption in mature-node and specialty manufacturing.
Hua Hong Grace Semiconductor Manufacturing chairman Peng Bai said about 90% of China's foundry capacity in 2026 was concentrated at 22nm and above, compared with 68% globally, indicating further growth potential for mature-node production.
Bai projected that China's specialty-process foundry average selling prices (ASPs), relative to global levels, would rise from 66% in 2024 to 76% by 2030, when domestic supply shares across specialty applications could exceed 40%. Hua Hong is targeting 2030 foundry market shares of 30% in embedded flash (eFlash), 50% in SPI NOR, 20% in bipolar-CMOS-DMOS (BCD) and 35% in CMOS image sensors (CIS).
AMEC advances memory equipment as Chinese GPU makers expand systems
Semiconductor equipment suppliers, including Naura, AMEC, Piotech, Hwatsing, ACM Research and Skyverse, showcased technologies spanning deposition, etching, cleaning, CMP and inspection.
AMEC introduced two high-end systems: the Primo XD-RIE extreme high-aspect-ratio etcher and Prefima Unicore AM 12-inch atomic layer deposition (ALD) molybdenum tool.
Supporting aspect ratios of 70:1 to 90:1, the Primo XD-RIE targets advanced 3D memory manufacturing through improved etch selectivity and a wider process window. The Prefima Unicore AM addresses increasingly complex memory stacks and the transition to molybdenum-based word lines, offering high throughput, a compact footprint, reduced chemical consumption, and warped-wafer compatibility.
AMEC chairman Gerald Yin said the company had developed 54 semiconductor equipment types , including 26 etching configurations and 24 thin-film systems. By June 2026, more than 8,800 reaction chambers were operating in mass production across over 220 fabrication lines worldwide, serving more than 100 customers.
Chinese GPU developer MetaX exhibited its N300, C600, X301 and X302 accelerators for large-model inference, AI training and scientific computing. Its S600 supernode integrates 64 interconnected GPUs per rack and supports expansion to clusters of up to 10,000 GPUs.
Shanghai-based Enflame Technology displayed its CloudBlazer ESL64-0 supernode, combining proprietary AI chips with Orthogonal Electrical Exchange (OEX) interconnects, a cable-free architecture and optical connectivity to improve large-cluster networking.
Component supplier Chongqing Genori Technology showcased silicon, quartz, silicon carbide and ceramic chamber components alongside surface-treatment services. Its upstream expansion includes mass production of large-diameter silicon rods and high-purity CVD silicon carbide materials.
EDA localisation advances as Shanghai targets system-level innovation
At the accompanying 2026 Shanghai IC Summit, Chinese Academy of Sciences academician Junfa Mao identified advanced packaging, chiplets and optical interconnections as alternatives to conventional transistor scaling. Such technologies could shorten interconnect distances and reduce power consumption, while AI-assisted design tools could improve chip development efficiency and reliability.
Shanghai-based Oriental Computing illustrated this approach with its DF1000 , introduced in July 2026. Described by the company as the world's first software-defined near-memory computing 3D chip, it combines 3D stacking with a domestic 14nm manufacturing process.
According to Yicai , Shanghai has established a CNY100 billion (approx. US$14.94 billion) industrial guidance fund, including CNY45 billion for integrated circuits, alongside a third-phase semiconductor investment fund. Three merger-and-acquisition sub-funds covering equipment, EDA and electronic materials support consolidation and supply-chain development.
Empyrean chairman Weiping Liu said Chinese EDA tool coverage had risen from below 30% to 85%, although gaps remain in full-process support and individual tool performance. Domestic adoption exceeds 50% in flat-panel displays, memory and wafer manufacturing, while Chinese EDA platforms cover approximately half of major process nodes, with 80% expected by year-end 2026.
Liu also highlighted AI-assisted development, algorithm optimisation and agent-based EDA systems capable of selecting and operating design tools.
Shanghai's integrated circuit industry approached CNY580 billion in 2025, accounting for roughly 30% of China's total, according to Tang Wenkan, director of the Shanghai Municipal Commission of Economy and Informatization. The sector grew more than 20% year on year in January–August 2026.
The city hosts over 1,200 semiconductor companies and nearly 40% of China's industry talent. Its industrial development strategy prioritises Zhangjiang, Lingang and Jiading, focusing on critical technologies and closer integration across the semiconductor supply chain.