IMPACT 2026先进封装论坛：欣兴、STATS ChipPAC、纬创等高管泛论AI/HPC系统级集成，无订单、指引或新增财务事实

The Global Electronics Association hosted a panel titled "Component to System Integration Advances" during the IMPACT 2026 symposium, bringing together industry leaders from Unimicron, STATS ChipPAC, Wistron, and market research firm TechSearch. Covering crucial supply chain segments—including PCBs, IC substrates, OSATs, and EMS providers—the forum addressed pressing technical bottlenecks in AI-driven high-performance computing (HPC).

As surging demand for AI computing power pushes packaging architectures away from standalone components toward system-level integration, every tier of the supply chain must upgrade in tandem.
Matt Kelly, Chief Technology Officer and Vice President of Technology Solutions at the Global Electronics Association, emphasized that AI and HPC are fundamentally reshaping electronic packaging requirements. He noted that no single segment—whether advanced packaging, substrates, or printed circuit board assembly (PCBA)—can overcome these challenges in isolation.
Kelly highlighted that identifying these critical technology gaps and technical requirements will directly inform the association's next-generation industry guidelines and standards, underscoring its role as a cross-supply-chain collaborative platform.
Jason Wang, Deputy Chief Technology Officer at Unimicron, examined the paradigm shift transforming substrate and PCB technologies under the rapid expansion of AI and HPC. Key developments include IC substrates evolving toward semiconductor-grade manufacturing and traditional PCBs transitioning into substrate-like architectures. Wang urged the industry to proactively adapt to these structural shifts.
Ming-Che Hsieh, Director of Technical Marketing at STATS ChipPAC, analyzed how the semiconductor industry is accelerating its transition toward heterogeneous integration and chiplet architectures to support expanding AI workloads. From an OSAT perspective, Hsieh mapped out the migration path from 2D to 3D packaging, detailing solutions across 2D large FCBGA-MCMs, 2.1D/2.5D interposer integration, and full 3D vertical stacking.
Hao-Chun Hsieh, Deputy Director of Advanced Process Technology and Materials Analysis Engineering at Wistron, focused on the complex board-level assembly challenges associated with massive package footprints. He explained that large system-on-chip (SoC) architectures and BGA packages stacked with high-bandwidth memory (HBM) face severe surface-mount technology (SMT) assembly issues post-mounting, including solder joint fatigue, PCB warpage, placement thermal shifts, and reflow defects.
Jan Vardaman, President of TechSearch International, highlighted common technical hurdles spanning advanced packaging, substrate fabrication, PCB manufacturing, and board assembly. She observed that as advanced packaging continues to evolve, the boundaries between IC packaging, substrate fabrication, and system assembly are blurring into a unified ecosystem, making tighter upstream and downstream supply chain collaboration essential.
Building on the advanced packaging session hosted at IMPACT 2025, the Global Electronics Association stated that it is leveraging its expertise in electronic manufacturing standards to foster integrated dialogue across all manufacturing tiers, connecting every link in the supply chain to help the industry navigate the evolution of advanced packaging.