三星电机6.78万亿韩元AI基板扩产传设备采购瓶颈，但公司称按计划推进、延迟未获证实

Samsung Electro-Mechanics (Semco) faces potential equipment procurement bottlenecks in its KRW6.78 trillion (approx. US$5.1 billion) expansion of semiconductor substrate production for AI servers, as machinery manufacturers struggle with component shortages and longer delivery times. The South Korean company maintains that its investment is proceeding as planned. No production delay has been confirmed.

South Korean reports from Dealsite and Newspim indicate that demand for semiconductor substrate manufacturing equipment has risen sharply since April 2026, stretching suppliers' production schedules. Equipment makers are encountering longer procurement times for components needed to assemble their machines, creating potential shipment delays even when manufacturers have sufficient assembly capacity.
Semco reportedly began reviewing equipment delivery arrangements before formally announcing its expansion. However, some equipment order volumes have yet to be finalized, leaving uncertainty over whether suppliers can deliver the required quantities within the planned timetable.
The company is investing KRW4.27 trillion in its Sejong facility in South Korea, with spending scheduled through May 2028 and mass production targeted for September 2028. Another KRW2.51 trillion is earmarked for its Vietnam subsidiary, where construction completion and operations are targeted for June 2030.
The expansion was disclosed on September 28, with the Sejong investment alone representing the company's largest investment in a single product category. It aims to increase production of flip-chip ball grid array (FC-BGA) substrates used to package high-performance chips, including AI accelerators, graphics processing units, and server CPUs.
Equipment lead times stretch as orders surge
Supply pressures extend across the substrate manufacturing equipment market.
Industry research published in October showed that equipment maker Taesung's cumulative orders increased from approximately KRW43 billion at the end of April to KRW220 billion by early September.
Taesung's equipment delivery lead times have lengthened from three to four months to seven to eight months as orders accelerate. The company manufactures wet-process equipment, including etching and surface-treatment systems used in semiconductor substrate production.
The figures illustrate growing pressure on equipment suppliers but do not establish that Taesung is supplying Semco's expansion.
Lead times are considerably longer for certain other equipment categories. Some substrate exposure, inspection, and repair systems can take nearly two years to deliver. Even expedited orders can take around 18 months, with a minimum waiting period of 12 months.
The constraints reflect a broader investment cycle as substrate manufacturers expand production for larger, more complex semiconductor packages. As substrates increase in area and layer count, additional processing steps and manufacturing equipment are required.
For Semco, the challenge extends beyond securing equipment orders. New production lines also require machinery installation, testing, and commissioning before commercial manufacturing can begin. Any disruption to equipment deliveries could reduce the time available for those subsequent stages.
Customer commitments help offset investment risks
Semco's expansion is supported by funding from global technology and semiconductor customers, alongside medium- and long-term purchase commitments intended to support future plant utilization.
These arrangements are designed to provide greater visibility into demand and reduce financial exposure associated with the multibillion-dollar investment. However, customer funding and purchase commitments do not eliminate the operational risks associated with securing manufacturing equipment.
Semco has not disclosed the identities of participating customers, their financial contributions, or the proportion of future production capacity covered by the agreements.