📰 DigiTimes 实时DigiTimes RealtimeCodex · 实盘观望把握 3/10
北京时间·🕒 发布 07-08 11:17:32时区推断·⟳ 抓取 07-08 11:17:32回填·⚡ 决策 07-09 00:39:33·110.7 天前
日月光扩大先进封装投资，DigiTimes称韩美半导体有望切入ASE的CoWoS设备需求
事件方向对韩美半导体（042700.KS）偏利多：报道指其2.5D TC Bonder 40面向TSMC CoWoS流程，并预计供应ASE，若落地可把增长点从HBM工具扩展到系统级先进封装设备。
📄 原文DigiTimes Realtime↗ 原文
ASE expands globally as Hanmi Semiconductor targets CoWoS packaging demand
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观望 韩美半导体（042700.KS）
方向偏多但不是确认订单，缺少金额和收入弹性，且市场已交易后没有正向反应，当前不满足ENTER。
不做 日月光投控（3711.TW）
ASE是扩产和设备采购方，capex上调早已是AI封装叙事的一部分，且本条未给出直接利润增量，短线edge不足。
展开详情(成交明细 / 研究档案 / 原文全文 / 决策记录链)
研究档案
消息传播链
- DigiTimes报道称ASE因TSMC相关需求扩产，韩美半导体2.5D TC Bonder 40预计供应ASE，但报道本身不是公司公告。
- DigiTimes半导体频道将该文列入当日IC manufacturing新闻，说明已在行业媒体内扩散。
- 2026-07-08 16:37 UTC市场反应stock_quote/yfinance非一手韩美半导体（042700.KS）最新价199200韩元，较前收跌5.37%，未出现同向利好反应。市场反应:042700.KS当日-5.37%，近20日-23.87%；3711.TW当日-3.85%。
关键理由
- 事件方向对韩美半导体（042700.KS）偏利多：报道指其2.5D TC Bonder 40面向TSMC CoWoS流程，并预计供应ASE，若落地可把增长点从HBM工具扩展到系统级先进封装设备。
- 定量库显示CoWoS瓶颈仍在先进封装供给，TSMC约占CoWoS主导产能、ASE/矽品承接部分后道和CoWoS-L相关外包，ASE扩产确实可能带来设备采购需求。
- 量级句：现有信息只有ASE 2026年capex从70亿美元上调至85亿美元与韩美潜在供货方向，但未披露韩美单机ASP、订单台数、确认PO或收入确认节奏，无法把潜在新增收入可靠映射到韩美约18.9万亿韩元市值。
主要风险
- 核心订单仍是DigiTimes行业来源的“预计供应”，不是ASE或韩美公告，且没有金额，不能确认短线业绩弹性。
- 韩美半导体（042700.KS）当天收跌5.37%、近20日跌23.87%，说明市场没有把该报道当作足够强的确认利好，做多逆势风险高。
反向证据
- 做多前查反向 · 来源 kb_search · 影响 weakens
内部KB检索超时，未能补充近期反向纪要；这一缺口降低交易置信度。
检索:Hanmi Semiconductor recent risk HBM TC bonder competition Hanwha Besi order cut 2026 - 做多前查反向 · 来源 stock_quote · 日期 2026-07-08 · 影响 weakens
韩美半导体最新价较前收跌5.37%，近5日跌17.93%、近20日跌23.87%，价格行为不支持立即追多。
检索:042700.KS stock_quote full - 做多前查反向 · 来源 kb_search · 影响 weakens
内部KB检索超时，未能确认订单金额、台数或收入占比；无法完成足以支持ENTER的量级核查。
检索:Hanmi Semiconductor ASE 2.5D TC Bonder 40 CoWoS supply order revenue
工具调用 · 历史记录,结果未知(4 种)
- query_modeling_kb · 结果未知
- kb_search · 结果未知
- stock_quote · 结果未知
- normalize_ticker · 结果未知
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ASE expands globally as Hanmi Semiconductor targets CoWoS packaging demand
Daniel Chiang, Seoul
Jul 8, 2026, 11:17
0
South Korean equipment maker Hanmi Semiconductor is moving beyond high-bandwidth memory (HBM) tools into advanced chip packaging, a shift that could affect the global semiconductor supply chain. As ASE boosts capacity to meet TSMC-linked demand, Hanmi is positioning for broader sales growth in the second half of 2026 and beyond.
Industry sources in South Korea said ASE recently increased investment to absorb spillover packaging orders from TSMC, opening a larger market for Hanmi's system semiconductor packaging equipment. Hanmi has introduced its "2.5D TC Bonder 40" for AI semiconductors and is expected to supply the tool to ASE.
The new platform handles chips from 3x3mm to 40x40mm and is designed for TSMC's CoWoS process, extending Hanmi's lineup from HBM packaging into system-on-chip applications. Hanmi said the equipment includes "Auto Conversion" technology for continuous operation across different chip types and "Reel Feeder Loading" to improve operating efficiency. An optional "Fluxless Bonding" function is aimed at reducing minor defects and improving quality reliability.
Hanmi also plans to establish a US subsidiary, Hanmi US, by the end of 2026 to serve AI companies, foundry customers, and outsourced semiconductor assembly and test clients in the country more directly. The company wants to work with customers earlier in the chip design stage to deepen its presence in the US market.
ASE has been expanding aggressively on the back of the AI boom. It raised its 2026 capex plan from US$7 billion to US$8.5 billion, and COO Tien Wu recently said the company has 15 new plants and externally acquired facilities under construction, but still cannot keep up with demand.
Beyond Taiwan, ASE already operates two test, development, and production facilities in California, with two more sites under planning. It is also preparing a plant in Arizona. Hanmi's US expansion is expected to place it closer to ASE's American operations.
Hanmi first supplied ASE with Micro SAW and Vision Placement equipment, then later FC Bonder tools. The latest 2.5D TC Bonder 40 suggests the relationship is moving into more advanced packaging for CoWoS.
Yole Group estimates the advanced packaging market, including 2.5D and 3D technologies, will grow from US$46 billion in 2024 to US$79.4 billion by 2030. Industry sources said Hanmi's vertical integration has lowered procurement costs and improved margins, potentially making advanced packaging its next major growth driver after HBM.
Article
translated by Jingyue Hsiao and edited by Jack Wu
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REALTIME NEWS
ASE expands globally as Hanmi Semiconductor targets CoWoS packaging demand
Semiconductors
1min ago
ZillTek posts steady revenue growth on PC, auto and hearing aid demand
ICT
3min ago
Dongfeng Nissan seeks a turnaround amid weak Chinese auto market
Tomorrow's Headlines
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Apple's entry into foldable market boost supply chain orders despite cost pressure
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DRAM giants face US price-fixing lawsuit over HBM shift
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Home
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Semiconductors
ASE expands globally as Hanmi Semiconductor targets CoWoS packaging demand
Daniel Chiang, Seoul
Jul 8, 2026, 11:17
0
South Korean equipment maker Hanmi Semiconductor is moving beyond high-bandwidth memory (HBM) tools into advanced chip packaging, a shift that could affect the global semiconductor supply chain. As ASE boosts capacity to meet TSMC-linked demand, Hanmi is positioning for broader sales growth in the second half of 2026 and beyond.
Industry sources in South Korea said ASE recently increased investment to absorb spillover packaging orders from TSMC, opening a larger market for Hanmi's system semiconductor packaging equipment. Hanmi has introduced its "2.5D TC Bonder 40" for AI semiconductors and is expected to supply the tool to ASE.
The new platform handles chips from 3x3mm to 40x40mm and is designed for TSMC's CoWoS process, extending Hanmi's lineup from HBM packaging into system-on-chip applications. Hanmi said the equipment includes "Auto Conversion" technology for continuous operation across different chip types and "Reel Feeder Loading" to improve operating efficiency. An optional "Fluxless Bonding" function is aimed at reducing minor defects and improving quality reliability.
Hanmi also plans to establish a US subsidiary, Hanmi US, by the end of 2026 to serve AI companies, foundry customers, and outsourced semiconductor assembly and test clients in the country more directly. The company wants to work with customers earlier in the chip design stage to deepen its presence in the US market.
ASE has been expanding aggressively on the back of the AI boom. It raised its 2026 capex plan from US$7 billion to US$8.5 billion, and COO Tien Wu recently said the company has 15 new plants and externally acquired facilities under construction, but still cannot keep up with demand.
Beyond Taiwan, ASE already operates two test, development, and production facilities in California, with two more sites under planning. It is also preparing a plant in Arizona. Hanmi's US expansion is expected to place it closer to ASE's American operations.
Hanmi first supplied ASE with Micro SAW and Vision Placement equipment, then later FC Bonder tools. The latest 2.5D TC Bonder 40 suggests the relationship is moving into more advanced packaging for CoWoS.
Yole Group estimates the advanced packaging market, including 2.5D and 3D technologies, will grow from US$46 billion in 2024 to US$79.4 billion by 2030. Industry sources said Hanmi's vertical integration has lowered procurement costs and improved margins, potentially making advanced packaging its next major growth driver after HBM.
Article
translated by Jingyue Hsiao and edited by Jack Wu
AI Search
Related stories
Hanmi targets advanced packaging market with FC Bonder 3.5
ASE raises 2026 capex to record US$8.5 billion on strong advanced packaging demand
Hanmi eyes AI chip packaging amid HBM market challenges
Hanmi Semiconductor expands into advanced chip packaging for AI era
Hanmi Taiwan posts record growth as demand for maintenance services and component sales surge
Show more
Categories
Chips + components IC manufacturing Memory chips
Tags
2026 ASE capacity CoWoS demand equipment growth Hanmi HBM market packaging South Korea supply chain TSMC
Companies
Advanced Semiconductor Engineering Taiwan Semiconductor Manufacturing Company
Share this article
Other links
Related topics
Global supply chain: Advanced economies
Global supply chain: China market
Asia
TSMC updates
Regions
BIZ FOCUS
Jun 1, 08:00
LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE
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