LG Innotek越南IC基板新厂获批推进，但核心扩产消息已提前传播且量产在2028年

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LG Innotek expands Vietnam footprint with new IC substrate plant

Jingyue Hsiao
, DIGITIMES, Taipei

Jul 10, 2026, 02:48

0

LG Innotek is moving ahead with a new semiconductor substrate manufacturing facility in Vietnam, marking its first overseas production base for IC substrates as the company seeks to expand capacity for advanced packaging products used in AI servers and high-end mobile devices.

According to Thelec , authorities in Haiphong have approved LG Innotek's investment plan for a semiconductor packaging manufacturing complex in the Nam Dinh Vu Industrial Park within the Dinh Vu-Cat Hai Economic Zone. The project carries a total investment of about US$1 billion, higher than the roughly KRW1 trillion (US$670 million) investment outlined when the company signed a memorandum of understanding with the Haiphong government last month.
Construction is expected to begin later this year, with trial production scheduled for the third quarter of 2027 and mass production targeted for the third quarter of 2028. The facility will occupy approximately 98,000 pyeong (about 324,000 square meters).
Focus on RF-SiP and FC-CSP
The Vietnam project represents the first phase of LG Innotek's expansion of its Package Substrate business. Initial production will focus on radio frequency system-in-package (RF-SiP) and flip-chip chip-scale package (FC-CSP) substrates, while a separate second-phase investment for flip-chip ball grid array (FC-BGA) substrates will be decided later.
The company has previously said the first-phase expansion is intended to meet demand from existing customers. Discussions on FC-BGA expansion are continuing with global technology companies, particularly for AI server applications, according to Korean industry reports.
Until now, LG Innotek has produced IC substrates only at its Gumi plant in South Korea. With the Gumi lines approaching full utilization, the Vietnam facility extends the company's manufacturing footprint beyond camera modules, which have already been produced in the country under a dual-site strategy spanning South Korea and Vietnam.
The company has also announced additional investment plans in Gumi for FC-BGA capacity, with the two locations expected to become its primary production bases for semiconductor substrates.
AI demand supports capacity expansion
The investment comes as demand continues to grow for advanced package substrates used in AI infrastructure, 5G smartphones, and premium application processors.
RF-SiP substrates are widely used in radio frequency modules for smartphones and wireless communications, while FC-CSP substrates support processors and other high-performance chips used in consumer electronics and computing applications. FC-BGA substrates, which use higher-density packaging technologies, are increasingly deployed in AI servers, networking equipment, and data center processors.
LG Innotek has identified semiconductor packaging as a key growth business alongside its optical solutions operations. The company aims to increase revenue from its Package Solution business to more than KRW3 trillion by 2030 and raise operating profit from the segment to KRW1 trillion by 2031.
Capacity race extends across the substrate industry
LG Innotek's expansion reflects broader investment across the IC substrate industry as suppliers respond to rising AI-related demand.
Established FC-BGA manufacturers in Taiwan and Japan have operated at high utilization amid growing orders for AI accelerators and server processors, prompting other suppliers to expand production. Korean substrate makers have also increased investment as demand broadens beyond traditional high-performance computing applications to networking, automotive, and communications equipment.
At the same time, companies are preparing for next-generation packaging technologies, including glass substrates, although industry observers expect conventional organic substrates such as FC-CSP and FC-BGA to remain the dominant packaging platforms for advanced processors in the near term.
By establishing substrate production in Vietnam while continuing expansion in South Korea, LG Innotek is adopting a dual-manufacturing strategy similar to the one it previously used for camera modules, positioning itself to support long-term demand for advanced semiconductor packaging across both mobile and AI applications.

Article
edited by Joseph Chen

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