鸿海OCP 2026展示Rubin机柜级AI基础设施与FIT液冷/互连方案，仅为展品演示、无订单等增量商业事实

Foxconn Technology Group showcased rack-scale artificial intelligence infrastructure at the Open Compute Project (OCP) Global Summit 2026 in San Jose, California, combining computing platforms, high-speed interconnects, power delivery, and liquid cooling. The portfolio included Ingrasys Technology's Nvidia Vera Rubin NVL72 platform and connectivity, power, and thermal-management systems from Foxconn Interconnect Technology (FIT) as Foxconn expanded its offering from components and Compute Trays to complete AI racks.

Ingrasys featured the Vera Rubin NVL72 platform for large-scale model training and AI inference. The platform's inference performance per watt reaches up to 10 times that of Nvidia's Blackwell platform, according to the company. Ingrasys also presented the Nvidia Groq 3 LPX Rack and Compute Tray for agentic AI inference, along with a Vera CPU Rack Compute Tray using high-density liquid cooling. The design can accommodate up to 256 Vera CPUs in one rack and support 22,500 sandboxes for agentic AI, reinforcement learning, and data-processing workloads.
The exhibition also included the HGX Rubin NVL8 platform and an Nvidia MGX 4U architecture equipped with Nvidia RTX PRO 6000 Blackwell Server Edition GPUs. Foxconn presented additional MGX support spanning server chassis, racks, power delivery, and liquid cooling. Its ultra-dense interconnect (UDI) and ZQD technologies were featured on the Nvidia MGX Ecosystem Wall as solutions for high-density AI rack architectures.
FIT added connectivity and infrastructure technologies to the portfolio. Its 1.6T octal small form factor pluggable (OSFP) platform supports direct-attach copper, active copper, active retimer, and active electrical cables, as well as a 32-port OSFP liquid-cooling solution. Its 12.8T XPO, or eXtra Dense Pluggable Optics, platform combines electrical and optical interconnects with direct liquid cooling to address bandwidth, power, and thermal requirements while increasing port density and energy efficiency. FIT's portfolio supports PAM4, PCIe 6.0, and PCIe 7.0, along with 224G and 448G SerDes.
For rack power and cooling, FIT displayed a liquid-cooled busbar system rated for up to 480 kilowatts, high-current alternating-current whips supporting up to 400 amps, and OCP-compliant UQD and UQDB liquid-cooling quick disconnects. Foxconn said it was continuing work with Intel on rack-scale agentic AI systems based on Intel Xeon platforms. The group plans to combine Ingrasys computing platforms with FIT's components as AI infrastructure moves toward higher density, increased power consumption, and broader use of liquid cooling.