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北京时间·🕒 发布 18:38:00·⟳ 抓取 18:38:35 +35s·⚡ 决策 07-29 18:47:43 +9m08s·89.9 天前

Aeluma与美国商务部签署最高3000万美元CHIPS研发资助意向书

最高3000万美元CHIPS研发资助LOI约占Aeluma 2.60亿美元市值的11.6%,对微盘光子半导体公司仍是可量化政策资金与技术背书。

📄 原文ALMU↗ 原文
Aeluma and Department of Commerce Sign CHIPS Research & Development Office (CRDO) Letter of Intent for up to $30 Millio…
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进场成交2026-07-29 · 盘前首笔 · 07-29 18:41 北京 · @15.484 · 成交 53%
离场成交2026-07-30 · 开盘 · @15.43
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建仓日2026-07-29 · 进场不早于新闻时刻 + 2 分钟

收益口径 event_time_plus_2min_10min_walk_open_topup_to_next_open_exchange_calendar_fill_model_local_notional_v9 · method_id m8db1cbc8f2d · 截至 2026-10-27 16:14

研究档案

🔎 新鲜度:最早出现 2026-07-29 · 扩散 low · price-in 风险 low ↗

消息传播链

  1. 2026-07-29 06:38 ET首发Aeluma/GlobeNewswire一手源原文 ↗
    Aeluma一手发布最高3000万美元CHIPS研发资助LOI,明确资金用途、审批条件和潜在股权发行安排。
    市场反应:首轮stock_quote显示截至2026-07-29 10:39 UTC,ALMU.US报价14.19美元,较前收14.84美元低4.38%。

关键理由

  • 最高3000万美元CHIPS研发资助LOI约占Aeluma 2.60亿美元市值的11.6%,对微盘光子半导体公司仍是可量化政策资金与技术背书。
  • 权威先例显示同类CHIPS/政府资金事件+1日中位为-0.31%、aligned +3日中位仅+2.33%,但ALMU自身两次政府资金/CHIPS叙事均首日弱、3至5日显著修复,因此只适合低位限价试探。
  • 当前权威快照显示ALMU近20日下跌27.25%、距52周高点-53.32%,且首轮实时报价14.19美元低于前收14.84美元,不是已跳空兑现的追高形态。

主要风险

  • LOI仍需尽调、政府内部批准和最终奖励文件,资金金额、到账节奏与里程碑达成均不确定。
  • 公告写明拟向美国商务部发行等同奖励金额的股权证券,资金利好同时伴随稀释,且先例中高开低走/见光死不少。

反向证据

  • 做多前查反向 · 来源 kb_search · 影响 weakens
    内部KB未命中足以推翻本次利好方向的最新负面材料;公告自身披露稀释、审批和亏损历史是主要反证。
    检索:Aeluma ALMU recent risks dilution equity Department of Commerce losses limited operating history

历史先例(按相似度)

  • 相似度 9/10 COHR 2026-06-16 Coherent签署最高5000万美元CHIPS LOI扩产InP, 同为AI基础设施光子/化合物半导体材料背书, 金额小于当前ALMU但机制最贴近。 原文 ↗
    事件后 +1日 -1.0% · +2日 +1.8% · +3日 +11.2% · +4日 -0.4% · +5日 +2.5%
    相似度依据:同为美国商务部CHIPS LOI、化合物/光子半导体材料链, 但COHR金额/市值占比远低于ALMU且当日混有NVIDIA/奠基叙事。
  • 相似度 8/10 ALMU 2026-04-13 Aeluma获逾400万美元美国政府量子材料和激光合同,规模小于当前3000万美元LOI。 原文 ↗
    事件后 +1日 -7.1% · +2日 +8.3% · +3日 +13.0% · +4日 +5.0% · +5日 +8.6%
    相似度依据:同一标的、同属美国政府资金/技术背书,规模小于本次但事件机制接近。
  • 相似度 8/10 COHR 2025-01-16 Coherent获最高7900万美元CHIPS PMT扩产SiC基板/外延, 同一交易对手方、同类化合物半导体政策资金。 原文 ↗
    事件后 +1日 +2.7% · +2日 +7.9% · +3日 +12.8% · +4日 +12.6% · +5日 +4.9%
    相似度依据:同一商务部CHIPS PMT/半导体材料供应链, 但不是LOI且金额/市值弹性低于ALMU。
  • 相似度 7/10 ALMU 2026-05-28 Aeluma评论美国商务部量子CHIPS LOI名单,属于政府资金与技术路线背书。 原文 ↗
    事件后 +1日 -6.5% · +2日 +13.5% · +3日 +15.0% · +4日 +16.1% · +5日 +17.8%
    相似度依据:同一标的、同为CHIPS/政府资金叙事,但当时金额确定性弱于本次。
  • 相似度 6/10 ADI 2025-01-16 Analog Devices获最高1.05亿美元CHIPS PMT用于R&D、RF和成熟节点设施, 政策资金属性一致但交易弹性弱。 原文 ↗
    事件后 +1日 +1.9% · +2日 +3.0% · +3日 +4.2% · +4日 +6.2% · +5日 +1.1%
    相似度依据:同一商务部CHIPS PMT机制, 但ADI为大盘模拟/RF龙头, 资金占市值极低。
  • 相似度 6/10 GLW 2024-11-08 Corning获最高3200万美元CHIPS PMT用于半导体专用玻璃, 金额口径最接近当前事件但市值占比明显更低。 原文 ↗
    事件后 +1日 +0.4% · +2日 -0.8% · +3日 -3.1% · +4日 -3.4% · +5日 -4.0%
    相似度依据:3200万美元与ALMU的3000万美元同量级, 但GLW市值巨大且品类为半导体玻璃材料。
  • 相似度 6/10 AMKR 2024-07-26 Amkor签署最高4亿美元直接资金和2亿美元贷款CHIPS PMT, 先进封装政策背书强但不是小盘研发资助。 原文 ↗
    事件后 +1日 -1.4% · +2日 -20.0% · +3日 -14.4% · +4日 -21.3% · +5日 -24.9%
    相似度依据:同为CHIPS PMT和半导体制造供应链, 但先进封装CAPEX项目、金额更大且公告后叠加财报/行业因素。
  • 相似度 5/10 MCHP 2024-01-04 Microchip获约1.62亿美元CHIPS PMT扩产MCU和成熟节点芯片, 政策资金确认但市场预期较充分。 原文 ↗
    事件后 +1日 +0.7% · +2日 +2.7% · +3日 +2.3% · +4日 +2.5% · +5日 +2.8%
    相似度依据:同一商务部CHIPS PMT机制, 但成熟节点大盘公司、事件弹性和技术相位都弱于ALMU。
  • 相似度 5/10 GFS 2024-02-19 GlobalFoundries获约15亿美元CHIPS PMT扩产纽约和佛蒙特成熟节点产能, 同交易对手方但非小盘研发背书。 原文 ↗
    事件后 +1日 -2.0% · +2日 -0.7% · +3日 -2.5% · +4日 +0.0% · +5日 -1.8%
    相似度依据:同一CHIPS资金机制, 但GlobalFoundries是成熟晶圆厂、金额/市值和商业模式与ALMU差异大。
  • 相似度 5/10 600703 2024-06-29 三安光电公告收到湖南三安2024年度科技研发专项扶持资金2亿元, 同为第三代半导体/化合物半导体政府研发补助。 原文 ↗
    事件后 +1日 -1.1% · +2日 -1.6% · +3日 -3.7% · +4日 -3.7% · +5日 -4.8%
    相似度依据:同为化合物/第三代半导体公司获得政府研发补助, 但A股会计补助公告和美国CHIPS LOI机制不同。
  • 相似度 4/10 INTC 2024-03-20 Intel获最高85亿美元直接资金和110亿美元贷款CHIPS PMT, 政策锚最强但大盘股见光死风险更有代表性。 原文 ↗
    事件后 +1日 +0.5% · +2日 +0.9% · +3日 -0.9% · +4日 -0.5% · +5日 +3.7%
    相似度依据:同为商务部CHIPS PMT, 但Intel为巨型IDM、政策预期最充分, 对ALMU小盘弹性参考有限。
  • 相似度 4/10 MU 2024-04-25 Micron获约61.4亿美元CHIPS PMT建设美国DRAM产能, 同政策资金但金额/市值弹性低于ALMU。 原文 ↗
    事件后 +1日 +2.9% · +2日 +2.5% · +3日 +1.2% · +4日 -1.7% · +5日 +0.7%
    相似度依据:同一CHIPS PMT, 但Micron为周期存储大盘股, 事件更多影响长期资本开支而非即时研发现金弹性。
  • 相似度 4/10 TSM 2024-04-08 TSMC Arizona获最高66亿美元CHIPS PMT并新增第三座美国先进制程厂, 用于观察海外主体拿美国政策资金的方向反应。 原文 ↗
    事件后 +1日 +1.8% · +2日 +2.4% · +3日 +3.1% · +4日 -0.2% · +5日 -1.9%
    相似度依据:同为美国CHIPS PMT但主体为台湾公司ADR, 巨头扩厂叙事与ALMU小盘研发资助差异大。
  • 相似度 3/10 000938 2024-01-03 紫光股份控股子公司获郑州高新区2023年度经营奖励3亿元、已收2.01亿元, 政府补助占净利约13.9%。 原文 ↗
    事件后 +1日 -1.7% · +2日 -4.5% · +3日 -7.8% · +4日 -7.3% · +5日 -8.0%
    相似度依据:同为政府补助/奖励确认且金额占利润不小, 但行业和政策机制都弱于半导体CHIPS可比性。
工具调用 · 历史记录,结果未知(7 种)
  • search_processed_events · 结果未知
  • stock_quote · 结果未知
  • kb_search · 结果未知
  • query_modeling_kb · 结果未知
  • event_study · 结果未知
  • search_case_library · 结果未知
  • validate_order · 结果未知

原文全文

展开原文 · 9,576 字
Aeluma and Department of Commerce Sign CHIPS Research & Development Office (CRDO) Letter of Intent for up to $30 Million to Accelerate U.S. Leadership in AI and Advanced Computing
July 29, 2026 6:38am EDT
Download as PDF
Funding Would Advance Company’s Scalable Non-InP Substrate Technology for AI Datacom to Address Supply Chain Constraints
GOLETA, Calif., July 29, 2026 (GLOBE NEWSWIRE) -- Aeluma, Inc. (NASDAQ: ALMU), a semiconductor company specializing in high-performance, scalable technologies for mobile, AI, defense and aerospace, robotics, automotive, AR/VR, and quantum, today announced that it has signed a letter of intent (LOI) for up to $30 million of proposed funding under the CHIPS and Science Act, which is administered by the U.S. Department of Commerce. The award will support Research & Development of Aeluma’s scalable, non-InP semiconductor manufacturing platform for photonics, an important technology for the U.S. economy and national security.
CHIPS funding is designed to advance semiconductor R&D, strengthen U.S. technology leadership, and accelerate the pace of commercialization to enable technology dominance in the industries of the future. Scalable manufacturing of compound semiconductors is critical to AI, advanced computing, and other applications. Aeluma’s non-InP, large-diameter substrate platform addresses supply chain constraints and enables the scaling of photonic components such as high-speed photodetectors and lasers. These technologies will accelerate domestic production for next generation AI interconnects, network communications, and sensing.
“We are pleased to be one of the companies selected to receive an LOI for funding to support the AI and advanced computing ecosystem in the U.S.,” said Jonathan Klamkin, Ph.D., Aeluma’s President and CEO. “This award aims to accelerate development and commercialization of our scalable, high-performance semiconductor platform, leveraging Aeluma’s facilities in Goleta, California, and partner sites within the U.S. With growing demand for photonics in AI and advanced computing infrastructure, Aeluma is poised for broad market adoption of our innovative technology solutions.”
“With today’s compute supply chain investments, the Trump Administration is accelerating America’s innovation engine,” said Secretary of Commerce Howard Lutnick. “These strategic investments will enhance our country’s domestic capabilities, create high-paying jobs and keep America at the forefront of the semiconductor industry.”
“The CHIPS R&D incentives will support a breakthrough in manufacturing of photonic devices for compute and communication networks,” said Bill Frauenhofer, the Executive Director for Semiconductor Innovation and Investment at the Department of Commerce. “Accelerating R&D for next generation substrates for domestic photonic devices provides American industry the extreme bandwidth and energy efficiency to scale complex AI workloads.”
Aeluma pioneered a platform to build high-performance photonics on large-diameter, mismatched substrates up to 300mm in size. This game-changing technology bridges compound semiconductor materials with mainstream microelectronics to meet the scaling requirements of high growth markets. The funded initiatives would accelerate commercialization of Aeluma’s high-performance semiconductors for the AI and advanced computing markets. InP substrates are used for manufacturing critical photonic components, but these substrates are relatively expensive, limited in manufacturing throughput, and subject to geopolitics and supply shortages. Aeluma leverages alternative, larger diameter substrates to build high-performance photonics. The development contemplated in the LOI emphasizes manufacturing readiness and scaling of Aeluma’s non-InP photonics, aligning with the U.S. CHIPS and Science Act objectives to strengthen domestic semiconductor manufacturing, supply chain resiliency, and national security.
The award is subject to the completion of further due diligence, required approvals, including internal approvals of the U.S. Government, and the parties’ execution of definitive award documents. The LOI contemplates a portion of the award being funded up front and the remainder funded on a milestone-based award structure tied to eligible project costs and technical progress.
Any securities issued to the U.S. Department of Commerce in connection with the proposed award will not be registered under the Securities Act of 1933, as amended, and may be issued only pursuant to an applicable exemption from the registration requirements of that Act. This press release does not constitute an offer to sell or the solicitation of an offer to buy any securities of Aeluma, nor shall there be any sale of such securities in any state or jurisdiction in which such offer, solicitation, or sale would be unlawful prior to registration or qualification under the securities laws of such state or jurisdiction. In connection with executing final award documents, Aeluma would issue equity securities to the U.S. Department of Commerce with an aggregate value equal to the award amount.
About Aeluma
Aeluma (NASDAQ: ALMU) is a transformative semiconductor company specializing in high-performance photonic and electronic technologies that scale. The company’s proprietary platform combines compound semiconductors with scalable manufacturing used for mass market microelectronics to enable volume production and large-scale integration. Applications for Aeluma’s technology include mobile, AI, defense and aerospace, robotics, automotive, AR/VR, and quantum. Headquartered in Goleta, California, Aeluma operates state-of-the-art R&D and manufacturing capabilities for semiconductor wafer production, quick-turn chip fabrication, rapid prototyping, test, and validation. Aeluma also partners with production-scale fabrication foundries, packaging, and integration companies. For more information, visit
www.aeluma.com
.
Forward-Looking Statements
This press release contains forward-looking statements within the meaning of the safe harbor provisions of the Private Securities Litigation Reform Act of 1995 and other securities laws. All statements in this press release that are not historical are forward-looking statements, including, among other things, statements whether Aeluma or the U.S. Department of Commerce will enter into definitive award documents on acceptable terms, or at all, whether Aeluma will receive or retain any portion of the proposed funding, the potential issuance of Company securities to the U.S. Department of Commerce, potential applications and resulting benefits of Aeluma’s technology, timing of development and commercialization of Aeluma’s products, anticipated demand for Aeluma’s products, and impacts of the Award on the same. These statements are not historical facts but rather are based on Aeluma’s current expectations, estimates, and projections regarding its business, operations, and other similar or related factors. Words such as “anticipate,” “could,” “growing,” “intend,” “may,” “plan,” “poised,” “potential,” “will,” “would,” and other similar or related expressions are used to identify these forward-looking statements, although not all forward-looking statements contain these words. These forward-looking statements are neither promises nor guarantees, and you should not place undue reliance on forward-looking statements because they involve known and unknown risks, uncertainties, and assumptions that are difficult or impossible to predict and, in some cases, beyond Aeluma’s control. Actual results may differ materially from those in the forward-looking statements as a result of a number of factors, including uncertainty as to whether Aeluma and the U.S. Department of Commerce will establish and execute definitive award documents for the proposed funding on acceptable terms, or at all; uncertainty as to whether, when, and in what amount Aeluma will receive or retain any portion of the proposed funding; the perceived and actual dilutive effects of the proposed issuance of common stock; impacts of an equity stake by the U.S. government in Aeluma, including any related reputational, regulatory, or governance considerations; Aeluma’s ability to satisfy applicable milestones associated with the funding; the risk that anticipated benefits of the proposed funding, including acceleration of commercialization and scaling of Aeluma’s non-InP photonics platform, may not be realized on the timeline anticipated or at all; changes in U.S. government policy, funding priorities, or budgetary constraints that could affect the availability or continuation of CHIPS and Science Act programs; Aeluma’s history of losses and limited operating history, and its ability to achieve or sustain profitability; competitive, technological, and market risks affecting the adoption of Aeluma’s semiconductor and photonics products for AI, high-performance computing, and other target markets; general economic, geopolitical, and supply-chain conditions affecting the semiconductor industry; and other risks described in Aeluma’s filings with the U.S. Securities and Exchange Commission. Aeluma undertakes no obligation to revise or update information in this release to reflect events or circumstances in the future, even if new information becomes available, except as required by law.
Company:
Aeluma, Inc.
(805) 351-2707
info@aeluma.com
Investor Contact:
Financial Profiles, Inc.
Moira Conlon and Alex Villalta
(310) 622-8227
ir@aeluma.com
Source: Aeluma, Inc.
Released July 29, 2026

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