The Elec EnglishCodex · 实盘不做把握 6/10
北京时间·🕒 发布 17:22:51时区推断·⟳ 抓取 17:26:45·⚡ 决策 07-15 18:23:36 +56m51s·103.9 天前
三星考虑将谷歌2nm TPU I/O Die后端设计外包给韩国DSP厂商
The Elec称三星只是向DSP伙伴询问谷歌Icefish TPU I/O Die后端设计外包意向,尚未确定中标方或合同结构。
📄 原文The Elec English↗ 原文
이전 기사보기 다음 기사보기 Samsung Weighs Outsourcing Back-End Design for Google's 2nm TPU I/O Die Character Size Settings 가 The b…
不做 ADTechnology(200710.KS)
不做:只是潜在候选且未获正式订单,项目金额通常仅数十亿韩元、毛利低,公司已有更大2nm CPU项目;隔夜追高没有足够edge。
不做 Gaonchips(399720.KS)
不做:虽被列为领先候选,但报道同时称其项目负荷重且承接意愿不强,且近期股价波动和量能已很拥挤,未确认中标前不追。
不做 Alphachips(117670.KS)
不做:小市值弹性最大但当前只有媒体称其积极争取,缺少官方确认和合同金额;流动性偏低,适合等三星/公司确认后由新信号接手。
展开详情(成交明细 / 研究档案 / 原文全文 / 决策记录链)
研究档案
🔎 新鲜度:最早出现 2026-07-15 · 扩散 low · price-in 风险 medium ↗
消息传播链
- The Elec援引多位行业人士称三星正评估将谷歌第10代TPU I/O Die后端设计外包给DSP伙伴,ADTechnology、Gaonchips和Alphachips被点名为潜在方。市场反应:发布时间在韩国收盘后,韩股无法连续成交;当日涨跌不是对此文的直接反应。
- 2026-07-15 10:21 UTC市场反应stock_quote非一手ADTechnology当日收涨6.77%、Gaonchips收涨5.98%、Alphachips收涨1.57%,但文章为盘后发布,不能把当日涨幅视为事件确认。市场反应:韩国市场已收盘,下一可交易窗口为次日开盘。
关键理由
- The Elec称三星只是向DSP伙伴询问谷歌Icefish TPU I/O Die后端设计外包意向,尚未确定中标方或合同结构。
- 报道明确称后端设计项目通常仅数十亿韩元、毛利低于完整ASIC项目;对ADTechnology和Gaonchips这类更大设计服务商的收入和市值弹性有限。
- Alphachips体量更小且报道称其积极争取该项目,但目前缺少官方确认、金额和唯一中标信息,信号仍停留在候选名单阶段。
主要风险
- 若后续三星或谷歌确认Alphachips独家获得高规格2nm项目,117670.KS可能因小市值和AI半导体标签出现补涨。
- 韩国设计服务股近期波动极大,Gaonchips和ADTechnology在事件前一周已有多次大幅跳涨/回落,追隔夜消息容易遇到高开低走。
反向证据
- 做多前查反向 · 来源 kb_search · 日期 2026-07-15 · 影响 weakens
内部库未命中该项目的确认中标或明确反向利空;但The Elec正文自身提示后端设计毛利低、ADTechnology已有重点2nm CPU项目。
检索:ADTechnology Samsung DSP 2nm back-end design Google TPU recent negative risk 原文 ↗ - 做多前查反向 · 来源 kb_search · 日期 2026-07-15 · 影响 weakens
内部库未命中该项目的确认中标或明确反向利空;但The Elec正文称Gaonchips已有K-On-Device AI等项目,且对低毛利后端设计项目热情不强。
检索:Gaonchips Samsung DSP 2nm back-end design Google TPU recent negative risk 原文 ↗ - 做多前查反向 · 来源 kb_search · 日期 2026-07-15 · 影响 weakens
内部库未找到Alphachips已获三星/谷歌项目的独立确认;当前只有媒体称其积极追求该机会。
检索:Alphachips AlphaChips Samsung DSP Google TPU 2nm back-end design growth opportunity 原文 ↗
工具调用 · 历史记录,结果未知(3 种)
- normalize_ticker · 结果未知
- stock_quote · 结果未知
- kb_search · 结果未知
原文全文
展开原文 · 6,310 字
이전 기사보기
다음 기사보기
Samsung Weighs Outsourcing Back-End Design for Google's 2nm TPU I/O Die
Character Size Settings
가
The body content of the article will be changed to this letter size.
스크롤 이동 상태바
Semiconductor
ADTechnology, Gaonchips and Alphachips emerge as potential design partners amid rising foundry demand
Lee Jun
Published 2026.07.15 18:22
Reply 0
이 기사를 공유합니다
Google TPU. (Image: Google)
Samsung Electronics is considering outsourcing the back-end design of the input/output (I/O) die for Google's 2-nanometer tensor processing unit (TPU), as rising foundry demand stretches its internal engineering resources and prompts the company to seek support from external partners.
According to multiple industry sources on July 15, Samsung has recently approached its Design Solution Partners (DSPs) to assess interest in the back-end design work for the I/O die of Google's 10th-generation TPU, code-named Icefish, which will be manufactured on Samsung's 2nm process.
The TPU is Google's in-house AI accelerator used to power AI models including Gemini. Google is reportedly co-developing the 10th-generation TPU with MediaTek, with mass production expected to begin as early as 2028.
The TPU consists of a compute processor and a separate I/O die. The compute processor is expected to be manufactured by TSMC using its 1.4nm process, while Samsung will produce the I/O die on its 2nm node. The I/O die is responsible for transferring data between the compute processor and high-bandwidth memory (HBM).
DSPs adapt customers' chip designs so they can be manufactured at Samsung's foundries. The back-end design process includes physical implementation, such as placement and routing of logic circuits, design-for-test (DFT) implementation, and design verification. Samsung is considering outsourcing part or all of the work to DSPs, while also evaluating whether to keep portions of the project in-house.
Samsung handled the back-end design of Tesla's 2nm autonomous driving chip internally. However, industry sources said demand for Samsung's 2nm process has recently increased to the point where engineering resources have become constrained.
In addition to Google and Tesla, Samsung has reportedly secured Anthropic and DeepX as 2nm foundry customers. One industry source said some orders are shifting to Samsung because TSMC, the leading competitor in advanced-node manufacturing, is approaching capacity limits.
ADTechnology and Gaonchips are currently viewed as the leading candidates for the back-end design work. Both companies are already preparing or executing projects based on Samsung's 2nm process, the same technology node used for Google's TPU.
Industry sources said, however, that neither company has shown strong enthusiasm for the project. Both are already committed to major engagements, and back-end design services generally offer lower margins than full custom application-specific integrated circuit (ASIC) projects. Design houses typically prefer ASIC programs that cover the entire process from chip design through tape-out. Even so, the companies are expected to consider taking on part of the work to build a track record on a high-profile 2nm project for a global technology company.
Depending on the manufacturing process and contract structure, back-end design projects are typically valued at several billion won, while ASIC projects are generally worth tens of billions of won. For ASIC programs with guaranteed mass-production volumes, contract values can ultimately reach hundreds of billions of won.
ADTechnology is currently focused on its 2nm central processing unit (CPU) project, known as ADP620, with the goal of generating annual revenue exceeding 1 trillion won between 2028 and 2029.
Gaonchips is also preparing to participate in the approximately 800 billion won K-On-Device AI project led by South Korea's Ministry of Trade, Industry and Resources. The company plans to develop a 5nm advanced driver assistance system (ADAS) chip in collaboration with Hyundai Motor and other partners.
In addition to ADTechnology and Gaonchips, Alphachips has also been mentioned as a potential outsourcing partner. Unlike some of its rivals, the company reportedly views participation in the Google TPU project as a key growth opportunity and is actively pursuing the assignment.
2jun0504@thelec.kr
View other news
Copyright © The Elec Inc. No unauthorized transfer and redistribution
Comments
Name
Password
Enter comments
0
/ 400
Submit
Sort the comments.
Newest
Recommended
Top Comments
Best comment
It is automatically exposed by adding up the number of replies and recommendations.
close
더보기
Delete comments
Deleted comments cannot be recovered.
Do you still want to delete it?
Delete
Modify the comments
You can modify comments only within 1 minute after writing.
Text
Modify
My comment
Most Read
1
LG Display Says AI-Driven Manufacturing and R&D Save More Than 200 Billion Won Annually
2
Samsung SDI Supplies AI Data Center Battery Cells to Taiwan's Simplo Technology
3
Samsung Electro-Mechanics to Invest 23 Trillion Won in Sejong and Busan Through 2040
4
Samsung SDI to Invest 25 Trillion Won in Next-Generation Battery Production in Ulsan and Cheonan
5
Samsung Reaffirms 1.4nm Mass Production in 2029, Sets SF1.4+ for 2030
6
US Media: Samsung and Anthropic Discuss Collaboration on 2nm AI Chips and Advanced Packaging
7
LG Energy Solution Begins ESS Battery Production at GM Joint Venture Plant
8
Samsung Foundry Showcases Future Production Pipeline at SAFE Forum
9
Is Meta's Cloud Plan Really a Sign of an AI Semiconductor Investment Bubble?
10
Synopex to Invest 15 Billion Won More in Vietnam Plant for EV FPCB Production
Editor’s Picks
PSK Holdings Wins Orders for More Than 300 Reflow Systems
SK hynix Expands Supplier Base for Hafnium High-k Precursors Used in DRAM
Samsung Electronics, Samsung Display Join Forces on Glass Interposer Technology
SK hynix Prices ADR Offering at $149, Raising Record $26.51 Billion
LG Energy Solution Expands Tesla Battery Production at Nanjing Plant
More Stories
LG Electronics Accelerates Push Into Robotic Actuator Business
LG Energy Solution Sees ESS as the Answer to AI-Driven Grid Bottlenecks
MIT Advances Toward KOSDAQ Listing After Securing Technology Evaluation Grade
Electrolytes Emerge as Key to Better, Lower-Cost Batteries
다음 기사보기
Samsung Weighs Outsourcing Back-End Design for Google's 2nm TPU I/O Die
Character Size Settings
가
The body content of the article will be changed to this letter size.
스크롤 이동 상태바
Semiconductor
ADTechnology, Gaonchips and Alphachips emerge as potential design partners amid rising foundry demand
Lee Jun
Published 2026.07.15 18:22
Reply 0
이 기사를 공유합니다
Google TPU. (Image: Google)
Samsung Electronics is considering outsourcing the back-end design of the input/output (I/O) die for Google's 2-nanometer tensor processing unit (TPU), as rising foundry demand stretches its internal engineering resources and prompts the company to seek support from external partners.
According to multiple industry sources on July 15, Samsung has recently approached its Design Solution Partners (DSPs) to assess interest in the back-end design work for the I/O die of Google's 10th-generation TPU, code-named Icefish, which will be manufactured on Samsung's 2nm process.
The TPU is Google's in-house AI accelerator used to power AI models including Gemini. Google is reportedly co-developing the 10th-generation TPU with MediaTek, with mass production expected to begin as early as 2028.
The TPU consists of a compute processor and a separate I/O die. The compute processor is expected to be manufactured by TSMC using its 1.4nm process, while Samsung will produce the I/O die on its 2nm node. The I/O die is responsible for transferring data between the compute processor and high-bandwidth memory (HBM).
DSPs adapt customers' chip designs so they can be manufactured at Samsung's foundries. The back-end design process includes physical implementation, such as placement and routing of logic circuits, design-for-test (DFT) implementation, and design verification. Samsung is considering outsourcing part or all of the work to DSPs, while also evaluating whether to keep portions of the project in-house.
Samsung handled the back-end design of Tesla's 2nm autonomous driving chip internally. However, industry sources said demand for Samsung's 2nm process has recently increased to the point where engineering resources have become constrained.
In addition to Google and Tesla, Samsung has reportedly secured Anthropic and DeepX as 2nm foundry customers. One industry source said some orders are shifting to Samsung because TSMC, the leading competitor in advanced-node manufacturing, is approaching capacity limits.
ADTechnology and Gaonchips are currently viewed as the leading candidates for the back-end design work. Both companies are already preparing or executing projects based on Samsung's 2nm process, the same technology node used for Google's TPU.
Industry sources said, however, that neither company has shown strong enthusiasm for the project. Both are already committed to major engagements, and back-end design services generally offer lower margins than full custom application-specific integrated circuit (ASIC) projects. Design houses typically prefer ASIC programs that cover the entire process from chip design through tape-out. Even so, the companies are expected to consider taking on part of the work to build a track record on a high-profile 2nm project for a global technology company.
Depending on the manufacturing process and contract structure, back-end design projects are typically valued at several billion won, while ASIC projects are generally worth tens of billions of won. For ASIC programs with guaranteed mass-production volumes, contract values can ultimately reach hundreds of billions of won.
ADTechnology is currently focused on its 2nm central processing unit (CPU) project, known as ADP620, with the goal of generating annual revenue exceeding 1 trillion won between 2028 and 2029.
Gaonchips is also preparing to participate in the approximately 800 billion won K-On-Device AI project led by South Korea's Ministry of Trade, Industry and Resources. The company plans to develop a 5nm advanced driver assistance system (ADAS) chip in collaboration with Hyundai Motor and other partners.
In addition to ADTechnology and Gaonchips, Alphachips has also been mentioned as a potential outsourcing partner. Unlike some of its rivals, the company reportedly views participation in the Google TPU project as a key growth opportunity and is actively pursuing the assignment.
2jun0504@thelec.kr
View other news
Copyright © The Elec Inc. No unauthorized transfer and redistribution
Comments
Name
Password
Enter comments
0
/ 400
Submit
Sort the comments.
Newest
Recommended
Top Comments
Best comment
It is automatically exposed by adding up the number of replies and recommendations.
close
더보기
Delete comments
Deleted comments cannot be recovered.
Do you still want to delete it?
Delete
Modify the comments
You can modify comments only within 1 minute after writing.
Text
Modify
My comment
Most Read
1
LG Display Says AI-Driven Manufacturing and R&D Save More Than 200 Billion Won Annually
2
Samsung SDI Supplies AI Data Center Battery Cells to Taiwan's Simplo Technology
3
Samsung Electro-Mechanics to Invest 23 Trillion Won in Sejong and Busan Through 2040
4
Samsung SDI to Invest 25 Trillion Won in Next-Generation Battery Production in Ulsan and Cheonan
5
Samsung Reaffirms 1.4nm Mass Production in 2029, Sets SF1.4+ for 2030
6
US Media: Samsung and Anthropic Discuss Collaboration on 2nm AI Chips and Advanced Packaging
7
LG Energy Solution Begins ESS Battery Production at GM Joint Venture Plant
8
Samsung Foundry Showcases Future Production Pipeline at SAFE Forum
9
Is Meta's Cloud Plan Really a Sign of an AI Semiconductor Investment Bubble?
10
Synopex to Invest 15 Billion Won More in Vietnam Plant for EV FPCB Production
Editor’s Picks
PSK Holdings Wins Orders for More Than 300 Reflow Systems
SK hynix Expands Supplier Base for Hafnium High-k Precursors Used in DRAM
Samsung Electronics, Samsung Display Join Forces on Glass Interposer Technology
SK hynix Prices ADR Offering at $149, Raising Record $26.51 Billion
LG Energy Solution Expands Tesla Battery Production at Nanjing Plant
More Stories
LG Electronics Accelerates Push Into Robotic Actuator Business
LG Energy Solution Sees ESS as the Answer to AI-Driven Grid Bottlenecks
MIT Advances Toward KOSDAQ Listing After Securing Technology Evaluation Grade
Electrolytes Emerge as Key to Better, Lower-Cost Batteries
决策记录链 · 只追加
每次领取产生一条记录,重新决策追加一条并以 supersedes 指向被替代的记录(ADR 0014)。
这条决策早于决策账本(2026-10-08 起逐条追加),没有追加记录。