三星电机与高通联合开发AI封装用有机桥（2.1D）技术，仍处验证阶段、无订单无收入

Samsung Electro-Mechanics is working with Qualcomm to develop an “organic bridge” technology for advanced packaging used in artificial intelligence (AI) semiconductors. Samsung Electro-Mechanics is also pursuing joint development of the organic bridge technology with multiple customers beyond Qualcomm.
The organic bridge is similar to the silicon bridge used in Intel’s Embedded Multi-die Interconnect Bridge (EMIB) packaging, but uses organic materials commonly found in printed circuit boards (PCBs) instead of silicon.
According to industry sources on Monday, Samsung Electro-Mechanics and Qualcomm have been jointly developing organic bridge technology for use in 2.1D packaging. The companies have been developing and validating the technology for more than a year. They are evaluating the performance and reliability of flip-chip ball grid array (FC-BGA) substrates in which organic bridges are embedded to connect Qualcomm chips.
Qualcomm is understood to be considering the use of organic bridges in large multi-die semiconductors for data centers. In October 2024, the company filed a patent for an “Interconnect Bridge” technology. The technology involves embedding a separately manufactured organic-material bridge in a package substrate to connect multiple dies. Qualcomm also recruited personnel for organic bridge development in South Korea in March.
An organic bridge is a component that connects multiple semiconductor dies integrated into a single package. It can be viewed as an extremely small substrate with ultrafine circuitry. Multiple layers of fine circuits are formed on an organic insulating material through a redistribution layer (RDL) process. The resulting wiring is finer than the buildup circuits used in conventional FC-BGA substrates, allowing more signals to be transmitted over a smaller area. The technology is designed to increase input/output (I/O) density and bandwidth between dies, including graphics processing units (GPUs) and high-bandwidth memory (HBM). It serves a role similar to the silicon bridge used in Intel's EMIB, but is manufactured on an organic material using substrate manufacturing processes rather than semiconductor fabrication processes.
Samsung Electro-Mechanics is manufacturing FC-BGA substrates with cavities where the organic bridges are embedded. The company is considering two approaches for sourcing the bridges: in-house production and external procurement. It is producing small quantities of organic bridges for evaluation on its own pilot line. Samsung Device Solutions R&D Japan (DSRJ), a research organization under Samsung Electronics' Samsung Advanced Institute of Technology (SAIT), is also producing samples. Samsung Electro-Mechanics is also evaluating the use of organic bridges manufactured by external partners and embedded into its FC-BGA substrates.
Samsung Electro-Mechanics is developing 2.1D package substrates incorporating organic bridges with multiple customers in addition to Qualcomm. The strategy is aimed at avoiding reliance on intellectual property (IP) associated with Intel's EMIB packaging. Intel developed EMIB to address the cost and manufacturing challenges of silicon interposers by placing small bridges only where high-density connections are required. The company began applying the technology to mass production in 2017 and has accumulated related IP. Several major technology companies are considering organic bridges as an alternative to silicon bridges.
Samsung Electro-Mechanics' 2.1D package substrate technology uses organic bridges with five to seven RDL circuit layers embedded in FC-BGA substrates. The company aims to reduce the line width and spacing of the organic bridge circuitry to 1.5 micrometers ($\mu\text{m}$) to 2 $\mu\text{m}$, while shrinking via sizes to 4 $\mu\text{m}$ to 5 $\mu\text{m}$. The target pattern density between dies is 500 to 1,000 connections per millimeter.
Collaboration with Samsung Electronics' foundry business is also drawing attention. After Samsung Electro-Mechanics manufactures FC-BGA substrates based on the organic bridge, Samsung Electronics' foundry is expected to evaluate package performance and reliability. Samsung Electronics' foundry is developing advanced packaging technologies including 2.3D Cube-E, which uses a silicon bridge, and 2.3D Cube-R, which is based on an organic RDL interposer. Samsung Electro-Mechanics' organic bridge substrate is expected to support an expansion of Samsung Electronics' foundry packaging services.