Siemens EDA 在 Semiconductor Engineering 发布 Calibre DE-Via 自动通孔插入白皮书，属常规技术营销内容

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Shift-Left DE-Via
Low Power-High Performance

WHITEPAPERS

Calibre-aware, short-resilient via insertion for signoff-ready physical design.
October 19th, 2026 -
By: Siemens EDA

Physical design teams face challenges with via resistance, electromigration and routing density. Calibre DesignEnhancer Via (DE-Via) automates the insertion of additional vias, ensuring DRC-clean layout modifications.
This shift-left methodology improves via robustness early in the design cycle, reducing late signoff iterations. DE-Via identifies short-prone regions, avoiding insertion in those areas to maintain productivity and visibility into unresolved issues.
What you’ll learn:
- How automated via insertion improves interconnect robustness
- The benefits of a shift-left methodology in physical design
- How DE-Via identifies and avoids short-prone regions
- The integration of DE-Via into existing design flows
- Practical benefits of short-resilient handling in via optimization
Who should read this:
- Physical design engineers
- CAD engineers
- Design implementation teams
- Anyone involved in advanced node physical design
To learn more, click here.
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