INTEKPLUS（064290.KS）获日本载板厂首台玻璃基板AOI检测订单（研发用、台数与金额未披露），消息日9/9、9/10连涨约+9%后9/11冲高回落，催化已被重定价

INTEKPLUS has won its first order for glass substrate inspection equipment from a Japanese customer, potentially expanding its substrate inspection business beyond flip-chip ball grid array (FC-BGA) substrates into glass substrates.
According to industry sources on Sept. 8, INTEKPLUS recently received an order from a major Japanese substrate maker for an automated optical inspection (AOI) system for glass substrate R&D. The equipment will be delivered in the second half of this year. The number of systems and the contract value were not disclosed. Given the outlook for the glass substrate market, the order could lead to longer-term business opportunities.
The equipment for Japan builds on INTEKPLUS’s existing substrate inspection technology, enhanced to accommodate the characteristics of glass substrates. Handling technology allows fragile glass to be transported and secured safely during inspection and is designed to work with the customer’s existing glass substrate handling solution. Inspection precision has also been improved to address increasingly fine circuit pitches as advanced packaging substrates become more highly integrated.
The system uses white light scanning interferometer (WSI) technology to measure the three-dimensional shape of glass substrates after plating and wiring processes. It inspects the height and shape of fine bumps, flatness and warpage. Surface defects such as cracks and chipping are detected through automated final visual inspection (AFVI). Precise inspection is particularly important as glass substrates become finer and larger, because even small variations in shape or defects can cause failures in subsequent processes.
INTEKPLUS also made an initial delivery of its next-generation FC-BGA inspection equipment to the same customer, along with an R&D-use panel three-dimensional (3D) inspection system. Both systems are designed for larger and finer substrates. Additional orders are expected as the customer increases production.
The customer is a Japanese semiconductor substrate manufacturer that produces FC-BGA substrates. It recently established a pilot line for advanced packaging and is developing technology to form redistribution layers (RDLs) and other structures on glass substrates or glass interposers after through-glass via (TGV) processing.
INTEKPLUS has conducted sample tests of glass substrates for major South Korean substrate makers and global customers. Using glass substrates produced by customers, the company verified the performance and applicability of its inspection equipment.
Existing INTEKPLUS substrate inspection equipment is also being used for glass substrate development. Two major South Korean substrate makers use existing INTEKPLUS systems at their research centers to inspect internally produced glass substrate samples. Because finished glass substrates have structures similar to FC-BGA substrates, existing 3D measurement and visual inspection technologies can be applied.
Demand is expected to expand from R&D systems to mass-production equipment once customers begin volume production of glass substrates. At the mass-production stage, throughput and handling of large substrates become important alongside inspection precision, increasing demand for new equipment. INTEKPLUS plans to expand sales of glass substrate inspection equipment, primarily to its existing FC-BGA customers.
“Japan is a market where customers have a strong preference for domestic equipment, making it difficult for foreign equipment suppliers to enter, but evaluations and initial deliveries of INTEKPLUS equipment have recently increased as substrates become larger,” an INTEKPLUS official said. “For glass substrates, we have already secured sufficient technology to perform inspections even with equipment previously supplied.”