LG Innotek二季度业绩大增但基本符合预期，并称正评估越南封装基板追加投资

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LG Innotek Posts Record First-Half Revenue on Strong Semiconductor Substrate Demand
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Company Reviews Additional Vietnam Investment Beyond Initial 1.5 Trillion-Won Substrate Plant
Selye Moon
Published 2026.07.27 22:13
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​LG Innotek's large-size FC-BGA and ultra-large-size FC-BGA semiconductor substrates. (Photo: LG Innotek)
LG Innotek posted first-half revenue exceeding 10 trillion won for the first time. Cumulative revenue for the first six months reached 11.0621 trillion won, while operating profit totaled 541.1 billion won, up 24.1% and 296.4% year over year, respectively. Demand for camera modules and semiconductor substrates remained solid even during the second quarter, which is typically the seasonal off-peak period for smartphones.
​LG Innotek said on July 27 that it recorded 5.5272 trillion won in revenue and 245.8 billion won in operating profit for the second quarter. Revenue rose 40.5% from a year earlier, while operating profit surged 2,057.3%. Compared with the previous quarter, revenue slipped 0.1% and operating profit declined 16.8%.
​Revenue from the Package Solution business reached 498.4 billion won, up 20% from a year earlier and 14% from the previous quarter. The segment accounted for about 9% of total revenue, up from approximately 7.9% in the first quarter. Growth was driven by expanded shipments of high-value semiconductor substrates, including radio frequency system-in-package (RF-SiP) and flip chip-chip scale package (FC-CSP) products. Shipments of flip chip-ball grid array (FC-BGA) substrates to global customers also increased.
​Despite the seasonal slowdown, demand for premium mobile camera modules remained resilient. The Optical Solution business generated 4.5179 trillion won in revenue, up 48% from a year earlier. Revenue, however, declined about 2% from the previous quarter's 4.6106 trillion won. Automotive camera sales also increased as supplies for new models at major customers expanded.
​The Mobility Solution business posted revenue of 510.9 billion won, up 10% year over year and about 5% from the previous quarter. Sales increased across the entire product portfolio, led by automotive lighting and communication modules.
​LG Innotek plans to expand its Package Solution business to increase the share of high-value-added products. The company has already decided to invest 1.5 trillion won to build its first semiconductor substrate manufacturing plant in Vietnam and is reviewing additional investments.
​Kyung Eun-kook, Chief Financial Officer and Executive Vice President of LG Innotek, said, "We have begun expanding our semiconductor substrate plant in Vietnam to meet rising demand driven by the semiconductor upcycle, and we are also reviewing additional investments. Along with expanding capital expenditures, we will foster the Package Solution business as one of the company's core businesses by leveraging differentiated technologies such as the Cu-post process and applying artificial intelligence-driven manufacturing transformation (AX) across production processes."
selyesel@thelec.kr
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