SKC子公司Absolics开始在台湾进行嵌入式玻璃基板封装级可靠性评估

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Absolics Begins Package-Level Evaluation of Embedded Glass Substrates in Taiwan
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Supply Chain
Company Successfully Produces ‘Good Die’ Samples Ahead of Mass Production Validation
Selye Moon
Published 2026.07.27 22:14
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Explanation of Absolics' embedded glass substrate technology.(Photo:Absolics)
SKC subsidiary Absolics is conducting package-level reliability evaluations of next-generation embedded glass substrates. The company has successfully produced "good die" samples that meet quality standards and aims to enter a proof-of-concept (PoC) phase with customers soon. The company is also working on non-embedding glass substrate projects with multiple global customers and expects to begin PoC activities within this year.
SKC said during its second-quarter earnings conference call on July 27 that "embedded glass substrate samples produced at the Georgia plant have been sent to Taiwan, where initial package-level reliability evaluations have begun." Package-level evaluation goes beyond testing the performance of individual glass substrates and verifies electrical characteristics, thermal durability, and mechanical reliability after applying the substrates to actual semiconductor packages. It is the final technology validation stage before mass production.
Previously, Absolics completed substrate-level internal reliability testing (Hammer Test) on embedded glass substrate samples produced at its Georgia plant, as well as preliminary electrical characteristic evaluations in Japan. The company then secured good die samples that met design specifications and quality standards and began initial package-level reliability evaluations in Taiwan. Good die refers to qualified products that meet designed performance and yield targets and are at a level suitable for mass production validation.
Absolics expects to secure reliability evaluation results as early as this year. The company is discussing with customers ways to quickly move into PoC after completing the evaluations.
The non-embedding glass substrate project, which began early this year, is also progressing through new development projects with multiple global customers. Some projects are scheduled to select suppliers in the second half of this year. Final selections are expected to be made within the year, followed by the start of PoC activities.
Absolics said, "In the second half of the year, we are preparing for initial reliability evaluations of embedded products and the launch of PoC for non-embedded products," adding, "We expect to confirm evaluation feedback as early as this year." The company also said, "We are continuing discussions with customers to accelerate entry into PoC following the initial reliability evaluation of embedded products."
Absolics is pursuing a dual-track strategy to develop both embedded and non-embedded products. Non-embedded products replace the organic material core used in existing flip-chip ball grid array (FC-BGA) substrates with glass. By utilizing glass's low warpage characteristics and high flatness, the technology can reduce substrate deformation and enable stable implementation of fine circuits.
Embedded products use a method of embedding passive components such as multilayer ceramic capacitors (MLCCs) inside glass substrates. The technology integrates functions previously performed by silicon interposers into the substrate. Using through-glass vias (TGVs) and fine circuits, the substrate directly handles signal transmission between chips. The technology is more difficult than non-embedded solutions. Absolics is pursuing mass production of embedded glass substrates for the first time in the world.
Of the 1.1647 trillion won raised through a recent rights offering, about 589.6 billion won will be invested in Absolics' glass substrate business. The company is discussing detailed execution plans with strategic partner Applied Materials.
As a first step, Absolics plans to execute 37.6 billion won in operating expenses (OPEX) from its 194.7 billion won investment plan for this year. The funds will be used for customer evaluations and certification responses, as well as manufacturing workforce operations. The company will then sequentially pursue equipment upgrades to improve production yield and quality.
Additional investments and large-scale expansion plans will be decided after reviewing customer evaluation results and demand. Absolics said, "We plan to execute investments at the appropriate time in line with customer evaluations and certification progress," adding, "Additional investments and large-scale expansion will also be pursued while monitoring customer demand."
selyesel@thelec.kr
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