JMCeco称因英伟达服务器电源半导体材料需求上升而扩建新厂

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JMCeco to Build New Fab on Rising Nvidia Demand
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Semiconductor
Company to Add About 100 Equipment Units, Begin Operations Next Year's Second Quarter
Lee Jun
Published 2026.07.27 22:14
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Photo: JMCeco.
JMCeco will expand its fab capacity in response to increasing demand for power semiconductor materials.
JMCeco announced on July 27 that it will build an additional fab with a total floor area of 2,178 pyeong on a site secured in advance, with construction starting at the end of this year. Mass production is scheduled to begin in the second quarter of next year.
As of last year, JMCeco owned land in Gijang, Busan, measuring about 1,553 pyeong for its headquarters and 65 pyeong for its dormitory. The company recently secured a new site of about 1,000 pyeong next to its headquarters, where its existing fab is located.
The total area of the newly built fab will be about 83% of the existing fab, which consists of four floors and covers about 2,627 pyeong.
JMCeco will also add about 100 equipment units required for mass production to the new fab and existing fab. Including about 30 equipment units currently installed at the existing fab, the company will have secured about 130 equipment units in total.
The time required to bring the new fab into operation is expected to take up to six months. This is faster than semiconductor manufacturing fabs, which typically require more than two years. This is because the materials supplied by JMCeco do not require the same level of cleanliness as semiconductor manufacturing processes.
JMCeco supplies welding materials for server power semiconductors to Texas Instruments (TI) and Renesas Electronics. The end customer is Nvidia. Customers have provided JMCeco with next year's estimated material demand of up to 100 billion won.
Welding materials are heat-dissipation materials. They are used to bond semiconductor chips and copper plates through ultrasonic methods. The process uses microscopic heat generated by ultrasonic waves to join chips and copper plates, minimizing damage to heat-sensitive semiconductors.
Nvidia is considering ways to increase power switching speeds in servers to 800 volts using next-generation power semiconductors based on silicon carbide (SiC) and gallium nitride (GaN). Silicon carbide and gallium nitride are materials capable of operating in high-voltage environments. They can deliver high efficiency and fast switching characteristics in data centers where currents ranging from thousands to tens of thousands of volts (V) flow.
As a result, power semiconductor companies expect their revenue mix to shift from being concentrated in mobile applications toward servers and other markets. Recently, TI said its second-quarter revenue from data center applications doubled from a year earlier.
Chips manufactured using JMCeco's materials are used in power modules that provide stable supplies of high-voltage current. A single module can contain up to 280 chips.
JMCeco CEO Choi Yoon-hwa said, "As demand for power semiconductors expands, sales in the first half of this year have approached the company's full-year revenue from last year."
2jun0504@thelec.kr
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