大德电子洽谈AI相关半导体基板长期供货协议，并推进超过8500亿韩元扩产

Daeduck Electronics is negotiating long-term supply agreements (LTAs) with multiple global technology companies as customer demand for additional semiconductor substrate capacity continues to rise. The company expects the agreements to be finalized by the end of the year.
Daeduck Electronics said on July 22 that it is in discussions with several global technology companies on LTAs covering flip chip ball grid array (FC-BGA), flip chip chip scale package (FC-CSP) and memory substrates.
"We are in negotiations to conclude LTAs, and discussions are largely in the final stages," a Daeduck Electronics official said. "Customers are requesting both long-term supply agreements and capacity expansion backed by advance payments. We are reviewing the production volumes we can support based on our manufacturing capacity and investment plans." The company added that it is discussing multiple product categories simultaneously with some customers but is being selective because demand exceeds its available production capacity.
An LTA is a multi-year agreement under which customers commit to purchasing specified volumes over several years. The contracts typically establish purchase quantities and supply terms in advance through memorandums of understanding or definitive agreements. Such arrangements allow customers to secure stable supplies while enabling substrate manufacturers to expand production with greater demand visibility.
The use of customer advance payments to finance facility investments is also becoming more common. Under this model, customers provide a portion of future purchase payments upfront to help suppliers accelerate capacity expansion. Substrate manufacturers invest the funds in new production lines and gradually offset the advance payments through product shipments, reducing the financial burden associated with large-scale capital expenditures.
Daeduck Electronics is pursuing a major capacity expansion using both customer advance payments and its own financial resources. On July 20, the company announced a 497 billion won investment in manufacturing facilities. It also agreed to acquire Newflex's Ansan plant for 52.8 billion won to secure additional production space for future expansion. Including a previously announced 213 billion won investment in a new FC-CSP plant in May and the revival of a previously postponed 90 billion won to 100 billion won FC-BGA investment announced in 2022, Daeduck Electronics' total investment plan exceeds 850 billion won. The company expects to complete the investments by the end of 2027.
The newly announced 497 billion won investment will be directed toward high-value semiconductor substrate production, including FC-BGA, FC-CSP and memory substrates, excluding conventional multilayer boards (MLBs). At its B2 Center in Ansan, Daeduck Electronics will install additional FC-BGA production equipment. The facility currently houses four FC-BGA production buildings, and the company plans to utilize approximately 70% of the available space in one newly constructed building while continuing maintenance of existing production lines. At its B1 Center in Siheung, Daeduck Electronics is adding a third FC-CSP production building to its existing two-building complex. Part of the new investment will be allocated to equipment installation at the facility. The new FC-BGA production line is scheduled to begin operations in the second quarter of 2027, followed by the FC-CSP line in the third quarter.
The company's product portfolio has also shifted toward higher-value AI-related applications. Since the fourth quarter of 2025, FC-BGA products have expanded beyond automotive applications to include AI server controllers, networking equipment and optical modules. FC-CSP products are also becoming increasingly focused on controllers and automotive applications rather than smartphones. Its multilayer boards are primarily supplied for satellite communications and aerospace applications.
The trend toward customer-backed investment through LTAs is spreading beyond large corporations to mid-sized substrate manufacturers. Samsung Electro-Mechanics is expanding FC-BGA production at its Sejong facility and investing 1.8 trillion won in Vietnam at the request of North American technology customers. LG Innotek is also in discussions with multiple customers regarding FC-BGA capacity expansion at its Gumi and Vietnam facilities.
"As AI demand continues to drive shortages in semiconductor substrates, capacity expansion based on long-term supply agreements is becoming increasingly common," an industry official said. "In the past, substrate makers expanded capacity based on their own demand forecasts. Now, customers are initiating the investment requests. This represents a significant shift for an industry that has traditionally operated on a build-to-order basis."