韩国태성（Taesung）在 KPCA Show 2026 展出 2.0mm 厚玻璃芯基板实物样品并演示 TGV 蚀刻/清洗与自下而上电镀工艺，仅称正与韩海内外客户洽谈量产设备应用

Taesung said Sept. 14 that it has unveiled a physical sample of a 2.0-millimeter-thick (2T) glass core substrate.
The substrate features through-glass via (TGV) technology implemented in a glass substrate. The physical sample was displayed at Taesung’s booth at the KPCA Show 2026, the International Semiconductor Substrate & Advanced Packaging Industry Exhibition.
Taesung said it was “not simply presenting a technology development plan or possibility, but showcasing an actual product,” adding that it had demonstrated process technology capable of handling high-thickness glass substrates.
The industry has recently been developing and evaluating 2T-class glass substrates in response to customer requirements. Taesung has implemented TGV on a 2T glass substrate in response to the market shift. The company has established key process equipment technologies required for glass substrate manufacturing, including TGV etching and cleaning, as well as bottom-up plating. The equipment was also introduced at the company’s booth at the KPCA Show.
The TGV process involves creating microscopic holes in a glass substrate to form interconnects that carry electrical signals between chips and the substrate. Etching cuts and shapes the holes, while cleaning removes contaminants. Plating deposits metal to enable electrical conductivity. Bottom-up plating grows copper from the bottom of the TGV holes, helping reduce the formation of voids even at high aspect ratios.
As glass substrates become thicker, the difficulty of TGV processing increases. The greater depth of the passages through the substrate makes the material more susceptible to cracking and deformation during processing. The importance of equipment and process technologies that can control these issues and reliably form TGVs is therefore increasing.
Taesung said, “Withందాthe expansion of the artificial intelligence (AI) semiconductor and high-performance computing (HPC) markets, the importance of process technologies capable of handling thick glass substrates is growing.” The company added that it is discussing the mass-production application of glass substrate equipment with customers in Korea and overseas and will strengthen its technological competitiveness to meet customer specifications.