Cadence 与 Notre Dame 研究者发表 3D-IC 热建模 AI 求解器（DAIST）学术论文，属技术研究而非商业产品事件

Researchers at Cadence Design Systems and the University of Notre Dame published “A Composable AI-Accelerated Iterative Solver for 3D-IC Thermal Modeling.”
Abstract:
“Accurate thermal analysis of heterogeneous 2.5D/3D-IC packages is essential yet computationally prohibitive. A single full-package FEM simulation can take hours, while AI-based surrogates treat the entire stack as a monolithic prediction target and must be retrained whenever the die count or topology changes. To address this limitation, this work proposes Domain-Decomposed AI-Accelerated Iterative Solver for Thermal Analysis (DAIST), a composable thermal solver that decomposes the global package simulation into block-level subdomain problems, replaces subdomain solvers with neural operators, and couples them through iterative exchanges of interfacial temperature and heat flux. This local-to-global architecture eliminates the topology lock-in of monolithic models: block-level neural operators can be directly reused in unseen package assemblies without retraining. The iterative coupling strategy further provides a controllable accuracy-runtime tradeoff, where the iteration budget can be adjusted to trade accuracy for runtime. Evaluated on a multi-chiplet system and an advanced packaging system, DAIST achieves up to 178× speedup over traditional FEM solvers with mean temperature errors of 0.068% and 0.323%, respectively, while demonstrating cross-topology reuse of block-level models across structurally distinct package assemblies.”
Find the technical paper here. October 2026
Li, Yixing, Jiahang Zhou, Zhiyu Zeng, and Xin Ai. “A Composable AI-Accelerated Iterative Solver for 3D-IC Thermal Modeling.” arXiv preprint arXiv:2610.02461 (2026).