📰 BloombergBloombergCodex · 实盘可交易 · 做多市场:韩股▼ 亏 -8.30% · 已结算 · 2 腿均把握 6/10🔁 +2 同一事件
北京时间·🕒 发布 19:00:00时区推断·⟳ 抓取 19:16:05·⚡ 决策 07-24 19:20:42 +4m37s·95.2 天前
三星电子和SK海力士据称将在总统访美期间与美国科技公司公布大额存储芯片供货与AI合作协议
彭博援引韩国总统办公室称，两家公司将公布涉及“very large”金额的长期存储芯片供货、战略投资和MOU，且美国科技公司贡献底层订单的80%至90%。
📄 原文Bloomberg↗ 原文
Samsung Electronics Co.and SK Hynix Inc. are set to unveil major agreements involving “very large” sums with leading US…
▼ 亏 -8.89%入场 07-27 开盘 @1,813,607 → 离场 07-28 开盘 @1,661,640
日 K 取自复盘打分切片 · 蓝点/蓝虚线 = 纸面入场价 · 灰虚线 = 纸面离场 · 持有期红底 = 赚(价格在入场线上方)、绿底 = 亏
💡 交易逻辑美AI客户大额长协预告，收盘后新增催化
怎么买 限价买入 不高于 1812000、仅下一个交易日，不成交作废
怎么卖 止盈 +5%(半仓)/+10%(清仓) · 止损 -5% · 时间止损 3日
▼ 亏 -7.71%入场 07-27 开盘 @257,000 → 离场 07-28 开盘 @238,500
日 K 取自复盘打分切片 · 蓝点/蓝虚线 = 纸面入场价 · 灰虚线 = 纸面离场 · 持有期红底 = 赚(价格在入场线上方)、绿底 = 亏
💡 交易逻辑大额存储协议预告，低位补反应窗口
怎么买 限价买入 不高于 257000、仅下一个交易日，不成交作废
怎么卖 止盈 +4%(半仓)/+8%(清仓) · 止损 -4% · 时间止损 3日
展开详情(成交明细 / 研究档案 / 原文全文 / 决策记录链)
分时走势
做多 000660.KS SK海力士
建仓日早于近 30 天,只有日线图
做多 005930.KS 三星电子
建仓日早于近 30 天,只有日线图
成交明细 · 纸面
做多 000660.KS SK海力士
| 收益状态 | -8.89% 已平仓 |
|---|---|
| 进场成交 | 2026-07-27 · 开盘 · @1.81361e+06 |
| 离场成交 | 2026-07-28 · 开盘 · @1.66164e+06 |
| 毛收益 | -8.38% |
| 成本 | +0.51% |
| 净收益 | -8.89% |
| 计入收益 | -8.89% |
| 建仓日 | 2026-07-27 · 进场不早于新闻时刻 + 2 分钟 |
做多 005930.KS 三星电子
| 收益状态 | -7.71% 已平仓 |
|---|---|
| 进场成交 | 2026-07-27 · 开盘 · @257000 |
| 离场成交 | 2026-07-28 · 开盘 · @238500 |
| 毛收益 | -7.20% |
| 成本 | +0.51% |
| 净收益 | -7.71% |
| 计入收益 | -7.71% |
| 建仓日 | 2026-07-27 · 进场不早于新闻时刻 + 2 分钟 |
收益口径 event_time_plus_2min_10min_walk_open_topup_to_next_open_exchange_calendar_fill_model_local_notional_v9 · method_id m8db1cbc8f2d · 截至 2026-10-28 00:38
研究档案
🔎 新鲜度:最早出现 2026-07-24 · 扩散 medium · price-in 风险 medium ↗
消息传播链
- 彭博报道称韩国总统办公室预告三星电子和SK海力士将与美国头部科技公司公布大额存储芯片供货和AI合作协议。市场反应:事件发生时韩股已收盘，005930.KS和000660.KS无法连续成交。
- 2026-07-24 20:16 KS市场反应stock_quote非一手行情显示005930.KS当日收跌7.59%、000660.KS当日收跌8.34%，该跌幅发生在彭博消息前的韩股交易时段。市场反应:消息未进入韩股当天连续交易价格，下一交易日存在补反应窗口。
关键理由
- 彭博援引韩国总统办公室称，两家公司将公布涉及“very large”金额的长期存储芯片供货、战略投资和MOU，且美国科技公司贡献底层订单的80%至90%。
- SK海力士（000660.KS）对HBM/AI存储敞口更纯，内部KB显示HBM已成为2026-2027年AI硬件并行瓶颈，长协有助于锁定高景气订单。
- 两股7月24日韩股盘中大跌后消息才在收盘后释放，当前催化未进入当天韩股收盘价，但具体金额和客户名单仍未落地，仓位需控制。
主要风险
- 目前仍是总统官员预告，未披露具体金额、客户、供货期限和可确认收入，若正式公告低于“very large”预期或仅为MOU，容易高开回落。
- 三星电子（005930.KS）业务盘子大、存储敞口被手机/代工等多业务摊薄，短线弹性弱于SK海力士。
反向证据
- 做多前查反向 · 来源 kb_search · 日期 2026-07-24 · 影响 weakens
KB命中显示AWS专家交流称存储/HBM长协和预付款已是行业趋势，利好供货确定性但也说明部分长协预期已被机构讨论。
检索:SK Hynix Samsung HBM demand US customers 80% 90% orders AI data center July 2026 risks CXMT memory cycle 原文 ↗ - 做多前查反向 · 来源 kb_search · 日期 2026-07-14 · 影响 weakens
KB命中SK海力士美国上市和HBM扩产讨论，说明公司扩产融资和HBM景气并非全新叙事，但本次具体美国客户协议仍是新增催化。
检索:Samsung SK Hynix US tech companies long-term memory supply deals very large sums July 2026 原文 ↗ - 做多前查反向 · 来源 query_modeling_kb · 日期 2026-03-12 · 影响 supports
定量KB显示HBM/DRAM是2026-2027年AI硬件并行约束之一，支持存储厂供货长协的基本面方向。
检索:Samsung Electronics HBM Nvidia memory supply revenue share AI DRAM NAND
历史先例(按相似度)
- 相似度 9/10 MU 2026-06-25 Micron财报夜披露16份多年take-or-pay战略客户协议,约1000亿美元最低收入承诺和220亿美元现金/信用支持;事件日已大幅高开,随后+1/-3/-5日转弱。 原文 ↗
事件后 +1日 -6.7% · +2日 -5.6% · +3日 -4.9% · +4日 -14.9% · +5日 -19.6%
相似度依据:同为存储厂商披露AI客户多年take-or-pay长协,事件机制最接近;但市场不同且为财报同日催化。 - 相似度 7/10 NBIS 2026-03-16 Nebius与Meta签五年AI基础设施供应协议,120亿美元专用容量并可扩至约270亿美元;公告后+1/+3/+5日均下跌。 原文 ↗
事件后 +1日 -10.4% · +2日 -8.7% · +3日 -6.4% · +4日 -9.4% · +5日 -12.1%
相似度依据:同为美国超大科技客户锁定AI基础设施长期供应,金额量级大;但标的不是芯片/存储供应商。 - 相似度 7/10 GLW 2026-05-06 Corning获NVIDIA约5亿美元AI数据中心光连接战略供应协议并伴随股权/认股权安排;事件日高开后仍在+3/+5日延续上涨。 原文 ↗
事件后 +1日 +0.5% · +2日 +3.0% · +3日 +14.2% · +4日 +9.2% · +5日 +13.7%
相似度依据:同为NVIDIA锁定AI数据中心关键瓶颈部件供应,客户质量和AI资本开支机制相似;但非存储且金额小于本次预期。 - 相似度 6/10 TSM 2026-02-25 AMD与Meta重大AI芯片供应协议报道后,TSMC因先进AI芯片制造敞口受益;事件后+1/+3/+5日下跌,显示外溢类催化易被市场回吐。 原文 ↗
事件后 +1日 -2.8% · +2日 -3.4% · +3日 -4.8% · +4日 -8.9% · +5日 -7.8%
相似度依据:同为美国AI大客户需求确认外溢到核心半导体供应商;但TSM只是供应链受益方,不是协议直接签约标的。 - 相似度 5/10 TSM 2026-05-27 NVIDIA CEO称拟每年在台湾投入约1500亿美元并扩建台北总部,市场交易TSMC持续订单/产能利用受益;事件后+3/+5日小幅正收益。 原文 ↗
事件后 +1日 +0.5% · +2日 -1.0% · +3日 +3.0% · +4日 +5.7% · +5日 +3.3%
相似度依据:同为NVIDIA长期AI产能/采购意向带动半导体核心供应商;但不是明确供货合同,相位弱于当前事件。 - 相似度 5/10 MU 2026-07-23 Alphabet上调AI capex后存储同业受益，反映超大云厂需求确认对存储链方向偏正面。 原文 ↗
event_study仅取得MU.US事件日OHLC，缺少完整+1/+3/+5日窗口，不能作为幅度校准。
相似度依据:同属AI数据中心存储需求确认，但测的是美股同业Micron且事件为Alphabet capex确认，不是韩国本股供货公告。 - 相似度 4/10 9888 2026-06-29 Baidu因AI芯片子公司昆仑芯拟赴港IPO且潜在投资者需承诺采购半导体产品而上涨;事件后+1/+3/+5日均为正。 原文 ↗
事件后 +1日 +5.1% · +2日 +5.5% · +3日 +6.3% · +4日 +5.9% · +5日 +6.0%
相似度依据:同属AI芯片商业订单/采购承诺验证,但测的是母公司百度且不是存储供应商,可交易性和机制较远。
工具调用 · 历史记录,结果未知(6 种)
- search_processed_events · 结果未知
- stock_quote · 结果未知
- price_snapshot · 结果未知
- query_modeling_kb · 结果未知
- kb_search · 结果未知
- event_study · 结果未知
原文全文
展开原文 · 2,564 字
Samsung Electronics Co.and SK Hynix Inc. are set to unveil major agreements involving “very large” sums with leading US technology companies during President Lee Jae Myung’s visit to Silicon Valley, a senior presidential official said.
The announcements would likely include new long-term memory chip supply deals, strategic investment partnerships and memorandums of understanding, presidential policy chief Kim Yong-beom told reporters Thursday. He declined to disclose the value of the deals ahead of company announcements.
Kim said the presidential visit acted as a “catalyst,” helping wrap up long-running negotiations between Korean companies and their US counterparts.
Lee begins the overseas trip in San Francisco on Friday, where he is set to join an AI summit and hold separate meetings with Nvidia Corp.’s Jensen Huang, OpenAI’s Sam Altman, Anthropic PBC’s Dario Amodei and Broadcom Inc.’s Hock Tan.
The AI summit will also bring together Samsung Electronics Executive Chairman Jay Y. Lee, SK Group Chairman Chey Tae-won, Hyundai Motor Co. Executive Chair Euisun Chung and Naver Corp. founder Lee Hae-jin.
Last month, Seoul unveiled an investment plan worth at least $880 billion, backed by Samsung Electronics, SK Group and Naver, to expand chip production, build AI data centers and strengthen its leadership in semiconductors and physical AI.
Kim said the trip is expected to turn much last month’s planned investment into concrete projects. More than half of the government’s planned roughly 8 gigawatts of first-phase AI data-center capacity is expected to take shape during the visit. Unlike the earlier announcement, which reflected initial investment intentions, the new projects will identify specific customers, sites and Korean engineering partners.
Earlier this month, Commerce Secretary Howard Lutnick urged Samsung and SK Hynix to expand memory-chip production in the US. Kim said it was natural for a US commerce secretary to encourage companies to expand domestic manufacturing but there were no formal requests by Washington to make additional semiconductor investments in the US.
Kim added that the latest expansion plans at home are being driven by strong demand from American technology companies, which account for 80% to 90% of the underlying orders.
At the Silicon Valley AI summit, Lee is expected to deliver what the presidential office described as a “San Francisco AI Declaration,” outlining South Korea’s ambition to become a dependable supplier of AI infrastructure while expanding the use of AI across its economy.
The announcements would likely include new long-term memory chip supply deals, strategic investment partnerships and memorandums of understanding, presidential policy chief Kim Yong-beom told reporters Thursday. He declined to disclose the value of the deals ahead of company announcements.
Kim said the presidential visit acted as a “catalyst,” helping wrap up long-running negotiations between Korean companies and their US counterparts.
Lee begins the overseas trip in San Francisco on Friday, where he is set to join an AI summit and hold separate meetings with Nvidia Corp.’s Jensen Huang, OpenAI’s Sam Altman, Anthropic PBC’s Dario Amodei and Broadcom Inc.’s Hock Tan.
The AI summit will also bring together Samsung Electronics Executive Chairman Jay Y. Lee, SK Group Chairman Chey Tae-won, Hyundai Motor Co. Executive Chair Euisun Chung and Naver Corp. founder Lee Hae-jin.
Last month, Seoul unveiled an investment plan worth at least $880 billion, backed by Samsung Electronics, SK Group and Naver, to expand chip production, build AI data centers and strengthen its leadership in semiconductors and physical AI.
Kim said the trip is expected to turn much last month’s planned investment into concrete projects. More than half of the government’s planned roughly 8 gigawatts of first-phase AI data-center capacity is expected to take shape during the visit. Unlike the earlier announcement, which reflected initial investment intentions, the new projects will identify specific customers, sites and Korean engineering partners.
Earlier this month, Commerce Secretary Howard Lutnick urged Samsung and SK Hynix to expand memory-chip production in the US. Kim said it was natural for a US commerce secretary to encourage companies to expand domestic manufacturing but there were no formal requests by Washington to make additional semiconductor investments in the US.
Kim added that the latest expansion plans at home are being driven by strong demand from American technology companies, which account for 80% to 90% of the underlying orders.
At the Silicon Valley AI summit, Lee is expected to deliver what the presidential office described as a “San Francisco AI Declaration,” outlining South Korea’s ambition to become a dependable supplier of AI infrastructure while expanding the use of AI across its economy.
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