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The Elec EnglishCodex · 实盘可交易 · 做多市场:韩股▲ 赚 +1.40% · 已结算把握 6/10
北京时间·🕒 发布 17:42:42时区推断·⟳ 抓取 17:45:27·⚡ 决策 07-24 17:51:25 +5m58s·95.0 天前

TEMC CNS恢复向SK海力士供应TiCl4半导体前驱体

The Elec称TEMC CNS已在7月23日从报恩2厂向SK海力士DRAM线恢复TiCl4商业出货,且较原计划提前约两个月。

📄 原文The Elec English↗ 原文
TEMC CNS Resumes SK hynix Semiconductor Materials Shipments After Fire Recovery
이전 기사보기 다음 기사보기 TEMC CNS Resumes SK hynix Semiconductor Materials Shipments After Fire Recovery Character Size Settings…
ENTER▲ 做多TEMC CNS241790.KS🇰🇷小仓
▲ 赚 +1.40%入场 07-27 开盘 @4,625 → 离场 07-28 开盘 @4,715
4,0005,0004,625做多 07-27离场 07-2807-0208-12
日 K 取自复盘打分切片 · 蓝点/蓝虚线 = 纸面入场价 · 灰虚线 = 纸面离场 · 持有期红底 = 赚(价格在入场线上方)、绿底 = 亏
💡 交易逻辑SK海力士供货恢复且年内放量,盘后新鲜
怎么买 限价买入 不高于昨收 +5%、仅下一个交易日,不成交作废
怎么卖 止盈 +8%(半仓)/+16%(清仓) · 止损 -7% · 时间止损 5日
不做 SK海力士(000660.KS)
客户侧只是材料供应稳定,未形成相对SK海力士市值可量化的短线增量,不做。
不做 Soulbrain(357780.KS)
可能失去临时替代份额但金额和持续性未披露,且未核到可借券,负面不足以做空。
展开详情(成交明细 / 研究档案 / 原文全文 / 决策记录链)

分时走势

做多 241790.KS TEMC CNS

建仓日早于近 30 天,只有日线图

成交明细 · 纸面

做多 241790.KS TEMC CNS

收益状态+1.40% 已平仓
进场成交2026-07-27 · 开盘 · @4625 · 成交 2%
离场成交2026-07-28 · 开盘 · @4715
毛收益+1.95%
成本+0.55%
净收益+1.40%
计入收益+0.03%
建仓日2026-07-27 · 进场不早于新闻时刻 + 2 分钟

收益口径 event_time_plus_2min_10min_walk_open_topup_to_next_open_exchange_calendar_fill_model_local_notional_v9 · method_id m8db1cbc8f2d · 截至 2026-10-27 17:56

研究档案

🔎 新鲜度:最早出现 2026-07-24 · 扩散 low · price-in 风险 medium ↗

消息传播链

  1. 2025-09-06其它The Elec非一手原文 ↗
    TEMC CNS安城1厂火灾摧毁TiCl4和HCDS生产设施,形成后续供货中断的基线。
  2. 2026-07-23官方确认/否认TEMC CNS经The Elec报道引述非一手原文 ↗
    公司举行报恩2厂TiCl4首批商业出货仪式,产品供应至SK海力士DRAM产线。
  3. 2026-07-24 18:42 KST首发The Elec English非一手原文 ↗
    产业媒体披露恢复商业供货、年底恢复火灾前供货量及明年新增需求,属于盘后新信息。
    市场反应:TEMC CNS当日收盘4620韩元,日跌3.25%,消息发布在韩股收盘后。

关键理由

  • The Elec称TEMC CNS已在7月23日从报恩2厂向SK海力士DRAM线恢复TiCl4商业出货,且较原计划提前约两个月。
  • 火灾前公司对SK海力士TiCl4年供货约100亿韩元,新产线产能接近翻倍,并预计今年底恢复至火灾前水平、明年因M15X和龙仁产线带来额外需求。
  • 按行情工具返回市值约3126万韩元口径看,100亿韩元年供货相对市值口径极大;即使市值字段存在口径误差,该订单恢复对小市值材料股仍是直接经营修复催化。

主要风险

  • 该消息来自产业媒体而非交易所公告,且公司去年12月已获设备审批、今年1月试产、6月样品出货,部分恢复预期可能已被市场知道。
  • TEMC CNS近13周股价路径持续下行且7月24日收跌3.25%,若开盘跳高后承接弱,容易演变为修复兑现而非趋势反转。

反向证据

  • 做多前查反向 · 来源 kb_search · 日期 2026-07-24 · 影响 none
    内部KB未命中TEMC CNS本身的直接负面或客户重新认证失败信息,命中内容主要与SK海力士其他AI/HBM扩产叙事相关。
    检索:TEMC CNS 241790 recent risks fire customer qualification SK hynix supplier Merck Soulbrain
  • 做多前查反向 · 来源 kb_search · 影响 weakens
    韩文关键词未命中内部KB,不能证明旧闻已广泛传播,但也说明缺少收入占比的一手量化验证。
    检索:티이엠씨씨엔에스 SK하이닉스 TiCl4 HCDS 매출 비중 화재 공급 재개
  • 做空前查反向 · 来源 web · 日期 2026-07-24 · 影响 none
    The Elec仅说明Soulbrain曾在供货中断期间填补缺口,未披露Soulbrain失去订单金额或利润影响,负面不足以开空。
    检索:Soulbrain TEMC CNS TiCl4 supply gap SK hynix Merck replacement 原文 ↗

历史先例(按相似度)

  • 相似度 8/10 WOLF 2023-07-05 Wolfspeed与Renesas签10年SiC晶圆供货协议,并获20亿美元保证金,规模和客户质量强。 原文 ↗
    事件后 +1日 -6.5% · +2日 +1.0% · +3日 +2.6% · +4日 +2.7% · +5日 +3.6%
    相似度依据:同为半导体材料供货协议且由产能放量/长期客户绑定驱动,但品类为SiC晶圆、客户不是SK海力士。
  • 相似度 7/10 COHR 2023-10-10 Coherent宣布Denso和Mitsubishi Electric向其SiC业务投资10亿美元并签长期基板/外延晶圆供货协议。 原文 ↗
    事件后 +1日 +5.2% · +2日 +2.8% · +3日 -1.0% · +4日 +2.7% · +5日 +2.8%
    相似度依据:半导体材料长期供货叠加战略投资,机制相似但不是存储前驱体且含股权投资因素。
  • 相似度 7/10 ACLS 2020-04-28 Axcelis获领先存储制造商Purion Dragon高电流注入机订单,此前通过评估并用于NAND量产。 原文 ↗
    事件后 +1日 +5.7% · +2日 -4.4% · +3日 -8.0% · +4日 -8.4% · +5日 -6.9%
    相似度依据:明确面向存储制造客户的半导体设备订单,客户链条更接近SK海力士,但不是材料供货恢复。
  • 相似度 6/10 ACMR 2021-12-01 ACM Research获一家美国大型全球半导体制造商两台SAPS清洗设备订单,含评估和生产工具。 原文 ↗
    事件后 +1日 -3.3% · +2日 -6.7% · +3日 -9.3% · +4日 -7.4% · +5日 -5.5%
    相似度依据:半导体制造大客户采购订单,同属客户导入/放量逻辑,但为清洗设备且客户未具名。
  • 相似度 6/10 ACMR 2023-02-24 ACM Research获一家欧洲大型全球半导体制造商首台SAPS-V清洗工具采购订单。 原文 ↗
    事件后 +1日 -9.0% · +2日 -10.0% · +3日 -8.5% · +4日 -11.2% · +5日 -7.3%
    相似度依据:全球半导体制造商首单导入,同为供应资格/客户突破,但规模未披露且设备属性更强。
  • 相似度 6/10 AEHR 2023-03-21 Aehr获第二家主要SiC半导体客户WaferPak全晶圆接触器量产订单。 原文 ↗
    事件后 +1日 -1.1% · +2日 +7.5% · +3日 +3.2% · +4日 +2.3% · +5日 -4.2%
    相似度依据:量产客户订单和半导体制造放量逻辑相似,但为SiC测试耗材/设备且客户不是存储厂。
  • 相似度 6/10 AEHR 2026-04-16 Aehr获主要hyperscale AI客户4100万美元跟单,为公司史上最大订单。 原文 ↗
    事件后 +1日 +3.7% · +2日 +11.5% · +3日 +15.9% · +4日 +20.4% · +5日 +18.1%
    相似度依据:大额跟单和年内放量叙事相似,但客户为AI/hyperscale链条且金额收入占比高于当前事件可比口径。
  • 相似度 6/10 VECO 2026-05-05 Veeco宣布获得超过2.5亿美元InP激光制造设备订单,用于AI数据中心相关光互连链条。 原文 ↗
    事件后 +1日 +25.2% · +2日 +16.5% · +3日 +19.9% · +4日 +23.6% · +5日 +24.1%
    相似度依据:半导体设备大单且金额/市值量级显著,但为多客户InP激光设备订单,不是单一存储材料供货恢复。
  • 相似度 5/10 ACLS 2023-01-19 Axcelis宣布Purion Power Series在全球SiC芯片制造商中的多个新客户突破和跟单出货。 原文 ↗
    事件后 +1日 +4.2% · +2日 +9.2% · +3日 +9.9% · +4日 +12.6% · +5日 +15.8%
    相似度依据:半导体设备订单/客户渗透逻辑相似,但客户分散、品类为SiC功率器件设备。
  • 相似度 5/10 ACLS 2021-07-21 Axcelis向中国新客户交付首台Purion EXE SiC高能注入机,并向亚洲/欧洲SiC厂商跟单出货。 原文 ↗
    事件后 +1日 -0.1% · +2日 +0.3% · +3日 -0.7% · +4日 -4.5% · +5日 -0.3%
    相似度依据:亚洲/中国SiC客户出货和跟单逻辑相似,但不是存储链且没有明确SK海力士交易对手。
工具调用 · 历史记录,结果未知(4 种)
  • search_processed_events · 结果未知
  • stock_quote · 结果未知
  • kb_search · 结果未知
  • validate_order · 结果未知

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TEMC CNS Resumes SK hynix Semiconductor Materials Shipments After Fire Recovery
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스크롤 이동 상태바
Supply Chain
Company begins commercial deliveries of TiCl₄ from Boeun plant, targeting full supply recovery by year-end
Selye Moon
Published 2026.07.24 18:42
Reply 0
이 기사를 공유합니다
A forklift loads TiCl₄ onto a delivery truck at TEMC CNS's Boeun Plant 2 in North Chungcheong Province on July 23. (Photo: THE ELEC)
TEMC CNS has resumed shipments of titanium tetrachloride (TiCl₄), a semiconductor precursor used in thin-film deposition, to SK hynix, about 10 months after a fire halted production at its Anseong plant. The company has officially declared a return to normal operations with the first commercial shipment from its new production base in Boeun, North Chungcheong Province.
TEMC CNS held a ceremony on July 23 to mark the first commercial shipment of TiCl₄ from its Boeun Plant 2. About 40 employees, including CEO Lee Dong-jun, Ko Sung-jong, head of Manufacturing Technology, and Koo Ja-kwon, director of Manufacturing Technology, attended the event, which featured a ribbon-cutting ceremony and the departure of the first delivery truck. The products shipped that day will be supplied to SK hynix's D램 production lines.
"Following the fire at our Anseong plant in September 2025, we have established a new production system and resumed supplying products to our customer," Lee said. "This marks a meaningful new beginning for the company's growth, built on our new manufacturing foundation."
Ko said, "When the fire occurred in 2025, the future looked uncertain, but every employee came together to make this resumption possible. It is a meaningful moment that demonstrates the company's resilience in overcoming adversity."
TEMC CNS executives and employees, including CEO Lee Dong-jun, Manufacturing Technology Head Ko Sung-jong and Manufacturing Technology Director Koo Ja-kwon. (Photo: THE ELEC)
TEMC CNS completed installation of TiCl₄ production equipment and obtained regulatory approvals for Boeun Plant 2 in December 2025. It began trial operations in January and spent approximately six months completing customer qualification and production line validation. Sample shipments began in June, while the first commercial shipment on July 23 marked the start of full-scale production.
The company plans to restore TiCl₄ shipments to pre-fire levels by the end of this year. Before the fire, TEMC CNS supplied approximately 10 billion won worth of TiCl₄ annually to SK hynix. Demand for TiCl₄ and other semiconductor precursors is expected to increase as SK hynix ramps up new D램 production lines, including M15X in Cheongju and the first fab at its Yongin semiconductor cluster. Additional demand exceeding previous supply volumes is expected beginning next year.
TEMC CNS has also restored production of hexachlorodisilane (HCDS), another precursor whose production was halted by the same fire, after relocating the production line to Boeun Plant 2. Shipments to overseas customers, including those in China, began in May, while major customers are currently conducting final production line qualification. The company expects to complete the evaluation process and resume mass production of HCDS later this year.
TEMC CNS executives participate in a ribbon-cutting ceremony to commemorate the first commercial shipment of TiCl₄. (Photo: THE ELEC)
The resumption of production came about two months earlier than initially expected after the company accelerated consolidation of manufacturing operations at its Boeun facility. Prior to the fire, TEMC CNS had planned to relocate precursor production from Anseong to Boeun Plant 2 by the second half of 2027 to improve manufacturing efficiency and prepare for customers' new production lines. Boeun Plant 2 had previously manufactured products including bis(diethylamino)silane (BDEAS) and disilane (Si₂H₆).
Following the fire, the company converted its long-term investment plan into an accelerated production recovery project by establishing new TiCl₄ and HCDS production lines at Boeun. It also relocated its headquarters from Anseong to Boeun in March, completing consolidation of its manufacturing base. The damaged Anseong Plant 1 is now being considered for future new business operations.
The relocation has nearly doubled the company's TiCl₄ production capacity compared with its previous facility. The new production line incorporates smart factory technologies, automating purification and filling processes while introducing real-time production data management to improve manufacturing efficiency and product consistency. The proximity of parent company TEMC's manufacturing facilities is also expected to generate logistics synergies.
A fire on September 6, 2025, destroyed the TiCl₄ and HCDS production facilities at TEMC CNS's Anseong Plant 1 in Gyeonggi Province. Because the finished goods warehouse was not damaged, the company continued supplying customers through November 2025 using approximately two months of inventory. During the subsequent supply interruption, Merck and Soulbrain, which were already approved suppliers to the same customers, filled the supply gap.
TiCl₄ is a precursor used to form titanium nitride (TiN) thin films during semiconductor deposition processes. A precursor is a chemical material used before a reaction takes place. TiN is used in D램 capacitor electrodes and as a protective barrier for metal interconnects, reducing leakage current and preventing copper diffusion into surrounding dielectric layers to improve semiconductor reliability.
HCDS is a precursor used to deposit silicon nitride (SiN) and silicon oxide (SiO) films. These materials are widely used as insulating and protective layers in D램 and NAND flash devices.
selyesel@thelec.kr
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