高通宣布与亚马逊AWS合作供应定制AI推理ASIC与1.6T光互连，10年最高采购额600亿美元并已收到订单、12月起确认收入

Qualcomm has announced a semiconductor partnership with Amazon for artificial intelligence data centers, tied to warrants and a potential deal worth up to $60 billion.
Qualcomm said Sept. 8 it began a product collaboration with Amazon to build next-generation AI data center infrastructure. The partnership aims to supply cost-efficient custom application-specific integrated circuits (ASICs) for large-scale AI inference workloads on Amazon Web Services (AWS). ASICs are dedicated chips optimized for specific computing tasks or services.
"As AI demand accelerates, data center infrastructure will require advances in both computing and connectivity to deliver greater performance with more efficiency," Qualcomm Chief Executive Officer Cristiano Amon said. "Qualcomm is pleased to work with AWS on customized silicon and connectivity solutions, bringing decades of leadership in advanced processing and power-efficient compute, to deliver breakthrough performance and enable the next generation of AI infrastructure."
The companies will also jointly design high-performance optical connectivity solutions to address rising data traffic and bandwidth requirements in data centers. The solutions will target transmission speeds of up to 1.6 terabits per second (Tbps), using Qualcomm's high-speed serializer/deserializer (SerDes) and optical digital signal processor (DSP) technologies.
SerDes chips convert slower parallel signals inside semiconductors into a single high-speed serial data stream for transmission. Optical DSPs precisely compensate for signal distortion and loss as optical data travels through fiber.
Qualcomm Chief Financial Officer Akash Palkhiwala said the Amazon collaboration could generate a potential revenue opportunity of as much as $60 billion. He added that Amazon's selection validates Qualcomm's data center technology, strategy and ability to supply products at scale.
Up to $60 Billion Over 10 Years
The potential revenue cited by Palkhiwala is linked to Qualcomm's issuance of warrants, which give Amazon the right to purchase shares at a specified price in the future. Qualcomm plans to vest the warrants in stages based on Amazon's purchases of its data center ASICs and optical connectivity solutions. Amazon's maximum contracted purchase amount is $60 billion, with the agreement running for 10 years.
Amazon has already secured 15% of the warrants after committing to purchase Qualcomm products at the initial stage of the agreement. The product volume is estimated at about $9 billion.
Qualcomm has also received purchase orders (POs) from Amazon and begun chip production. Revenue from the chips is expected to be recognized starting in December. That makes Qualcomm's previously announced fiscal 2027 data center revenue forecast of about $5 billion increasingly likely to be achieved.
Qualcomm also plans to expand its use of Amazon's AI platform to shorten semiconductor design cycles. The company will increase the use of services including Amazon Bedrock in electronic design automation (EDA) workloads.
EDA involves using software to design semiconductor circuits and verify their performance. Amazon Bedrock is a fully managed generative AI service that allows developers to use pretrained generative AI models in cloud environments for their specific workflows and applications.
Qualcomm's data center ASICs are part of its Dragonfly portfolio. In addition to custom silicon, Dragonfly includes the C1000 central processing unit (CPU), AI300 AI inference accelerator and connectivity products.