LightCounting LightTrendsCodex · 实盘不做把握 7/10不做原因:无增量信息
北京时间·源无时间·以抓取为准·⟳ 抓取 22:50:15·⚡ 决策 08-25 23:45:50 +55m35s·62.6 天前
LightCounting回顾ECTC 2026硅光子与CPO封装进展，但未披露新的订单或业绩增量
这是6月2日发布的会议/研报摘要，8月25日被抓取并不代表新催化；公开内容只有技术路线与会议亮点，没有上市公司新增订单、收入、量产或指引变化。
📄 原文LightCounting LightTrends↗ 原文
Advances in PIC Packaging
LightCounting reports on highlights from ECTC 2026 by Daryl Inniss June 2, 2026 The 76th annual Electronic Components a…
不做 英伟达（NVDA.US）
不做英伟达（NVDA.US）：CPO路线图和会议技术讨论不是新增订单或指引，且公司体量过大，软催化无短线edge。
不做 台积电（TSM.US）
不做台积电（TSM.US）：硅光子制造进展属于长期产业趋势，缺少新增量产金额或客户收入验证。
不做 康宁（GLW.US）
不做康宁（GLW.US）：连接器技术方向受益但未披露采购、量产或财务增量，且消息已发布两个多月。
不做 GlobalFoundries（GFS.US）
不做GlobalFoundries（GFS.US）：PIC连接测试属于技术验证，未坐实商业化订单和短线业绩弹性。
展开详情(成交明细 / 研究档案 / 原文全文 / 决策记录链)
研究档案
结论摘要
事件本质是LightCounting对ECTC 2026硅光子与CPO封装进展的行业综述，利好方向停留在长期技术趋势层面。被点名公司均为既有产业链参与者，公开摘要未给出商业化金额、量产节点或预期差，且信息首发已在2026-06-02，距离本次抓取超过两个月，因此不具备可执行短线交易边际。
消息传播链
- LightCounting发布《June 2026 Advances in PIC Packaging》，内容为ECTC 2026会议亮点和付费研究札记摘要。
- LightCounting新闻列表继续展示该6月研究主题，说明其不是8月25日首次出现的新消息。
- 检测系统抓取到同一公开摘要，但未新增金额、订单、官方确认或业绩指引变化。
关键理由
- CPO和硅光子封装长期受益于AI互连带宽与功耗瓶颈，但本条仅证明行业方向而非公司业绩增量。
- Corning与GlobalFoundries的可拆卸玻璃波导连接器属于技术验证阶段，未见新增采购或量产收入披露。
- 对英伟达和台积电等超大市值标的，会议技术摘要缺少足以推动短线重估的materiality。
主要风险
- 付费全文若包含未在摘要展示的独家量产订单或客户采用数字，可能改变对康宁或GlobalFoundries的判断。
- CPO主题若在二级市场已有独立行情，本条可能作为情绪背景被引用，但不是新的可验证催化。
反向证据
- 做多前查反向 · 来源 web · 日期 2026-06-02 · 影响 weakens
公开摘要未发现订单、量产收入、客户采购或业绩指引等可交易增量。
检索:LightCounting ECTC 2026 PIC packaging TSMC Nvidia Corning GlobalFoundries order revenue guidance 原文 ↗ - 做多前查反向 · 来源 web · 日期 2026 · 影响 weakens
可查证内容主要是论文/展示和技术指标，未见正式商业订单或量产采用公告。
检索:Corning GlobalFoundries ECTC 2026 detachable glass waveguide connector CPO commercial order 原文 ↗
先例如何影响了这次决策
对本次决策的影响:先例不足进一步压低交易置信度，最终不对任何标的下单。
方向:会议技术摘要和行业综述类事件缺少清晰交易锚点，不适合用作单股短线方向样本。
涨幅量级:没有高相似、同市场、同相位且可锚定到具体上市公司新增商业化事实的先例，不能据此设定涨幅目标。
形态:该类主题新闻更容易表现为长期叙事或主题扩散，而非独立、可回测的短线催化。
原文全文
展开原文 · 2,534 字
LightCounting reports on highlights from ECTC 2026
by Daryl Inniss
June 2, 2026
The 76th annual Electronic Components and Technology Conference (ECTC) was held May 26-29, in Orlando, FL. There was a record of over 2700 attendees and over 400 technical papers presented. The keynote presentation by Dr. Tien Wu, CEO of ASE, set the stage by highlighting that hardware is the bottleneck to AI growth. He did not frame this as a problem as it may be a damping force to a market bubble. Moreover, he implored the industry to recognize that even bigger semiconductor manufacturing challenges, that are opportunities, lie ahead.
ECTC is an electronic packaging conference, nonetheless silicon photonics was well represented, illustrating the importance of photonics to the semiconductor industry. The main issue is reducing power consumption while increasing interconnection bandwidth. The three sessions on photonics packaging are summarized here. Most presentations were focused on co-packaged optics (CPO). Researchers are developing scalable, manufacturable, reliable, and cost-effective processes. Waveguide materials including glass and polymer were highlighted. There were edge and surface coupling. There was a focus on passive alignment, decreased sensitivity to alignment tolerances, and wafer scale manufacturing processes.
In case you missed the announcement last week, LightCounting released May 2026 report on Silicon Photonics, LPO/LRO and NPO/CPO. The report includes appendices on packaging, laser integration and silicon photonics foundries.
Industry leaders and start-ups driving advanced PIC packaging
TSMC and Nvidia are focused on higher bandwidth for the next generation interconnects. Corning and GlobalFoundries are addressing the market need for a passive edge connector. And nsc (New Silicon Corp), the ECTC start-up competition winner, has introduced optical links embedded in the chip, see the figure below. This is potentially a revolutionary solution.
TSMC is on track to manufacture silicon photonics and has outlined the roadmap and bandwidth-scaling challenges for the ecosystem. The Nvidia presentation nicely addressed a critical issue: the impact of using DWDM lasers in the optical engine on the link energy.
Corning presented its edge coupling, passive alignment, detachable connector. GlobalFoundries showcased the performance of Corning’s connector by reporting the results of connecting it to a PIC.
Full text of the research note is available to subscribers at: https://www.lightcounting.com/login
by Daryl Inniss
June 2, 2026
The 76th annual Electronic Components and Technology Conference (ECTC) was held May 26-29, in Orlando, FL. There was a record of over 2700 attendees and over 400 technical papers presented. The keynote presentation by Dr. Tien Wu, CEO of ASE, set the stage by highlighting that hardware is the bottleneck to AI growth. He did not frame this as a problem as it may be a damping force to a market bubble. Moreover, he implored the industry to recognize that even bigger semiconductor manufacturing challenges, that are opportunities, lie ahead.
ECTC is an electronic packaging conference, nonetheless silicon photonics was well represented, illustrating the importance of photonics to the semiconductor industry. The main issue is reducing power consumption while increasing interconnection bandwidth. The three sessions on photonics packaging are summarized here. Most presentations were focused on co-packaged optics (CPO). Researchers are developing scalable, manufacturable, reliable, and cost-effective processes. Waveguide materials including glass and polymer were highlighted. There were edge and surface coupling. There was a focus on passive alignment, decreased sensitivity to alignment tolerances, and wafer scale manufacturing processes.
In case you missed the announcement last week, LightCounting released May 2026 report on Silicon Photonics, LPO/LRO and NPO/CPO. The report includes appendices on packaging, laser integration and silicon photonics foundries.
Industry leaders and start-ups driving advanced PIC packaging
TSMC and Nvidia are focused on higher bandwidth for the next generation interconnects. Corning and GlobalFoundries are addressing the market need for a passive edge connector. And nsc (New Silicon Corp), the ECTC start-up competition winner, has introduced optical links embedded in the chip, see the figure below. This is potentially a revolutionary solution.
TSMC is on track to manufacture silicon photonics and has outlined the roadmap and bandwidth-scaling challenges for the ecosystem. The Nvidia presentation nicely addressed a critical issue: the impact of using DWDM lasers in the optical engine on the link energy.
Corning presented its edge coupling, passive alignment, detachable connector. GlobalFoundries showcased the performance of Corning’s connector by reporting the results of connecting it to a PIC.
Full text of the research note is available to subscribers at: https://www.lightcounting.com/login
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