三星电机与英伟达战略合作供AI封装基板：同事件已被多源处理，The Elec英文稿无新增事实

Samsung Electro-Mechanics will jointly invest with Nvidia to establish dedicated production facilities for artificial intelligence (AI) semiconductor package substrates at its Sejong and Busan plants. The company’s plan to expand package substrate production lines through customer-backed investment, under consideration since the first half of 2026, has taken shape through its partnership with Nvidia.
Samsung Electro-Mechanics said on Oct. 21 that it had signed a strategic business partnership with Nvidia to supply semiconductor package substrates. The company will supply next-generation substrates from its Korean production facilities under a multiyear arrangement beginning in 2026.
The products include flip-chip ball grid array (FC-BGA) substrates for AI computing chips and network switches that enable high-speed connections between chips in data centers. Supply volumes are expected to grow at a double-digit annual rate starting in 2026. By 2028, Nvidia-related production is expected to account for a significant share of the company’s total capacity.
The substrates will also embed passive components, including multilayer ceramic capacitors (MLCCs) and silicon capacitors (Si-Caps). These components will help control power noise generated during ultra-high-speed computing and maximize power efficiency.
“We will combine our accumulated expertise in advanced FC-BGA manufacturing with our unrivaled high-reliability MLCC technology to ensure Nvidia’s AI platforms reach the market on time with the highest performance and quality,” said Chang Duck-hyun, president of Samsung Electro-Mechanics.
“Expanding production capacity globally is essential to keep pace with the speed of AI infrastructure deployment,” said Deborah Shoquist, executive vice president of operations at Nvidia. “Through our partnership with Samsung Electro-Mechanics, we will broaden our network of substrate supply partners and deliver the accelerated computing platforms our customers need.”