🏢 公司NewsroomVSHCodex · 实盘不做把握 6/10不做原因:无增量信息
北京时间·🕒 发布 12:01:37·⟳ 抓取 12:01:44 +7s·⚡ 决策 08-26 12:03:12 +1m28s·62.3 天前
Vishay将在PCIM Asia 2026展示AI电源、SDV和人形机器人相关半导体与无源器件方案
本次是一手官方展会展示新闻，可信但更接近产品/营销展示；缺少可量化商业化增量，且2025年同类PCIM Asia展示已出现过，无法形成足够预期差。
📄 原文VSH↗ 原文
Vishay Intertechnology to Showcase Solutions for AI Infrastructure and Physical AI at PCIM Asia 2026
Company to Highlight Broad Portfolio of Semiconductor and Passive Technologies in a Series of Reference Designs and Pro…
不做 Vishay Intertechnology（VSH.US）
不做Vishay Intertechnology（VSH.US）：本次只是官方展会展示与参考设计清单，没有订单、客户承诺、量产节点、金额或指引上调，且同类PCIM展示在2025年已出现，短线预期差不足。
展开详情(成交明细 / 研究档案 / 原文全文 / 决策记录链)
研究档案
结论摘要
Vishay宣布在PCIM Asia 2026展示AI电源、SDV和机器人相关元器件及参考设计，方向上贴合AI基础设施和功率电子主题，但文本没有客户订单、供货协议、量产节点、金额或盈利指引。PCIM Asia官方资料显示同场多家功率半导体厂商均展示AI数据中心、电动出行和功率电子方案，Vishay自身2025年也发布过类似PCIM Asia展示新闻，因此该消息更像常规展会传播，不足以下新仓。
消息传播链
- 公司官方新闻稿披露将在PCIM Asia 2026展示AI基础设施和Physical AI相关方案，属于一手来源。
- 展会主办方提前披露2026年展会将覆盖AI数据中心、电动出行和功率电子，说明本次主题属于展会主线而非单家公司独占催化。
关键理由
- 公司产品组合覆盖AI电源链路、汽车和机器人电机控制，但本次只是展示与参考设计，未形成可量化订单或收入增量。
- 2025年Vishay已发布过面向AI和EV的PCIM Asia展示新闻，本次主题延续性强，新增预期差有限。
- PCIM Asia 2026本身聚集Infineon、ROHM、Toshiba、Power Integrations等多家功率电子厂商，事件不是Vishay独占催化。
主要风险
- 若展会期间后续披露大客户设计定点、量产供货或AI电源实质订单，本次AVOID需要重新评估。
- 缺少实时stock_tools报价与内部案例库结果，无法精确判断盘前流动性和历史同类展示后的短线反应。
反向证据
先例如何影响了这次决策
对本次决策的影响:先例强化了本次不把展会展示当作订单催化的判断，维持AVOID。
方向:唯一高相似样本指向常规展会展示，方向偏中性而非强利好。
涨幅量级:缺少event_study测算，不能用该样本校准可执行涨幅。
形态:样本数量不足，无法证明稳定高开高走或见光死模式。
历史先例(按相似度)
- 相似度 8/10 VSH 2025-09-19 Vishay 2025年宣布在PCIM Asia展示AI和EV应用半导体及无源技术，未披露订单金额或客户承诺。 原文 ↗
事件后 +1日 -2.9% · +2日 -2.9% · +3日 -3.8% · +4日 -3.7% · +5日 -5.8%
⚠未核对目标相位 — 该行涨幅别用来定止盈止损
相似度依据:同一公司、同一展会、同样以AI相关功率器件和参考设计展示为核心，但2025年主题偏AI服务器和EV，本次增加Physical AI和机器人表述。
经验:同类展会展示更多是产品可见度事件，不等同于订单或业绩重估。
原文全文
展开原文 · 6,816 字
Company to Highlight Broad Portfolio of Semiconductor and Passive Technologies in a Series of Reference Designs and Product Demonstrations Focused on Grid to Board AI Power Delivery, Software-Defined Vehicles, and Humanoid Robotics
MALVERN, Pa., Aug. 26, 2026 (GLOBE NEWSWIRE) -- Vishay Intertechnology, Inc. (NYSE: VSH) today announced that the company will showcase its latest semiconductor and passive technologies at PCIM Asia 2026. In Hall 16, Booth C12, visitors are invited to explore Vishay's products and reference designs tailored to the rapidly evolving demands of AI infrastructure and physical AI applications.
At PCIM Asia, Vishay will highlight reference designs and products spanning the complete AI power architecture, from grid-level power infrastructure to board-level system power delivery. Featured exhibits will include solid-state transformers (SST), AC/DC power supply units (PSUs), high voltage DC (HVDC), DC/DC power conversion, battery backup units (BBUs), capacitor backup units (CBUs), hot-swap systems, software-defined vehicles (SDV), and humanoid robot motor control. Additional highlights will include automotive power modules for next-generation vehicle platforms.
For AI grid infrastructure, an SST reference design will feature components for input, DC blocking, output, and voltage balancing stages, including compact metallized polypropylene DC-Link film capacitors rated at 11 µF and 1800 V; high reliability power electronic capacitors up to 310 µF and 2000 V; four-terminal snap-in aluminum electrolytic capacitors with high ripple current and long life; non-inductive power resistors with working voltages up to 5000 V; and SiC MOSFET power modules in the EMIPAK 2B package. AC/DC PSU solutions will comprise Gen 5 E series MOSFETs for PFC and LLC stages; TrenchFET
®
Gen V power MOSFETs for synchronous rectification and OR-ing applications; low profile rectifiers; low forward voltage bridge rectifiers; glass passivated rectifiers with high forward surge capability; SiC Schottky diodes optimized for high speed hard switching for clamp protection; and Power Metal Strip
®
resistors for high power, low resistance current sensing. HVDC power conversion exhibits will highlight solutions for PFC, bootstrap, filtering, and precharge functions. Featured products will include Gen 4 SiC Schottky diodes with virtually no recovery tail, low switching losses, and a guaranteed minimum creepage distance of 3.2 mm; DC-Link film capacitors operating up to +125 °C with high ripple current capability and high humidity robustness; and PTC thermistors for inrush current limiting with energy absorption up to 300 J.
Board-level power conversion exhibits will consist of low profile PowerPAK
®
SO-8DC MOSFET solutions that deliver high temperature operation up to +175 °C and combine low on-resistance with low gate and output charge for efficient switching, together with thick film chip resistors for gate-drive applications offering excellent pulse-load capability, enhanced power ratings, and double-sided printed resistor elements. BBU and CBU exhibits will feature edge-wound inductors with current capability up to 260 A and 350 V
DC
coil to core isolation; IHDV power inductors rated up to 150 A with 1500 V
DC
coil to core isolation; IHLP
®
power inductors with current ratings up to 100 A; and output filter capacitors. Hot-swap systems will showcase power resistors for precharge and discharge applications rated up to 150 W with pulse absorption up to 75 J/0.1 s.
SDV exhibits will focus on POL converter, protection, and current sensing. Featured products will include AEC-Q100 qualified, integrated smart power stages with continuous current up to 50 A and peak current up to 80 A in the thermally enhanced PowerPAK MLP 5 x 6 package; polymer tantalum capacitors qualified to AEC-Q200 with ultra low ESR and 85 °C / 85 % RH rated voltage capability; Automotive Grade TVS devices with 7 kW surge protection and a flat clamping voltage; Ethernet ESD protection diodes compliant with OPEN Alliance specifications; 4-terminal current sense resistors with extremely low resistance values; and thermally enhanced MOSFETs for reverse protection. Humanoid robot motor control exhibits will demonstrate switching, gate-drive circuitry, and current sensing using MOSFETs in PowerPAK SO-8 and TOLL packages, 4-terminal shunt resistors with high power to 8 W, and an Automotive Grade inductor with a 200 V operating voltage rating. Automotive power module exhibits for EV / HEV charging stations and 48 V micromobility systems will feature SiC MOSFET / Si MOSFET power modules combining high blocking voltage, low on-resistance, high speed switching, and low capacitance, as well as half-bridge inverter modules integrating current and temperature sensing with an electrically isolated, exposed DBC substrate.
Addition reference designs being featured at PCIM Asia 2026 will include:
Active discharge circuits with wirewound safety resistors and MOSFET drivers for 400 V / 800 V DC-Link capacitors
An intelligent battery shunt built on WSBE Power Metal Strip
®
resistors, with low TCR and a CAN FD interface for 400 V / 800 V systems
A 48 V, 100 A resettable eFuse with adjustable current limiting and DC-Link capacitor pre-charge
A single-stage, single-phase 480 µH EMI filter featuring a common mode choke and replaceable X and Y capacitors
An active backup solution for 3.3 V systems featuring EDLC capacitors with charging and discharging currents up to 2.5 A
PCIM Asia 2026 will take place Aug. 26-28 at the Shenzhen World Exhibition and Convention Center in Shenzhen, China. More information on the event is available at
https://pcimasia-shenzhen.cn.messefrankfurt.com/shenzhen/en.html
.
# # #
Vishay manufactures one of the world’s largest portfolios of discrete semiconductors and passive electronic components that are essential to innovative designs in the automotive, industrial, computing, consumer, telecommunications, military, aerospace, and medical markets. Serving customers worldwide, Vishay is
The DNA of tech.
®
Vishay Intertechnology, Inc. is a Fortune 1000 Company listed on the NYSE (VSH). More on Vishay at
www.Vishay.com
.
The DNA of tech
®
is a registered trademark of Vishay Intertechnology, Inc. Power Metal Strip and IHLP are registered trademarks of Vishay Intertechnology, Inc. PowerPAK and TrenchFET are registered trademarks of Siliconix incorporated.
Vishay on Facebook:
http://www.facebook.com/VishayIntertechnology
Vishay Twitter feed:
http://twitter.com/vishayindust
Link to The DNA of tech
®
image:
https://www.flickr.com/photos/vishay/50342588442/sizes/l/
For more information please contact:
Vishay Intertechnology
Peter Henrici, +1 408 567-8400
peter.henrici@vishay.com
or
Redpines
Bob Decker, +1 415 409-0233
bob.decker@redpinesgroup.com
MALVERN, Pa., Aug. 26, 2026 (GLOBE NEWSWIRE) -- Vishay Intertechnology, Inc. (NYSE: VSH) today announced that the company will showcase its latest semiconductor and passive technologies at PCIM Asia 2026. In Hall 16, Booth C12, visitors are invited to explore Vishay's products and reference designs tailored to the rapidly evolving demands of AI infrastructure and physical AI applications.
At PCIM Asia, Vishay will highlight reference designs and products spanning the complete AI power architecture, from grid-level power infrastructure to board-level system power delivery. Featured exhibits will include solid-state transformers (SST), AC/DC power supply units (PSUs), high voltage DC (HVDC), DC/DC power conversion, battery backup units (BBUs), capacitor backup units (CBUs), hot-swap systems, software-defined vehicles (SDV), and humanoid robot motor control. Additional highlights will include automotive power modules for next-generation vehicle platforms.
For AI grid infrastructure, an SST reference design will feature components for input, DC blocking, output, and voltage balancing stages, including compact metallized polypropylene DC-Link film capacitors rated at 11 µF and 1800 V; high reliability power electronic capacitors up to 310 µF and 2000 V; four-terminal snap-in aluminum electrolytic capacitors with high ripple current and long life; non-inductive power resistors with working voltages up to 5000 V; and SiC MOSFET power modules in the EMIPAK 2B package. AC/DC PSU solutions will comprise Gen 5 E series MOSFETs for PFC and LLC stages; TrenchFET
®
Gen V power MOSFETs for synchronous rectification and OR-ing applications; low profile rectifiers; low forward voltage bridge rectifiers; glass passivated rectifiers with high forward surge capability; SiC Schottky diodes optimized for high speed hard switching for clamp protection; and Power Metal Strip
®
resistors for high power, low resistance current sensing. HVDC power conversion exhibits will highlight solutions for PFC, bootstrap, filtering, and precharge functions. Featured products will include Gen 4 SiC Schottky diodes with virtually no recovery tail, low switching losses, and a guaranteed minimum creepage distance of 3.2 mm; DC-Link film capacitors operating up to +125 °C with high ripple current capability and high humidity robustness; and PTC thermistors for inrush current limiting with energy absorption up to 300 J.
Board-level power conversion exhibits will consist of low profile PowerPAK
®
SO-8DC MOSFET solutions that deliver high temperature operation up to +175 °C and combine low on-resistance with low gate and output charge for efficient switching, together with thick film chip resistors for gate-drive applications offering excellent pulse-load capability, enhanced power ratings, and double-sided printed resistor elements. BBU and CBU exhibits will feature edge-wound inductors with current capability up to 260 A and 350 V
DC
coil to core isolation; IHDV power inductors rated up to 150 A with 1500 V
DC
coil to core isolation; IHLP
®
power inductors with current ratings up to 100 A; and output filter capacitors. Hot-swap systems will showcase power resistors for precharge and discharge applications rated up to 150 W with pulse absorption up to 75 J/0.1 s.
SDV exhibits will focus on POL converter, protection, and current sensing. Featured products will include AEC-Q100 qualified, integrated smart power stages with continuous current up to 50 A and peak current up to 80 A in the thermally enhanced PowerPAK MLP 5 x 6 package; polymer tantalum capacitors qualified to AEC-Q200 with ultra low ESR and 85 °C / 85 % RH rated voltage capability; Automotive Grade TVS devices with 7 kW surge protection and a flat clamping voltage; Ethernet ESD protection diodes compliant with OPEN Alliance specifications; 4-terminal current sense resistors with extremely low resistance values; and thermally enhanced MOSFETs for reverse protection. Humanoid robot motor control exhibits will demonstrate switching, gate-drive circuitry, and current sensing using MOSFETs in PowerPAK SO-8 and TOLL packages, 4-terminal shunt resistors with high power to 8 W, and an Automotive Grade inductor with a 200 V operating voltage rating. Automotive power module exhibits for EV / HEV charging stations and 48 V micromobility systems will feature SiC MOSFET / Si MOSFET power modules combining high blocking voltage, low on-resistance, high speed switching, and low capacitance, as well as half-bridge inverter modules integrating current and temperature sensing with an electrically isolated, exposed DBC substrate.
Addition reference designs being featured at PCIM Asia 2026 will include:
Active discharge circuits with wirewound safety resistors and MOSFET drivers for 400 V / 800 V DC-Link capacitors
An intelligent battery shunt built on WSBE Power Metal Strip
®
resistors, with low TCR and a CAN FD interface for 400 V / 800 V systems
A 48 V, 100 A resettable eFuse with adjustable current limiting and DC-Link capacitor pre-charge
A single-stage, single-phase 480 µH EMI filter featuring a common mode choke and replaceable X and Y capacitors
An active backup solution for 3.3 V systems featuring EDLC capacitors with charging and discharging currents up to 2.5 A
PCIM Asia 2026 will take place Aug. 26-28 at the Shenzhen World Exhibition and Convention Center in Shenzhen, China. More information on the event is available at
https://pcimasia-shenzhen.cn.messefrankfurt.com/shenzhen/en.html
.
# # #
Vishay manufactures one of the world’s largest portfolios of discrete semiconductors and passive electronic components that are essential to innovative designs in the automotive, industrial, computing, consumer, telecommunications, military, aerospace, and medical markets. Serving customers worldwide, Vishay is
The DNA of tech.
®
Vishay Intertechnology, Inc. is a Fortune 1000 Company listed on the NYSE (VSH). More on Vishay at
www.Vishay.com
.
The DNA of tech
®
is a registered trademark of Vishay Intertechnology, Inc. Power Metal Strip and IHLP are registered trademarks of Vishay Intertechnology, Inc. PowerPAK and TrenchFET are registered trademarks of Siliconix incorporated.
Vishay on Facebook:
http://www.facebook.com/VishayIntertechnology
Vishay Twitter feed:
http://twitter.com/vishayindust
Link to The DNA of tech
®
image:
https://www.flickr.com/photos/vishay/50342588442/sizes/l/
For more information please contact:
Vishay Intertechnology
Peter Henrici, +1 408 567-8400
peter.henrici@vishay.com
or
Redpines
Bob Decker, +1 415 409-0233
bob.decker@redpinesgroup.com
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