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野村证券Codex · 实盘不做把握 6/10
北京时间·🕒 发布 08-03 20:23:09时区推断·⟳ 抓取 08-03 20:44:52·⚡ 决策 08-04 14:06:18 +17h21m·84.1 天前

联发科法说后野村重申ASIC收入上修,但核心信息已于7月31日披露并被股价反应

联发科(2454.TW)管理层口径显示2027年ASIC收入目标上修至120亿至160亿美元、2026年超过20亿美元,方向上利好公司从手机SoC向数据中心ASIC转型。

📄 原文野村证券↗ 原文
Upbeat guidance aligns with our preview despite Street noise Quick Note
Likely driven by a sharply falling share price in July – following the record level from April to June (see our “after…
不做 联发科(2454.TW)
方向利好但不做:120亿至160亿美元ASIC展望是2026-07-31法说后的卖方复盘,2月和4月已有公开报道铺垫,且2454.TW在法说后已连续强涨消化;当前已过8月4日台股完整交易日,剩余短线edge不足。
不做 台积电(2330.TW)
联发科ASIC放量对先进制程和封装方向有利,但台积电体量过大、先进封装主线已广泛交易,本条未新增台积电订单或capex上修,无法形成公司级短线交易。
不做 创意电子(3443.TW)
只存在台湾ASIC设计服务主题联动,未坐实创意电子取得联发科或Google本项目新增订单,且近期同主题已有较大波动,不做二阶追题材。
不做 世芯-KY(3661.TW)
同属AI ASIC主题但与本次联发科TPU v9/ASIC收入指引没有直接客户或订单关系,属于泛化映射,当前不做。
不做 博通(AVGO.US)
联发科份额提升对博通有竞争含义,但Google TPU多供应商格局已在6月传播,且本条不是博通正式丢单或指引下修,不满足强做空催化。
不做 美满电子(MRVL.US)
Marvell同时可能参与Google推理芯片/MPU项目,当前信息对其净影响不明确,不做。
展开详情(成交明细 / 研究档案 / 原文全文 / 决策记录链)

研究档案

🔎 新鲜度:最早出现 2026-07-31 · 扩散 high · price-in 风险 high ↗ ↗ ↗

消息传播链

  1. 2026-02-04 16:51 CST财经媒体扩散中央社CNA非一手原文 ↗
    CNA已报道联发科称2026年ASIC营收将突破10亿美元、2027年可达数十亿美元且占营收约两成,说明长期ASIC主线并非新出现。
  2. 2026-04-30 17:19 CST财经媒体扩散中央社CNA非一手原文 ↗
    CNA报道联发科称首个AI加速器ASIC项目如期量产、2026年贡献约20亿美元、2027年市场规模700亿至800亿美元,已覆盖本次报告的大部分叙事。
  3. 2026-07-31 15:00 CST官方确认/否认MediaTek Investor Relations一手源原文 ↗
    联发科官网列示2026-07-31举行2Q26 Earnings Conference,这是本次野村复盘所依据的一手法说节点。
    市场反应:内部日线快照显示2454.TW在2026-07-31和2026-08-03分别约+9.9%、+10.0%,已出现强烈同向反应。
  4. 2026-08-03 08:23 ET行业媒体转载野村证券/Gangtise非一手原文 ↗
    野村复盘称联发科将2027年ASIC收入展望上修至120亿至160亿美元并确认第二颗AI ASIC进展顺利,但性质是法说后的卖方解读。
  5. 2026-08-03市场反应price_snapshot非一手
    内部行情快照显示2454.TW截至2026-08-03收盘价3910新台币、当日约+9.99%,但该快照对2026-08-04为stale,不能作为当前入场价。
    市场反应:7月31日至8月3日已连续接近涨停,显示催化已被交易。

关键理由

  • 联发科(2454.TW)管理层口径显示2027年ASIC收入目标上修至120亿至160亿美元、2026年超过20亿美元,方向上利好公司从手机SoC向数据中心ASIC转型。
  • 但这不是8月3日野村首次披露的新事实,联发科官方2Q26投资者会议已在2026-07-31举行,2月和4月已有CNA报道ASIC在2026、2027年的高增长叙事。
  • 价格层面,内部日线快照显示2454.TW在2026-07-31与2026-08-03已连续约涨停,当前时点已过8月4日台股完整交易日,剩余短线edge不足。

主要风险

  • ASIC收入弹性很大但项目仍依赖Google/美国CSP量产节奏、SerDes/先进封装良率和客户份额分配,若TPU v8/v9延迟或多供应商分流,2027收入落地会低于乐观口径。
  • 正确交易窗口应在2026-07-31法说后至2026-08-03开盘前;当前信号为券商复盘,且台股已交易消化,不宜追后手。

反向证据

  • 做多前查反向 · 来源 web · 日期 2026-04-20 · 影响 weakens
    DCD报道Google同时与Marvell讨论新的推理芯片和MPU,多供应商格局会削弱单一押注联发科的确定性。
    检索:MediaTek Google TPU v9 delay ASIC competition Marvell 2026 原文 ↗
  • 做多前查反向 · 来源 kb_search · 日期 2026-05-20 · 影响 weakens
    内部KB命中Google离职专家纪要,显示Marvell、Broadcom、联发科围绕TPU/MPU项目竞争,联发科份额仍需以客户最终量产分配验证。
    检索:MediaTek 2Q26 analyst briefing ASIC sales 2027 USD12-16bn TPU v9 price hike 原文 ↗
  • 做多前查反向 · 来源 stock_quote · 日期 2026-08-03 · 影响 weakens
    内部日线快照显示2454.TW在2026-07-31与2026-08-03已连续约涨停,当前催化后手追价的price-in风险高。
    检索:price_snapshot 2454.TW 2330.TW 3034.TW 3661.TW 3443.TW
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原文全文

展开原文 · 5,035 字
Likely driven by a sharply falling share price in July – following the record level from April to June (see our “after 2000 days… ” report from March) – most questions we have received from investors over the past month since our late-June preview note were triggered by Street noise such as the delays of TPU v8 or v9 projects, rising ASIC competition, and likely negative sales growth for 3Q26F.
MTK’s guidance (Fig. 1 ) and messages – projecting 3Q sales to grow 0-5% q-q and, more importantly, ASIC sales surging to USD12-16bn in 2027E (accounting for a 15-20% share of the USD80bn market, aligning with our USD14bn sales estimate, vs previous guidance of USD7-12bn based on a 10-15% share of a USD70-80bn cloud ASIC TAM ) from USD2bn+ in 2026 – should have effectively addressed these concerns, in our view.
Also, MTK confirmed that its second AI ASIC (TPU v9, we assume) is progressing well using EMIB-T, with further share gains and high volume production in 2028E. MTK is also engaging with several other ASIC customers. Last but not the least, MTK has confirmed price hikes to pass on the increased supply chain costs. Accordingly, MTK expects full-year GPM to be stable in the 46%+ to -1.5% range. These developments are broadly consistent with our strengthened positive view on the company, with one modest upside – the “implied” 4Q26E GPM guidance (at least 45-46%) appears slightly above our model forecast of 44.7% (likely reflecting price increases offsetting the lower GPM from ASIC).
Given the in-line 3Q guidance and 2Q results (Fig. 1 ), we maintain our 2026-28F EPS forecasts and reiterate our Buy rating and TP of TWD5,800. Our TP is based on 25x 2027-28 average EPS; the stock currently trades at 15x.
MediaTek: 2Q26 analysts briefing summary
Below comments are from MediaTek’s management, unless otherwise stated :
Results summary
• 2Q26 revenue was TWD152.2bn (+2.0% q-q and +1.2% y-y)
• 2Q26 GM was 46.2% (-0.1pp q-q and +2.9pp y-y)
• 2Q26 OPM was 15.0% (-0.3pp q-q and -4.5pp y-y)
• EPS was TWD15.28
Prepared remarks
• 2Q26 revenue was at the high end of guidance, mainly driven by solid momentum across Smart Edge products; 2Q26 GM was around the midpoint of guidance.
Data center
The release of increasingly capable frontier AI models and the rapid transition toward agentic AI are driving computing demand across both cloud and edge AI. Agentic AI represents a significant growth opportunity for MediaTek as it is well positioned to support both the scaling of AI data centers and the proliferation of agentic AI across edge devices.
○ Through close partnership with major US CSP customers, MediaTek has built the first AI accelerator and production is scheduled to begin in 4Q26.
○ It expects data center revenue to exceed USD2bn in 2026E and will continue to scale substantially in 2027E, primarily driven by increasing customer demand.
○ Now MediaTek believes the 2027E TAM to be USD80bn and raised the share target to 15-20% (from 10-15%).
○ The second AI ASIC is progressing well. With close collaboration with the advanced packaging partner, the yield and reliability of the second ASIC are on track for high-volume production in 2028E, and MediaTek is confident of capturing additional share when this ASIC ramps up.
○ MediaTek continues to deepen its engagement with several customers for data center ASIC opportunities. Backed by IP and proven execution capabilities, MediaTek can secure more design wins in the data center market.
■ The development of 448G SerDes is progressing well, delivering best-in-class performance and power with CPC system.
■ Beyond 448G, MediaTek continues to develop CPO on TSMC COUPE.
■ Offers end-to-end 3.5D platform with best-in-class 3.5D IP packaging and design flows.
○ Through DTCO (Design-Technology Co-Optimization) with TSMC (2330 TT, Buy) and close collaborations with key advanced packaging partners, MediaTek leverages its experience in advanced nodes such as 2nm and strong engineering and architecture capabilities to develop high-performance ASICs using large-size CoWoS and EMIB-T.
○ Creates significant value beyond semiconductors by orchestrating other key components throughout the supply chain, such as memory and substrate, to drive successful execution.
○ Confident in the ability to support data center customers' roadmaps.
Mobile Phone (41% of total revenue)
-14% q-q and -20% y-y primarily due to weak demand as a result of increasing smartphone BOM.
○ Mediatek maintains its global smartphone estimates at -15% units decline this year.
○ Has observed that customers are prioritizing both flagship and entry-level products.
○ For the flagship segment, MediaTek will launch 2nm SoC in 3Q26E to power customers' next-generation agentic AI models with strong agentic AI computation and a more efficient cost structure.
○ Will increase its presence in the flagship smartphone market in 2027E.
○ In the entry segment, MediaTek continues to support customers with SoC portfolio and memory utilization technologies to optimize their cost structures.

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