台积电提交2026年7月月度6-K，披露例行持股、资产处置与债券发行事项

----- 0001046179-26-000545-index-headers.html -----
<SEC-DOCUMENT>0001046179-26-000545-index.html : 20260825
<SEC-HEADER>0001046179-26-000545.hdr.sgml : 20260825
<ACCEPTANCE-DATETIME>20260825061727
ACCESSION NUMBER: 0001046179-26-000545
CONFORMED SUBMISSION TYPE: 6-K
PUBLIC DOCUMENT COUNT: 1
CONFORMED PERIOD OF REPORT: 20260731
FILED AS OF DATE: 20260825
DATE AS OF CHANGE: 20260825
FILER:
COMPANY DATA:
COMPANY CONFORMED NAME: TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
CENTRAL INDEX KEY: 0001046179
STANDARD INDUSTRIAL CLASSIFICATION: SEMICONDUCTORS & RELATED DEVICES [3674]
ORGANIZATION NAME: 04 Manufacturing
EIN: 000000000
FISCAL YEAR END: 1231
FILING VALUES:
FORM TYPE: 6-K
SEC ACT: 1934 Act
SEC FILE NUMBER: 001-14700
FILM NUMBER: 261312324
BUSINESS ADDRESS:
ADDRESS IS A NON US LOCATION: YES
STREET 1: NO. 8, LI-HSIN ROAD 6
STREET 2: HSINCHU SCIENCE PARK
CITY: HSINCHU
PROVINCE COUNTRY: F5
BUSINESS PHONE: 886-3-5636688
MAIL ADDRESS:
ADDRESS IS A NON US LOCATION: YES
STREET 1: NO. 8, LI-HSIN ROAD 6
STREET 2: HSINCHU SCIENCE PARK
CITY: HSINCHU
PROVINCE COUNTRY: F5
</SEC-HEADER>
<DOCUMENT>
<TYPE>6-K
<SEQUENCE>1
<FILENAME>tsm-monthend6kx20260825.htm
<DESCRIPTION>6-K
<TEXT>
Document 1 - file: tsm-monthend6kx20260825.htm
</DOCUMENT>
</SEC-DOCUMENT>

----- 0001046179-26-000545.txt -----
0001046179-26-000545.txt : 20260825
0001046179-26-000545.hdr.sgml : 20260825
20260825061727
ACCESSION NUMBER: 0001046179-26-000545
CONFORMED SUBMISSION TYPE: 6-K
PUBLIC DOCUMENT COUNT: 1
CONFORMED PERIOD OF REPORT: 20260731
FILED AS OF DATE: 20260825
DATE AS OF CHANGE: 20260825
FILER:
COMPANY DATA:
COMPANY CONFORMED NAME: TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
CENTRAL INDEX KEY: 0001046179
STANDARD INDUSTRIAL CLASSIFICATION: SEMICONDUCTORS & RELATED DEVICES [3674]
ORGANIZATION NAME: 04 Manufacturing
EIN: 000000000
FISCAL YEAR END: 1231
FILING VALUES:
FORM TYPE: 6-K
SEC ACT: 1934 Act
SEC FILE NUMBER: 001-14700
FILM NUMBER: 261312324
BUSINESS ADDRESS:
ADDRESS IS A NON US LOCATION: YES
STREET 1: NO. 8, LI-HSIN ROAD 6
STREET 2: HSINCHU SCIENCE PARK
CITY: HSINCHU
PROVINCE COUNTRY: F5
BUSINESS PHONE: 886-3-5636688
MAIL ADDRESS:
ADDRESS IS A NON US LOCATION: YES
STREET 1: NO. 8, LI-HSIN ROAD 6
STREET 2: HSINCHU SCIENCE PARK
CITY: HSINCHU
PROVINCE COUNTRY: F5
6-K
1
tsm-monthend6kx20260825.htm
6-K
Document
1934 Act Registration No. 1-14700
UNITED STATES
SECURITIES AND EXCHANGE COMMISSION
Washington, D.C. 20549
_____________________________
FORM 6-K
_____________________________
REPORT OF FOREIGN PRIVATE ISSUER
PURSUANT TO RULE 13a-16 OR 15d-16 UNDER
THE SECURITIES EXCHANGE ACT OF 1934
For the month of August 2026
(Commission File Number: 001-14700)
_____________________________
Taiwan Semiconductor Manufacturing Company Limited
(Translation of Registrant’s Name Into English)
_____________________________
No. 8, Li-Hsin Road 6
Hsinchu Science Park
Hsinchu 300-096, Taiwan
Republic of China
(Address of Principal Executive Offices)
_____________________________
Indicate by check mark whether the registrant files or will file annual reports under cover of Form 20-F or Form 40-F.
Form 20-F
x
Form 40-F
o
Indicate by check mark if the registrant is submitting the Form 6-K in papers as permitted by Regulation S-T Rule 101(b)(1):
o
Indicate by check mark if the registrant is submitting the Form 6-K in papers as permitted by Regulation S-T Rule 101(b)(7):
o
SIGNATURES
Pursuant to the requirements of the Securities Exchange Act of 1934, the registrant has duly caused this report to be signed on its behalf by the undersigned, thereunto duly authorized.
Taiwan Semiconductor Manufacturing Company Limited
Date: August 25, 2026
By
/s/ Wendell Huang
Wendell Huang
Senior Vice President and Chief Financial Officer
Taiwan Semiconductor Manufacturing Company Limited
("TSMC"; NYSE: TSM)
This is to report 1) the changes in the shareholdings of TSMC board of directors, executive officers and shareholders who own more than 10% of total outstanding common shares of TSMC; 2) the changes in the pledge of TSMC common shares by TSMC board of directors, executive officers and shareholders who own more than 10% of total outstanding common shares of TSMC; 3) the acquisition and disposition of assets by TSMC and its subsidiaries; 4) the capital appropriations approved by TSMC board of directors; 5) the unsecured bonds issued by TSMC and its subsidiaries and 6) the cancellation of TSMC common shares for the month of July 2026.
1.
The changes in the shareholdings of TSMC board of directors, executive officers and shareholders who own more than 10% of total outstanding common shares of TSMC:
Title
Name
Number of shares held as of
Changes
6/30/2026
7/31/2026
Vice President
B.Z. Tien
13,051
18,051
5,000
Vice President
S.S. Lin
30,269
35,269
5,000
Note: Shareholdings include shares held by the related parties.
2.
The changes in the pledge of TSMC common shares by TSMC board of directors, executive officers and shareholders who own more than 10% of total outstanding common shares of TSMC:
None.
3.
The acquisition and disposition of assets by TSMC and its subsidiaries:
Equity investment: NT$0.7 billion of disposition.
4.
The capital appropriations approved by TSMC board of directors:
None.
5.
The unsecured bonds issued by TSMC and its subsidiaries:
Issuance
Tranche
Issuance Period
Total Amount
(in billions)
Coupon Rate
Repayment and Interest Payment
115-3
A
July 2026 ~ July 2031
NT$14.0
2.03%
Bullet repayment; interest payable annually
B
July 2026 ~ July 2036
NT$4.5
2.10%
6.
The cancellation of TSMC common shares:
None.

----- tsm-monthend6kx20260825.htm -----
6-K
1
tsm-monthend6kx20260825.htm
6-K
Document
1934 Act Registration No. 1-14700
UNITED STATES
SECURITIES AND EXCHANGE COMMISSION
Washington, D.C. 20549
_____________________________
FORM 6-K
_____________________________
REPORT OF FOREIGN PRIVATE ISSUER
PURSUANT TO RULE 13a-16 OR 15d-16 UNDER
THE SECURITIES EXCHANGE ACT OF 1934
For the month of August 2026
(Commission File Number: 001-14700)
_____________________________
Taiwan Semiconductor Manufacturing Company Limited
(Translation of Registrant’s Name Into English)
_____________________________
No. 8, Li-Hsin Road 6
Hsinchu Science Park
Hsinchu 300-096, Taiwan
Republic of China
(Address of Principal Executive Offices)
_____________________________
Indicate by check mark whether the registrant files or will file annual reports under cover of Form 20-F or Form 40-F.
Form 20-F
x
Form 40-F
o
Indicate by check mark if the registrant is submitting the Form 6-K in papers as permitted by Regulation S-T Rule 101(b)(1):
o
Indicate by check mark if the registrant is submitting the Form 6-K in papers as permitted by Regulation S-T Rule 101(b)(7):
o
SIGNATURES
Pursuant to the requirements of the Securities Exchange Act of 1934, the registrant has duly caused this report to be signed on its behalf by the undersigned, thereunto duly authorized.
Taiwan Semiconductor Manufacturing Company Limited
Date: August 25, 2026
By
/s/ Wendell Huang
Wendell Huang
Senior Vice President and Chief Financial Officer
Taiwan Semiconductor Manufacturing Company Limited
("TSMC"; NYSE: TSM)
This is to report 1) the changes in the shareholdings of TSMC board of directors, executive officers and shareholders who own more than 10% of total outstanding common shares of TSMC; 2) the changes in the pledge of TSMC common shares by TSMC board of directors, executive officers and shareholders who own more than 10% of total outstanding common shares of TSMC; 3) the acquisition and disposition of assets by TSMC and its subsidiaries; 4) the capital appropriations approved by TSMC board of directors; 5) the unsecured bonds issued by TSMC and its subsidiaries and 6) the cancellation of TSMC common shares for the month of July 2026.
1.
The changes in the shareholdings of TSMC board of directors, executive officers and shareholders who own more than 10% of total outstanding common shares of TSMC:
Title
Name
Number of shares held as of
Changes
6/30/2026
7/31/2026
Vice President
B.Z. Tien
13,051
18,051
5,000
Vice President
S.S. Lin
30,269
35,269
5,000
Note: Shareholdings include shares held by the related parties.
2.
The changes in the pledge of TSMC common shares by TSMC board of directors, executive officers and shareholders who own more than 10% of total outstanding common shares of TSMC:
None.
3.
The acquisition and disposition of assets by TSMC and its subsidiaries:
Equity investment: NT$0.7 billion of disposition.
4.
The capital appropriations approved by TSMC board of directors:
None.
5.
The unsecured bonds issued by TSMC and its subsidiaries:
Issuance
Tranche
Issuance Period
Total Amount
(in billions)
Coupon Rate
Repayment and Interest Payment
115-3
A
July 2026 ~ July 2031
NT$14.0
2.03%
Bullet repayment; interest payable annually
B
July 2026 ~ July 2036
NT$4.5
2.10%
6.
The cancellation of TSMC common shares:
None.