TTM科技宣布追加4亿美元扩产中国及槟城AI用PCB产能，属既有12亿美元资本开支计划之上的增量投资

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UNITED STATES
SECURITIES AND EXCHANGE COMMISSION
WASHINGTON, D.C. 20549
FORM
8-K
CURRENT REPORT
Pursuant to Section 13 or 15(d)
of the Securities Exchange Act of 1934
Date of Report (Date of earliest event reported):
October 12, 2026
TTM TECHNOLOGIES, INC.
(Exact name of Registrant as specified in its charter)
Delaware
000-31285
91-1033443
(State of
Incorporation)
(Commission
File Number)
(I.R.S. Employer
Identification No.)
200 East Sandpointe
,
Suite 400
Santa Ana
,
California
92707
(Address of principal executive offices)
(Zip Code)
(714)
327-3000
Registrant’s telephone number, including area code
Check the appropriate box below if the Form
8-K
filing is intended to simultaneously satisfy the filing obligation of the registrant under any of the following provisions:
☐
Written communications pursuant to Rule 425 under the Securities Act (17 CFR 230.425)
☐
Soliciting material pursuant to Rule
14a-12
under the Exchange Act (17 CFR 240.14a-12)
☐
Pre-commencement
communications pursuant to Rule
14d-2(b)
under the Exchange Act (17 CFR 240.14d-2(b))
☐
Pre-commencement
communications pursuant to Rule
13e-4(c)
under the Exchange Act (17 CFR
240.13e-4(c))
Securities registered pursuant to Section 12(b) of the Act:
Title of each class
Trading
Symbol(s)
Name of each exchange
on which registered
Common Stock, $0.001 par value
TTMI
Nasdaq Global Select Market
Indicate by check mark whether the registrant is an emerging growth company as defined in Rule 405 of the Securities Act of 1933 (§230.405 of this chapter) or Rule
12b-2
of the Securities Exchange Act of 1934
(§240.12b-2
of this chapter).
Emerging growth company
☐
If an emerging growth company, indicate by check mark if the registrant has elected not to use the extended transition period for complying with any new or revised financial accounting standards provided pursuant to Section 13(a) of the Exchange Act. ☐
Section 7 - Regulation FD
Item 7.01 – Regulation FD Disclosure.
On October 12, 2026, TTM Technologies, Inc. (the “Company”) issued a press release announcing plans to invest an additional $400 million to expand manufacturing capacity across four facilities in China and its facility in Penang, Malaysia, to support growing demand for artificial intelligence infrastructure. The additional investment is incremental to the Company’s previously disclosed commitment to invest $1.2 billion during the 2025 to 2029 period.
A copy of the press release is furnished with this Current Report on Form
8-K
as Exhibit 99.1 and is incorporated herein by reference.
The information furnished in this Item 7.01, including Exhibit 99.1, shall not be deemed to be “filed” for the purposes of Section 18 of the Securities Exchange Act of 1934, as amended (the “Exchange Act”), or otherwise subject to the liabilities of that section, and shall not be incorporated by reference into any registration statement or other document filed under the Securities Act of 1933, as amended, or the Exchange Act, except as shall be expressly set forth by specific reference in such filing.
Cautionary Note Regarding Forward-Looking Statements
This Report, including Exhibit 99.1, contains forward-looking statements that relate to future events. The Company cautions you that such statements are simply predictions and actual events or results may differ materially. These statements reflect the Company’s current expectations, and the Company does not undertake to update or revise these forward-looking statements, even if experience or future changes make it clear that any projected results expressed or implied in this or other Company statements will not be realized. The statements also involve risks and uncertainties, many of which are beyond the Company’s control, which could cause actual results to differ materially from the forward-looking statements. For a description of additional factors that may cause the Company’s actual events or results to differ from any forward-looking statements, please review the information set forth in the “Risk Factors” and “Management’s Discussion and Analysis of Financial Condition and Results of Operations” sections of the Company’s public reports filed with the Securities and Exchange Commission.
Item 9.01.
Financial Statements and Exhibits
(d) Exhibits
The following exhibits are filed with this Report:
Exhibit
Number
Description
99.1
Press Release dated October 12, 2026.
104
Cover Page Interactive Data File (embedded within the Inline XBRL document)
SIGNATURES
Pursuant to the requirements of the Securities Exchange Act of 1934, the registrant has duly caused this Report to be signed on its behalf by the undersigned hereunto duly authorized.
TTM TECHNOLOGIES, INC.
Date: October 13, 2026
/s/ Daniel J. Weber
By: Daniel J. Weber
Executive Vice President, Chief Legal Officer & Secretary

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EX-99.1
2
d38382dex991.htm
EX-99.1
EX-99.1
Exhibit 99.1
TTM Technologies Announces $400 Million in Planned Strategic Investments to Accelerate AI Infrastructure
Capacity in China and Malaysia
CEO Edwin Roks and COO Jim Walsh unveil “Rapid-Ramp” brownfield capacity expansion to
aggressively scale advanced N+M interconnect technology for AI Data Center Infrastructure, Hyperscalers and Networking Customers.
SANTA ANA,
Calif.
— October 12, 2026 — TTM Technologies, Inc. (NASDAQ: TTMI) (“TTM”), a leading global manufacturer of technology products, including mission systems, radio frequency (“RF”) components, RF
microwave/microelectronic assemblies, and technologically advanced interconnect products, including printed circuit boards (“PCBs”) and substrates, announced today a $400 million investment plan to expand capacity across four key
facilities in China and its strategic southeast Asia plant in Penang, Malaysia. This expansion initiative represents incremental investments to the previously disclosed commitment to invest $1.2 billion through the 2025-2029 timeframe and is
buttressed by ongoing discussions with our long-standing customer partners indicating expected demand increases.
The planned investments are dedicated to
supporting the surge in Artificial Intelligence (“AI”) infrastructure demand, primarily scaling TTM’s advanced N+M asymmetrical, interconnect manufacturing technology products. This expansion underscores TTM’s commitment to
its shareholders to capitalize on aggressive organic growth opportunities within the AI sector, with the goal of ensuring the company’s customers have access to both the critical capacity and innovative capabilities of TTM’s advanced
interconnect technologies. To meet the urgent needs of data center infrastructure providers, hyperscalers, and networking customers, TTM is bypassing more time-consuming “greenfield” construction approaches in favor of its brownfield
approach for strategic expansions. This “rapid ramp” approach entails optimizing existing operational space and integrating cutting-edge equipment to bring
AI-specific
PCB production capacity
online very efficiently.
“The AI boom has increasingly placed significant demands for capacity within the AI hardware supply chain. TTM anticipates
this market to remain highly dynamic and we will continue to work closely with our customers to define additional expansions as required. The rapid growth in demand requires us to make rapid capacity increases across several of our
facilities.” said Edwin Roks, President and CEO of TTM. “By leveraging our existing footprint in China and Penang to scale our advanced technology, we believe we are shortening the time between investment and revenue such that our
customers can scale without unnecessary or prohibitive bottlenecks,“ said Jim Walsh, Chief Operating Officer of TTM. This expansion reinforces TTM’s position as a critical interconnect and integration partner for the AI revolution,
providing the high-performance hardware that enables the world’s most powerful computing systems.
TTMI expects to provide additional commentary for
investors during its Third Quarter 2026 Earnings Conference call, with the specific date and time to be announced in coming weeks.
About TTM
TTM Technologies, Inc. is a leading global manufacturer of technology products, including mission systems, RF components, RF microwave/microelectronic
assemblies, and technologically advanced interconnect products, including PCBs and substrates. TTM stands for
time-to-market,
representing how TTM’s time-critical,
one-stop
design, engineering and manufacturing services enable customers to reduce the time required to develop new products and bring them to market. Additional information can be found at www.ttm.com.
Forward-Looking Statements
This release contains
forward-looking statements that relate to future events or performance. TTM cautions you that such statements are simply predictions and actual events or results may differ materially. These statements reflect TTM’s current expectations, and
TTM does not undertake to update or revise these forward-looking statements, even if experience or future changes make it clear that any projected results expressed or implied in this or other TTM statements will not be realized. Further, these
statements involve risks and uncertainties, many of which are beyond TTM’s control, which could cause actual results to differ materially from the forward-looking statements. These risks and uncertainties include, but are not limited to, the
execution and implementation of TTM’s investment plan, general market and economic conditions, including interest rates, currency exchange rates, and consumer spending, demand for TTM’s products, market pressures on prices of TTM’s
products, warranty claims, changes in product mix, contemplated significant capital expenditures and related financing requirements, TTM’s dependence upon a small number of customers, and other factors set forth in the “Risk
Factors” and “Management’s Discussion and Analysis of Financial Condition and Results of Operations” sections of TTM’s public reports filed with the SEC.
Investor Relations Contact:
Sean K.F. Hannan
Vice President, Investor Relations
TTM Technologies, Inc.
sean.hannan@ttmtech.com
+1
339-466-7737
Media Contact:
Winnie Ng
Vice President, Corporate Marketing
TTM Technologies, Inc.
winnie.ng@ttm.com
+852 2272 2287 / +1 714 327 3000