TrendForce转述韩媒称三星电机、LG Innotek AI封装基板产能利用率接近满载并扩产

[News] Samsung Electro-Mechanics, LG Innotek Ramp Up AI Substrate Capacity as 1H Utilization Reportedly Nears 90%
As substrates, like memory, emerge as a key AI supply-chain bottleneck, South Korean suppliers are ramping up capacity to close the gap with leading Japanese and Taiwanese players. According to Chosun Biz, semiconductor substrate utilization reached 89% at Samsung Electro-Mechanics and 94% at LG Innotek in the first half. Both are now expanding beyond their traditional mobile-focused businesses into AI accelerators and servers.
As explained by the report, the rise of AI data centers is intensifying demand for advanced substrates, as AI packages must integrate GPUs with high-bandwidth memory (HBM), driving tight supply and steep price increases.
The supply crunch is already translating into stronger financial results. Samsung Electro-Mechanics’ Packaging Solutions division posted first-half sales of KRW 1.497 trillion, up 41% year over year, while operating profit surged 237% to KRW 160.2 billion, according to Chosun Biz. LG Innotek’s packaging business also saw sales rise 18% to KRW 935.6 billion, with operating profit jumping 94% to KRW 99.6 billion.
Samsung, LG Step Up FC-BGA Push Across AI Giants
According to Chosun Biz, Samsung Electro-Mechanics and LG are increasingly targeting high-value FC-BGA (Flip Chip Ball Grid Array) substrates, which are particularly well suited to AI chips. The technology flips the chip onto the substrate and connects the two through dense arrays of microbumps, shortening signal paths for faster data transmission while improving power delivery and thermal management.
Notably, the report highlights that Samsung Electro-Mechanics has already supplies FC-BGA to major tech companies including NVIDIA, Google and Amazon. LG, meanwhile, is reportedly in talks with semiconductor giants including Intel and Broadcom over FC-BGA supplies for AI applications.
Bloter reports that Samsung Electro-Mechanics began ramping up FC-BGA investment in 2021, including an $850 million commitment to its Vietnam subsidiary and additional spending at its Busan and Sejong plants. The company, according to Bloter, aims to lift high-value-added FC-BGA to more than 50% of its portfolio by year-end.
LG Innotek, meanwhile, is pairing customer expansion with capacity growth. The company expects PC CPU FC-BGA mass production to start contributing meaningfully to revenue in the second half of this year and plans to launch on-device FC-BGA production for new global big-tech customers, according to News Journalism. It is also expanding its Hai Phong, Vietnam, substrate plant, with completion targeted for May 2027 and production focused on FC-BGA, FC-CSP and RF-SiP, the report suggests.
In June, LG Innotek approved an expansion of its semiconductor substrate plant in Hai Phong, Vietnam, with completion targeted for May 2027, the report notes, adding that the expanded facility will produce FC-BGA, FC-CSP and RF-SiP products.
Global Expansion War Heats up
South Korean suppliers are not the only ones expanding capacity, with Japan’s Ibiden and Taiwan’s Unimicron also stepping up ABF substrate investments. According to Commercial Times, Unimicron has raised its 2026 capex from NT$34 billion to more than NT$53.7 billion, with 80%–85% of the incremental spending targeting ABF substrates.
The company is also developing Intel’s EMIB advanced packaging substrates, with mass production slated for 2027 and an initial yield target of 50%, the report says.
On the other hand, Nikkei reports that the industry leader, Ibiden, plans to invest a total of ¥500 billion over three years starting in fiscal 2026 to expand production of its IC package substrates. Capacity for substrates used in generative AI servers, measured by substrate area, is expected to rise to roughly 2.5 times current levels by fiscal 2028, as the company moves to keep pace with robust AI server demand, the report notes.
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(Photo credit: Samsung Electro-Mechanics)