意法半导体拟于8月23日年内第三次涨价，功率器件交期最长报52周

[News] STMicroelectronics Plans Third 2026 Price Hike for August 23; Power Device Lead Times Reportedly Hit 52 Weeks
STMicroelectronics has again notified customers of price increases. According to EE Times China , this marks its third price hike in 2026, with prices across multiple product lines set to rise from August 23. The company cited strong semiconductor demand across multiple sectors and rising costs for transportation, energy, raw materials, and manufacturing services. Specific increases and affected products were not disclosed.

The report notes that prices for some STMicroelectronics automotive MCUs have already risen 15%–20%, while power device lead times have generally stretched beyond 30 weeks, with some reaching 52 weeks.

As EE Times China indicates, STMicroelectronics announced its first price hike on March 24, effective April 26, targeting tight-supply products including automotive power semiconductors and high-end industrial MCUs. A second round, announced on May 28 and effective June 28, extended the increases to previously unaffected products, including general-purpose MCUs, power ICs, and NFC RF chips.

The price hikes come amid a strong earnings recovery. As the report notes, STMicroelectronics posted 2Q26 net revenue of US$3.49 billion, up 26% YoY and above the midpoint of its guidance. Gross margin rose 1.3 percentage points YoY to 34.8%, while net income attributable to shareholders reached US$222 million, reversing a US$97 million net loss a year earlier.

Semiconductor Price Hikes Spread as Demand and Cost Pressures Build

STMicroelectronics is far from alone, as price increases are spreading across the broader semiconductor industry in 2H26, spanning analog chips, power semiconductors, MCUs, and RF front-end chips, as noted by EE Times China. Texas Instruments (TI) has adjusted prices five times over the past 12 months. NXP and onsemi have also announced price hikes. Infineon has raised prices twice this year, with its second round in July lifting AI server power and automotive power device prices by 10%–20%, the report adds.

The trend is also spreading across Asian suppliers. Taiwanese power semiconductor makers are preparing a third round of price hikes, potentially as early as October, with non-contract products rising 10%–15%, Economic Daily News notes. Meanwhile, China’s UNT has notified customers of a 15%–25% increase in 3Q26, its second hike this year, according to another Economic Daily News report.

Tight mature-node capacity is another driver. Demand from AI data centers, new energy vehicles, and industrial automation is putting pressure on 8-inch wafer supply, EE Times China notes. Commercial Times adds that if AI-related demand continues to squeeze mature-node capacity, wafer prices could remain under upward pressure into 2027.

Higher costs across the semiconductor supply chain are also contributing to the price increases. EE Times China adds that costs are rising from foundry to packaging and testing, with higher energy, transportation, raw material, and manufacturing service costs pushing up chip production costs.

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[News] STMicroelectronics Reportedly Set for Second MCU Price Hike This Year, Effective June 28

(Photo credit: STMicroelectronics)

Please note that this article cites information from  EE Times China ,  STMicroelectronics ,  Economic Daily News , and  Commercial Times .