AMD发布Helios机架级AI系统并获OpenAI、Anthropic、Meta等客户验证，亚太供应链方向利好但缺少可执行单名alpha

# 美股盘后催化 2/12: AMD Helios机架级AI系统进入量产并获得OpenAI、Anthropic、Meta等客户验证

- 美股会话: 2026-07-23
- 方向: POSITIVE；类型: 产品/技术；规划重大性: 9/10
- 映射模式: supply_chain
- 美股驱动（规划器初判，需独立核验）: 事实：AMD在Advancing AI发布Helios rack-scale、MI400/MI450和6代EPYC路线图，称Helios全面量产并即将出货；OpenAI已获得Helios机架并计划与AMD合作MI500及后续芯片，Anthropic将通过云、新型云或自建数据中心使用AMD CPU/GPU，另与Cerebras推出分解式推理方案。推断：这是AMD从单GPU替代走向整机架平台竞争的客户级验证，对Nvidia生态构成竞争，同时利好先进制程、HBM、服务器ODM、液冷、电源和互连链条。

## 本催化相关美股真实收盘行情

- 英伟达 (NVDA.US): 208.76 -1.56%
- AMD (AMD.US): 539.69 -2.29%
- 微软 (MSFT.US): 381.58 -2.24%
- Meta (META.US): 606.1 -3.36%
- Oracle (ORCL.US): 120.04 -4.61%
- Super Micro (SMCI.US): 31.2 +2.09%
- CBRS.US (CBRS.US): 220.0 +4.86%

## 亚太映射假设（仅候选，必须查证）

- 台积电 (2330.TW) [TW/供应商/positive]: MI400/MI450、EPYC和可能的后续定制AI芯片若放量，将增加先进制程和先进封装需求。；核验问题: MI455X、MI450、Venice/Florence的代工节点、CoWoS/SoIC或其它封装供应商及量产排程。
- SK海力士 (000660.KS) [KR/供应商/positive]: AMD AI加速器放量通常需要HBM，高端内存需求从Nvidia向非Nvidia平台扩散。；核验问题: AMD MI400/MI450 HBM代际、容量、SK海力士/三星/美光份额和合约期限。
- 纬颖 (6669.TW) [TW/供应商/positive]: Helios机架级系统若由云客户规模部署，台湾服务器ODM和整柜集成厂可能受益。；核验问题: Helios认证ODM/JDM名单，OpenAI、Anthropic、Meta部署是否由纬颖、广达、鸿海或英业达承接。

## 必答问题

- OpenAI和Anthropic承诺是正式采购、容量合作还是测试部署？
- Helios首批出货数量、ASP、毛利率和供应链分配如何？
- AMD-Cerebras方案会替代Nvidia推理需求还是补充供给缺口？

## 原始证据全文（14 条）

### [E1434] Bloomberg | 2026-07-23 16:56 UTC | 盘中
AMD Unveils New Products in Pursuit of $2 Trillion Market
URL: https://www.bloomberg.com/news/articles/2026-07-23/amd-unveils-new-products-in-pursuit-of-2-trillion-opportunity
Advanced Micro Devices Inc. announced a raft of new products for data centers that it said will outperform those from rival Nvidia Corp., aiming to make gains in a booming market for artificial intelligence computing.

At a company event Thursday, AMD unveiled a new generation of microprocessors, an updated AI accelerator and a server design. The products represent major upgrades to its current lineup and compare favorably with offerings from competitors, the chipmaker said.

AMD is expressing growing confidence that it can be more than a distant rival to Nvidia, whose technology has dominated the massive build-out of AI data centers and generated hundreds of billions in revenue. Both companies agree that customers’ appetite for the technology is insatiable and are racing to offer more powerful chips.

Still, investors took a skeptical view on Thursday, sending shares of AMD down about 4% during the company’s presentation. The stock had more than doubled in value this year heading into the event, signaling that expectations were high.

Under Chief Executive Officer Lisa Su, AMD has delivered a remarkable growth run — and Wall Street expects the pace to accelerate. Still, challenging Nvidia won’t be easy. Though AMD is widely seen as a key contender, Nvidia continues to grow faster and gets more revenue in a quarter than AMD does in a year.

The market for AI accelerators — the chips that train and run the artificial intelligence software — will soar to $1.4 trillion by 2030, AMD predicted. The opportunity for the company’s traditional data center product, central processing units, will be worth $220 billion by that date, the company said. Overall, AMD believes it will be competing in a market worth $2 trillion in 2030.

Read More: AMD to Invest Up to $5 Billion in Anthropic, Deploy Chips

AMD showed off its new Helios server rack as part of the presentation. That computer, a design that server makers will adopt and sell themselves, consists of as many as 72 of its MI400 series accelerators. The MI455 version of that lineup will provide a massive increase in performance versus its predecessors when measured by ability to handle memory and provide results more quickly and cheaply.

### [E1435] Bloomberg | 2026-07-23 16:56 UTC | 盘中
AMD Unveils New Products in Pursuit of $2 Trillion Market
URL: https://www.bloomberg.com/news/articles/2026-07-23/amd-unveils-new-products-in-pursuit-of-2-trillion-opportunity
Advanced Micro Devices Inc. announced a raft of new products for data centers that it said will outperform those from rival Nvidia Corp., aiming to make gains in a booming market for artificial intelligence computing.

At a company event Thursday, AMD unveiled a new generation of microprocessors, an updated AI accelerator and a server design. The products represent major upgrades to its current lineup and compare favorably with offerings from competitors, the chipmaker said.

AMD is expressing growing confidence that it can be more than a distant rival to Nvidia, whose technology has dominated the massive build-out of AI data centers and generated hundreds of billions in revenue. Both companies agree that customers’ appetite for the technology is insatiable and are racing to offer more powerful chips.

Still, investors took a skeptical view on Thursday, sending shares of AMD down about 4% during the company’s presentation. The stock had more than doubled in value this year heading into the event, signaling that expectations were high.

Under Chief Executive Officer Lisa Su, AMD has delivered a remarkable growth run — and Wall Street expects the pace to accelerate. Still, challenging Nvidia won’t be easy. Though AMD is widely seen as a key contender, Nvidia continues to grow faster and gets more revenue in a quarter than AMD does in a year.

The market for AI accelerators — the chips that train and run the artificial intelligence software — will soar to $1.4 trillion by 2030, AMD predicted. The opportunity for the company’s traditional data center product, central processing units, will be worth $220 billion by that date, the company said. Overall, AMD believes it will be competing in a market worth $2 trillion in 2030.

Read More: AMD to Invest Up to $5 Billion in Anthropic, Deploy Chips

AMD showed off its new Helios server rack as part of the presentation. That computer, a design that server makers will adopt and sell themselves, consists of as many as 72 of its MI400 series accelerators. The MI455 version of that lineup will provide a massive increase in performance versus its predecessors when measured by ability to handle memory and provide results more quickly and cheaply.

### [E1506] Wall St Engine | 2026-07-23 17:11 UTC | 盘中
OPENAI GOT ACCESS TO $AMD’S HELIOS GPU RACKS THREE MONTHS AGO, VP OF COMPUTE STRATEGY SAYS
URL: https://x.com/wallstengine/status/2080340022944051301
OPENAI GOT ACCESS TO $AMD’S HELIOS GPU RACKS THREE MONTHS AGO, VP OF COMPUTE STRATEGY SAYS

### [E1575] First Squawk | 2026-07-23 17:27 UTC | 盘中
OPENAI INFRASTRUCTURE CHIEF: PLANS TO WORK WITH AMD ON MI500 SERIES AI CHIPS AND BEYOND; OPENAI OBTAINED AMD HELIOS GPU RACKS THREE MONTHS AGO
URL: https://x.com/FirstSquawk/status/2080344174516396368
OPENAI INFRASTRUCTURE CHIEF: PLANS TO WORK WITH AMD ON MI500 SERIES AI CHIPS AND BEYOND; OPENAI OBTAINED AMD HELIOS GPU RACKS THREE MONTHS AGO

### [E1640] AMD | 2026-07-23 17:45 UTC | 盘中
AMD and Cerebras Announce Industry-Leading Ultra-Low-Latency and High Throughput AI Inference Solution
News Highlights
- AMD and Cerebras are collaborating to advance a workload-optimized approach to ultra-low-latency AI inference infrastru
URL: https://ir.amd.com/news-events/press-releases/detail/1293/amd-and-cerebras-announce-industry-leading-ultra-low-latency-and-high-throughput-ai-inference-solution
AMD and Cerebras Announce Industry-Leading Ultra-Low-Latency and High Throughput AI Inference Solution
News Highlights
- AMD and Cerebras are collaborating to advance a workload-optimized approach to ultra-low-latency AI inference infrastructure.
- AMD Helios™ and the Cerebras Wafer-Scale Engine will operate as a single disaggregated inference workflow, combining ultra-high-throughput from AMD Instinct™ GPUs, with ultra-fast token generation of Cerebras Wafer-Scale Engine.
-
Cerebras plans to deploy AMD Helios in its data centers, with the joint solution expected to be available first through Cerebras Cloud in the second half of 2026.
SAN FRANCISCO and SUNNYVALE, Calif., July 23, 2026 (GLOBE NEWSWIRE) -- AMD (NASDAQ: AMD) and Cerebras Systems (NASDAQ: CBRS) announced a technical partnership to deliver a new disaggregated AI inference solution that combines AMD Helios™ rackscale solutions with the Cerebras Wafer-Scale Engine. Unveiled at Advancing AI 2026, the solution is designed to deliver the ultra-low latency required for the most advanced AI applications while dramatically increasing the throughput and efficiency.
The joint AMD and Cerebras solution will deploy AMD Helios alongside Cerebras Wafer-Scale Engine technology integrated in a single inference workflow for maximum performance and efficiency. AMD Helios will provide a high-performance, scalable throughput engine. Cerebras Wafer-Scale Engine technology will provide ultra-fast, ultra-low latency decode and token generation. Together, the two compute engines are expected to deliver up to 5x higher tokens per second per watt (T/s/W) i.
AI inference workloads increasingly have different requirements across latency, throughput, token capacity, cost and scale. High-volume workloads prioritize maximizing token generation, while coding, real-time copilots, live agents and agentic workflows demand faster response times. These differences are driving demand for heterogeneous infrastructure that matches compute technologies to specific workload requirements.
The AMD and Cerebras solution addresses this challenge through disaggregated inference, optimizing the two primary stages of the workflow independently. AMD Helios provides ultra-high throughput, processing prompts and large context windows. The Cerebras Wafer-Scale Engine accelerates the memory-bandwidth-intensive token generation, with ultra-low latency. By connecting these best-in-class engines through one integrated workflow, the companies are creating a differentiated platform for ultra-low-latency inference without sacrificing throughput or scale.
“AI inference is becoming one of the largest infrastructure opportunities in AI, and its growing diversity requires a more flexible approach,” said Dr. Lisa Su, chair and CEO, AMD. “AMD Helios delivers leadership performance and scale for the broadest range of inference workloads. Together with Cerebras, we are extending that leadership into the most latency-sensitive applications and creating a powerful new platform for real-time agentic AI.”
“The demand for ultra-fast inference is growing at an unprecedented pace. Cerebras delivers the world’s fastest, ultra-low-latency inference,” said Andrew Feldman, CEO and co-founder, Cerebras. “Partnering with AMD gives us an incredible opportunity to bring that performance to even more customers.”
Fast token generation is becoming increasingly important as AI moves into software development, autonomous agents, robotics, scientific discovery and other applications where response time directly shapes the user experience and the usefulness of the system. The joint solution brings together complementary architectures purpose-built for these demands.
AMD Helios provides the high-throughput prompt engine, rack-scale efficiency and deployment scale required to process large numbers of complex requests. Cerebras Wafer-Scale Engine technology provides the ultra-low-latency and decode performance needed to return tokens in real time. The result is a solution designed specifically for the ultra-low-latency segment of the inference market, with AMD Helios as the foundation for high-throughput and balanced inference workloads across the data center.
Cerebras plans to deploy AMD Helios systems in its data centers, with the joint solution expected to become available initially through Cerebras Cloud in the second half of 2026.
Supporting Resources
- Follow AMD at Advancing AI 2026 (Press Kit)
- Learn more about AMD Helios™ rackscale solution
- Learn more about AMD Instinct™ Accelerators
- Connect with AMD on LinkedIn
- Follow AMD on X
- Learn more about the Cerebras Wafer-Scale Engine
- Connect with Cerebras on LinkedIn | Follow Cerebras on X
About AMD
AMD (NASDAQ: AMD) drives innovation in high-performance and AI computing to solve the world’s most important challenges. Today, AMD technology powers billions of experiences across cloud and AI infrastructure, embedded systems, AI PCs and gaming. With a broad portfolio of AI-optimized CPUs, GPUs, networking and software, AMD delivers full-stack AI solutions that provide the performance and scalability needed for a new era of intelligent computing. Learn more at www.amd.com.
About Cerebras Systems
Cerebras Systems (NASDAQ: CBRS) builds the world’s fastest AI infrastructure. The Cerebras team of pioneering computer architects, computer scientists, AI researchers, and engineers of all types came together to make AI blisteringly fast through innovation and invention. We believe that when AI is fast, it will change the world. Leading global corporations, research institutes, and governments choose Cerebras to run their AI workloads. Cerebras solutions are available on premises and in the cloud. Visit cerebras.ai for more.
AMD CAUTIONARY STATEMENT
This press release contains forward-looking statements concerning Advanced Micro Devices, Inc. (AMD) such as the features, functionality, performance, availability, scalability, deployment, timing and expected benefits of AMD’s collaboration and joint solution with Cerebras, which are made pursuant to the Safe Harbor provisions of the Private Securities Litigation Reform Act of 1995. Forward-looking statements are commonly identified by words such as "would," "may," "expects," "believes," "plans," "intends," "projects" and other terms with similar meaning. Investors are cautioned that the forward-looking statements in this press release are based on current beliefs, assumptions and expectations, speak only as of the date of this press release and involve risks and uncertainties that could cause actual results to differ materially from current expectations. Such statements are subject to certain known and unknown risks and uncertainties, many of which are difficult to predict and are generally beyond AMD's control, that could cause actual results and other future events to differ materially from those expressed in, or implied or projected by, the forward-looking information and statements. Material factors that could cause actual results to differ materially from current expectations include, without limitation, the following: impact of government actions and regulations such as export regulations, import tariffs, trade protection measures, and licensing requirements; competitive markets in which AMD’s products are sold; the cyclical nature of the semiconductor industry; market conditions of the industries in which AMD products are sold; AMD’s ability to introduce products on a timely basis with expected features and performance levels; loss of a significant customer; economic and market uncertainty; quarterly and seasonal sales patterns; AMD's ability to adequately protect its technology or other intellectual property; unfavorable currency exchange rate fluctuations; ability of third party manufacturers to manufacture AMD's products on a timely basis in sufficient quantities and using competitive technologies; availability of essential equipment, materials, components (such as memory supply), substrates or manufacturing processes; ability to achieve expected manufacturing yields for AMD’s products; AMD's ability to generate revenue from its semi-custom SoC products; potential security vulnerabilities; potential security incidents including IT outages, data loss, data breaches and cyberattacks; uncertainties involving the ordering and shipment of AMD’s products; AMD’s reliance on third-party intellectual property to design and introduce new products; AMD's reliance on third-party companies for design, manufacture and supply of motherboards, software, memory and other computer platform components; AMD's reliance on Microsoft and other software vendors' support to design and develop software to run on AMD’s products; AMD’s reliance on third-party distributors and add-in-board partners; impact of modification or interruption of AMD’s internal business processes and information systems; compatibility of AMD’s products with some or all industry-standard software and hardware; costs related to defective products; failure to maintain an efficient supply chain as customer demand changes; AMD's ability to rely on third party supply-chain logistics functions; AMD’s ability to effectively control sales of its products on the gray market; impact of climate change on AMD’s business; AMD’s ability to realize its deferred tax assets; potential tax liabilities; current and future claims and litigation; impact of environmental laws, conflict minerals related provisions and other laws or regulations; evolving expectations from governments, investors, customers and other stakeholders regarding corporate responsibility matters; issues related to the responsible use of AI; restrictions imposed by agreements governing AMD’s notes, the guarantees of Xilinx’s notes and the revolving credit agreement; AMD’s ability to satisfy financial obligations under guarantees, leases and other commercial commitments; impact of acquisitions, joint ventures and/or investments on AMD’s business and AMD’s ability to integrate acquired businesses; impact of any impairment of the combined company’s assets; political, legal and economic risks and natural disasters; future impairments of technology license purchases; AMD’s ability to attract and retain key employees; and AMD’s stock price volatility. Investors are urged to review in detail the risks and uncertainties in AMD’s Securities and Exchange Commission filings, including but not limited to AMD’s most recent reports on Forms 10-K and 10-Q.
CEREBRAS DISCLOSURE INFORMATION
Cerebras uses its investor relations page (investors.cerebras.ai), its X account (@cerebras), and its LinkedIn page (linkedin.com/company/cerebras-systems/) to disclose material non-public information and for complying with its disclosure obligations under Regulation FD. Accordingly, investors should monitor these channels, in addition to following Cerebras’ press releases, Securities and Exchange Commission (SEC) filings, public conference calls and public webcasts.
Forward-Looking Statements
This press release contains “forward-looking statements” within the meaning of applicable securities laws. All statements other than statements of historical fact could be deemed to be forward-looking, including, but not limited to, statements regarding the features, capacity, scalability, performance, timing, data center deployment and implementation, costs and expected benefits and opportunities associated with Cerebras' collaboration and joint solution with AMD, and any assumptions relating to the foregoing. The words “may,” “will,” “shall,” “should,” “expects,” “plans,” “anticipates,” “could,” “intends,” “target,” “projects,” “contemplates,” “believes,” “estimates,” “predicts,” “potential,” “objective,” or “continue,” or the negative of these words or other similar terms or expressions that concern our expectations, strategy, plans, or intentions are intended to identify forward-looking statements, although not all forward-looking statements contain these identifying words. These forward-looking statements are subject to a number of risks and uncertainties, many of which involve factors or circumstances that are beyond Cerebras’ control. These risks and uncertainties include, but are not limited to: Cerebras’ ability to sustain and manage its growth, access borrowings and other sources of capital on acceptable terms, and deploy available capital to support growth; its history of net losses and ability to achieve and maintain profitability; its limited operating history at its current scale and ability to accurately forecast revenue and appropriately budget and manage expenses; its dependence on a limited number of significant customers, including OpenAI, Group 42 Holding Ltd, Mohamed bin Zayed University of Artificial Intelligence, and AWS, and the potential impact of any reduction in demand from, material adverse development in its relationships with, or failure to meet its obligations to, such customers, including under its Master Relationship Agreement with OpenAI; the timing, execution and expected benefits of its strategic customer, partner and financing arrangements; its historical reliance on sales of hardware systems and the early-stage, rapidly evolving market for its cloud-based offerings and AI infrastructure; its ability to secure sufficient data center capacity and capital to support its cloud-based offerings; its ability to launch new offerings and add new product capabilities; and its ability to compete effectively in the rapidly evolving and competitive market for AI computing solutions.
Cerebras’ actual results could differ materially from those stated or implied in forward-looking statements due to a number of factors. Accordingly, undue reliance should not be placed on such statements. These forward-looking statements are made as of the date they were first issued and are based on information available to Cerebras together with Cerebras’ expectations, estimates, forecasts, projections, beliefs, and assumptions as of such date. These forward-looking statements should not be relied upon as representing Cerebras’ views as of any date subsequent to the date of this press release. Past performance is not necessarily indicative of future results. Cerebras undertakes no intention or obligation to update or revise any forward-looking statements, whether as a result of new information, future events, or otherwise, except as required by law.
Further information on potential risks that could affect actual results is included in Cerebras’ most recent filings with the Securities and Exchange Commission (the “SEC”), including in Cerebras’ most recent Quarterly Report on Form 10-Q, copies of which may be obtained by visiting Cerebras’ Investor Relations website at investors.cerebras.ai or the SEC’s website at www.sec.gov.
Contacts:
Aaron Grabein
AMD Communications
737-256-9518
aaron.grabein@amd.com
Liz Stine
AMD Investor Relations
720-652-3965
liz.stine@amd.com
Kriselle Laran
Cerebras
pr@cerebras.ai
Sean Dorsey
Cerebras Investor Relations
investors@cerebras.ai
_______________
i Based on modelling by AMD Performance Labs and Cerebras in July 2026 to determine tokens per second per kilowatt (TPS/kW) at a comparable interactivity point with Kimi 2.6 1T Model comparing an AMD Helios rackscale solution with Cerebras WSE to a Cerebras WSE-only configuration. System manufacturers may vary configurations, yielding different results. MI400-021
Source: Advanced Micro Devices, Inc.
Released July 23, 2026

### [E1641] Cerebras | 2026-07-23 17:45 UTC | 盘中
AMD and Cerebras Announce Industry-Leading Ultra-Low-Latency and High Throughput AI Inference Solution
News Highlights
- AMD and Cerebras are collaborating to advance a workload-optimized approach to ultra-low-latency AI inference infrastru
URL: https://investors.cerebras.ai/news-releases/news-release-details/amd-and-cerebras-announce-industry-leading-ultra-low-latency-and
AMD and Cerebras Announce Industry-Leading Ultra-Low-Latency and High Throughput AI Inference Solution
News Highlights
- AMD and Cerebras are collaborating to advance a workload-optimized approach to ultra-low-latency AI inference infrastructure.
- AMD Helios™ and the Cerebras Wafer-Scale Engine will operate as a single disaggregated inference workflow, combining ultra-high-throughput from AMD Instinct™ GPUs, with ultra-fast token generation of Cerebras Wafer-Scale Engine.
- Cerebras plans to deploy AMD Helios in its data centers, with the joint solution expected to be available first through Cerebras Cloud in the second half of 2026.
SAN FRANCISCO and SUNNYVALE, Calif. — July 23, 2026 — AMD (NASDAQ: AMD) and Cerebras Systems (NASDAQ: CBRS) announced a technical partnership to deliver a new disaggregated AI inference solution that combines AMD Helios™ rackscale solutions with the Cerebras Wafer-Scale Engine. Unveiled at Advancing AI 2026, the solution is designed to deliver the ultra-low latency required for the most advanced AI applications while dramatically increasing the throughput and efficiency.
The joint AMD and Cerebras solution will deploy AMD Helios alongside Cerebras Wafer-Scale Engine technology integrated in a single inference workflow for maximum performance and efficiency. AMD Helios will provide a high-performance, scalable throughput engine. Cerebras Wafer-Scale Engine technology will provide ultra-fast, ultra-low latency decode and token generation. Together, the two compute engines are expected to deliver up to 5x higher tokens per second per watt (T/s/W) .
AI inference workloads increasingly have different requirements across latency, throughput, token capacity, cost and scale. High-volume workloads prioritize maximizing token generation, while coding, real-time copilots, live agents and agentic workflows demand faster response times. These differences are driving demand for heterogeneous infrastructure that matches compute technologies to specific workload requirements.
The AMD and Cerebras solution addresses this challenge through disaggregated inference, optimizing the two primary stages of the workflow independently. AMD Helios provides ultra-high throughput, processing prompts and large context windows. The Cerebras Wafer-Scale Engine accelerates the memory-bandwidth-intensive token generation, with ultra-low latency. By connecting these best-in-class engines through one integrated workflow, the companies are creating a differentiated platform for ultra-low-latency inference without sacrificing throughput or scale.
"AI inference is becoming one of the largest infrastructure opportunities in AI, and its growing diversity requires a more flexible approach," said Dr. Lisa Su, chair and CEO, AMD. "AMD Helios delivers leadership performance and scale for the broadest range of inference workloads. Together with Cerebras, we are extending that leadership into the most latency-sensitive applications and creating a powerful new platform for real-time agentic AI."
"The demand for ultra-fast inference is growing at an unprecedented pace. Cerebras delivers the world's fastest, ultra-low-latency inference," said Andrew Feldman, CEO and co-founder, Cerebras. "Partnering with AMD gives us an incredible opportunity to bring that performance to even more customers."
Fast token generation is becoming increasingly important as AI moves into software development, autonomous agents, robotics, scientific discovery and other applications where response time directly shapes the user experience and the usefulness of the system. The joint solution brings together complementary architectures purpose-built for these demands.
AMD Helios provides the high-throughput prompt engine, rack-scale efficiency and deployment scale required to process large numbers of complex requests. Cerebras Wafer-Scale Engine technology provides the ultra-low-latency and decode performance needed to return tokens in real time. The result is a solution designed specifically for the ultra-low-latency segment of the inference market, with AMD Helios as the foundation for high-throughput and balanced inference workloads across the data center.
Cerebras plans to deploy AMD Helios systems in its data centers, with the joint solution expected to become available initially through Cerebras Cloud in the second half of 2026.
Supporting Resources
- Follow AMD at Advancing AI 2026 (Press Kit)
- Learn more about AMD Helios™ rackscale solution
- Learn more about AMD Instinct™ Accelerators
- Connect with AMD on LinkedIn
- Follow AMD on X
- Learn more about the Cerebras Wafer-Scale Engine
- Connect with Cerebras on LinkedIn | Follow Cerebras on X
About AMD
AMD (NASDAQ: AMD) drives innovation in high-performance and AI computing to solve the world's most important challenges. Today, AMD technology powers billions of experiences across cloud and AI infrastructure, embedded systems, AI PCs and gaming. With a broad portfolio of AI-optimized CPUs, GPUs, networking and software, AMD delivers full-stack AI solutions that provide the performance and scalability needed for a new era of intelligent computing. Learn more at www.amd.com.
About Cerebras Systems
Cerebras Systems (NASDAQ: CBRS) builds the world's fastest AI infrastructure. The Cerebras team of pioneering computer architects, computer scientists, AI researchers, and engineers of all types came together to make AI blisteringly fast through innovation and invention. We believe that when AI is fast, it will change the world. Leading global corporations, research institutes, and governments choose Cerebras to run their AI workloads. Cerebras solutions are available on premises and in the cloud. Visit cerebras.ai for more.
AMD CAUTIONARY STATEMENT
This press release contains forward-looking statements concerning Advanced Micro Devices, Inc. (AMD) such as the features, functionality, performance, availability, scalability, deployment, timing and expected benefits of AMD's collaboration and joint solution with Cerebras, which are made pursuant to the Safe Harbor provisions of the Private Securities Litigation Reform Act of 1995. Forward-looking statements are commonly identified by words such as "would," "may," "expects," "believes," "plans," "intends," "projects" and other terms with similar meaning. Investors are cautioned that the forward-looking statements in this press release are based on current beliefs, assumptions and expectations, speak only as of the date of this press release and involve risks and uncertainties that could cause actual results to differ materially from current expectations. Such statements are subject to certain known and unknown risks and uncertainties, many of which are difficult to predict and are generally beyond AMD's control, that could cause actual results and other future events to differ materially from those expressed in, or implied or projected by, the forward-looking information and statements. Material factors that could cause actual results to differ materially from current expectations include, without limitation, the following: impact of government actions and regulations such as export regulations, import tariffs, trade protection measures, and licensing requirements; competitive markets in which AMD's products are sold; the cyclical nature of the semiconductor industry; market conditions of the industries in which AMD products are sold; AMD's ability to introduce products on a timely basis with expected features and performance levels; loss of a significant customer; economic and market uncertainty; quarterly and seasonal sales patterns; AMD's ability to adequately protect its technology or other intellectual property; unfavorable currency exchange rate fluctuations; ability of third party manufacturers to manufacture AMD's products on a timely basis in sufficient quantities and using competitive technologies; availability of essential equipment, materials, components (such as memory supply), substrat

### [E1824] AMD | 2026-07-23 18:30 UTC | 盘中
AAI 2026: AMD Delivers Full-Stack Compute for the Agentic AI Era
AMD launches broad high-performance computing and physical AI portfolios, including its first rack-scale AI solution and the world’s most powerful AI rack, AMD Helios.
News Hi
URL: https://ir.amd.com/news-events/press-releases/detail/1294/aai-2026-amd-delivers-full-stack-compute-for-the-agentic-ai-era
AAI 2026: AMD Delivers Full-Stack Compute for the Agentic AI Era
AMD launches broad high-performance computing and physical AI portfolios, including its first rack-scale AI solution and the world’s most powerful AI rack, AMD Helios.
News Highlights
- At Advancing AI 2026, AMD launches 6th Gen AMD EPYC™ CPUs, AMD Instinct™ MI400 Series GPUs, AMD Helios™ AI rackscale solutions, AMD Ryzen™ AI Embedded X100 processors and the AMD Kria™ AI SOM and Robotics Developer Platform.
- AMD Helios delivers up to 30% more inference tokens per dollar than the competition, maximizing output from every rack deployed.
- AI is accelerating demand for the full range of AMD silicon spanning data center, PCs, edge and embedded processors, driving AMD’s TAM to ~$2 trillion in 2030.
- Anthropic, OpenAI, Meta, Cerebras, AT&T and Cisco detailed how they are collaborating with AMD to advance AI infrastructure, enterprise capabilities and edge AI.
SAN FRANCISCO, July 23, 2026 (GLOBE NEWSWIRE) -- AMD (NASDAQ: AMD) today launched its next-generation AI infrastructure and physical AI portfolio at Advancing AI 2026, led by AMD Helios rackscale solutions, now in production to be deployed by leading AI companies at gigawatt scale.
As AI expands from training to inference and agentic workloads, compute demand is accelerating rapidly. AMD delivers an open, full-stack AI platform that gives customers the flexibility to deploy the right compute for every workload.
“The next phase of AI will span frontier models, agents and physical AI, creating new opportunities to bring intelligence everywhere,” said Dr. Lisa Su, chair and CEO, AMD. “Realizing that potential will take the entire industry working together. AMD is partnering across the ecosystem to deliver leadership compute and open platforms that give customers the performance, flexibility and choice to scale AI from the data center to the edge.”
AMD Helios: The Highest Performance Rack-Scale AI Solution
Delivering frontier AI requires a fully integrated rack architecture, with every part of the stack pushing the boundaries of performance. AMD Helios rackscale solutions are built for this, with co-optimized silicon spanning 72 high-performance AMD Instinct™ MI455X GPUs and 18 powerful 6th Gen AMD EPYC™ “Venice” CPUs, connected by AMD Pensando™ front-end, scale-up and scale-out networking, and accelerated by AMD ROCm™ open software. AMD Helios combines leadership compute performance, memory capacity and networking bandwidth to deliver up to 30% more tokens per dollar than the leading competitive solution1.
Leading AI labs and cloud providers are choosing AMD Helios for its open, full-stack performance. They include OpenAI, Anthropic, Meta, Microsoft, Oracle, HUMAIN, Tensorwave, Vultr, Cirrascale and others. Systems will be available from leading OEMs, including Bull, HPE, Lenovo and Supermicro, as well as infrastructure partners Sanmina and Wiwynn.
At Advancing AI, AMD partners detailed how they deploy AMD AI infrastructure at scale for frontier training and inference:
- Anthropic and AMD further outlined Wednesday’s strategic partnership announcement to deploy up to 2 gigawatts of AMD Instinct MI455X GPUs in AMD Helios rackscale solutions. The companies are launching a multiyear engineering collaboration to use Claude to accelerate AMD software development. Specifically, the teams will use Claude to optimize workloads for AMD Instinct GPUs and accelerate ROCm software development. AMD will also broadly adopt Claude across its engineering and product development teams.
- OpenAI and AMD are partnering to optimize the full AI stack, from silicon to software. Leveraging OpenAI’s Triton framework with AMD ROCm software, the companies are optimizing GPT-class workloads on AMD Instinct MI455X GPUs and AMD Helios racks. OpenAI expects to bring Helios online beginning in the fourth quarter of 2026, with deployments accelerating throughout 2027.
- Meta and AMD are co-designing for gigawatt-scale deployments, optimizing AMD’s full AI compute stack for Meta workloads. Meta is now validating 6th Gen EPYC CPU platforms in its labs and has begun testing and validating workloads on AMD Helios racks as they prepare to deploy at scale.
- Cerebras and AMD are collaborating to deliver a combined solution of Cerebras ultra-low-latency AI compute and AMD Helios high-throughput rack-scale infrastructure to help improve inference efficiency, scalability and economics for ultra-low-latency inference serving.
Delivering the Highest Performance Data Center CPUs and GPUs
6th Gen EPYC processors deliver the broadest server CPU portfolio for agentic AI,2 spanning cloud, enterprise, general-purpose and high-performance computing (HPC) workloads. With leadership per-core performance and the highest thread density3, they enable the most agents per watt, per dollar and per rack.4,5,6 For AI host nodes, 6th Gen EPYC CPUs deliver the speed and memory bandwidth to keep accelerators fully fed. And for general-purpose servers, they bring leadership performance and energy efficiency to run business critical applications and AI support tasks.
With AMD Instinct™ MI400 Series GPUs, AMD delivers powerful performance for cloud, enterprise and HPC workloads. AMD Instinct MI455X GPUs deliver 34x higher token throughput compared to MI355X GPUs7. For high-precision workloads, the AMD Instinct™ MI430X accelerator is the most advanced for HPC and sovereign AI with up to 288 TFLOPS of hardware-based FP64 performance for scientific computing. Instinct MI430X accelerators are powering the next wave of exascale-class supercomputers across the U.S. and Europe.
AMD also launched the Instinct MI350P GPU, bringing seamless AI acceleration to existing infrastructure with leadership token economics. MI350P GPUs deliver up to 4.2x more tokens per second per dollar than the competition8.
Advancing the Open Software Ecosystem
For developers, AMD ROCm is the open software platform with the performance, flexibility and ecosystem support needed to build and deploy AI on AMD hardware. Building on that foundation, AMD is introducing ROCm.ai, an AI-driven development platform that helps developers build, optimize and deploy GPU software faster across AMD platforms. ROCm.ai brings AI-assisted GPU programming to developers by enabling popular coding agents such as Claude, Codex and Cursor to understand AMD platforms and ROCm natively.
ROCm.ai is accelerating software enablement for AMD Instinct MI455X GPUs while optimizing performance. Leading open-source frameworks including PyTorch, Hugging Face, vLLM and SGLang are already enabled on MI455X and seeing great results.
Accelerating Next-Generation AI Infrastructure
AMD is extending its annual cadence of CPU, GPU, networking and rack-scale innovation through 2030. The company shared new details on its roadmaps, including:
- Next-generation EPYC server CPUs based on the “Zen 7” architecture are coming in 2028. The “Florence,” “Ferrara” and “Fidenza” CPUs are expected to extend AMD’s leadership in density, performance, performance-per-system dollar and performance-per-watt.
- “Ravenna” CPUs based on the “Zen 8” architecture are coming in 2030, designed to continue AMD server CPU leadership.
- Next-generation AMD Instinct MI500 Series GPUs are coming in 2027, with next-generation compute, memory and interconnect technologies for leadership performance.
- AMD Instinct MI600 Series GPUs are coming in 2028.
- The next-generation AMD Helios 500 rackscale solution will be powered by AMD Instinct MI500 Series GPUs and AMD EPYC “Verano” CPUs, with next-gen Pensando “Como” and “Monza” networking. The AMD Helios 600 rackscale solution will follow, powered by AMD Instinct MI600 Series GPUs, EPYC “Ferrara” CPUs and Pensando “Palma” and “Levanzo” networking.
Scaling AI Across Enterprise
Leading enterprises run on AMD infrastructure, from cloud, hybrid and on-prem data centers to AI-enabled PC fleets. AMD technologies are helping customers scale quickly and accelerate enterprise transformation.
At Advancing AI, AT&T illustrated how it is deploying flexible enterprise AI using AMD technology across cloud, on-premises and air-gapped environments. AT&T is also using AMD Instinct GPUs and ROCm software to power its OTel 2.0 model, an open-source model trained specifically for telecoms.
With the AMD Ryzen™ AI Halo developer platform, AMD delivers performance, efficiency and simplicity that makes local AI development accessible. More AMD Ryzen AI Halo platforms, powered by Ryzen™ AI Max PRO 400 Series processors, will be available later this year from AMD and OEM partners.
Cisco and AMD are collaborating to combine AMD high-performance inference engines, including AMD Ryzen AI Halo systems, with Cisco networking, observability and security capabilities, so enterprises can deploy, govern and manage hybrid and local agentic AI at scale.
Advancing the Next Frontier of Physical AI
As AI expands across cloud, enterprise and local systems, the next frontier is bringing intelligence into machines that perceive, reason and act in the physical world. Building on a long legacy in robotics with AMD FPGAs and adaptive SoCs, AMD introduced AMD Kria™ AI solutions, extending the company’s robotics capabilities from the robot body to the robot brain. AMD uniquely brings AI perception, reasoning and agentic decision-making and control together on a single platform to deliver the performance required for demanding real-world robotic systems.
The portfolio includes new AMD Kria AI system-on-modules (SOMs), powered by the new AMD Ryzen AI Embedded X100 Series processors, and the AMD Kria AI Robotics Developer Platform, the first open, turnkey integrated platform for autonomous robotics combining CPU, GPU, NPU and FPGA compute. Together with an expanded open software ecosystem, AMD Kria AI solutions remove vendor lock-in and help developers and customers accelerate the path from prototype to production for next-generation physical AI systems.
Supporting Resources
- Follow AMD at Advancing AI 2026 (Press Kit)
- Watch the AAI keynote replay
About AMD
AMD (NASDAQ: AMD) drives innovation in high-performance and AI computing to solve the world’s most important challenges. Today, AMD technology powers billions of experiences across cloud and AI infrastructure, embedded systems, AI PCs and gaming. With a broad portfolio of AI-optimized CPUs, GPUs, networking and software, AMD delivers full-stack AI solutions that provide the performance and scalability needed for a new era of intelligent computing. Learn more at www.amd.com.
CAUTIONARY STATEMENT
This press release contains forward-looking statements concerning Advanced Micro Devices, Inc. (AMD) such as AI accelerating demand for the full range of AMD silicon, driving AMD’s total addressable market to ~$2 trillion in 2030; compute demand accelerating; the next phase of AI; the features, functionality, performance, availability, timing and expected benefits of AMD products, including, but not limited to, 6th Gen AMD EPYC™ CPUs, AMD Instinct™ MI400 Series GPUs, AMD Helios™ AI rackscale solutions, AMD Ryzen™ AI Embedded X100 processors and the AMD Kria™ AI SOM and Robotics Developer Platform; expected plans, benefits, scalability and deployments with AMD partners including Anthropic, OpenAI, Meta and Cerebras; AMD’s AI infrastructure product roadmaps through 2030; and AMD’s collaboration with AT&T and Cisco, which are made pursuant to the Safe Harbor provisions of the Private Securities Litigation Reform Act of 1995. Forward-looking statements are commonly identified by words such as "would," "may," "expects," "believes," "plans," "intends," "projects" and other terms with similar meaning. Investors are cautioned that the forward-looking statements in this press release are based on current beliefs, assumptions and expectations, speak only as of the date of this press release and involve risks and uncertainties that could cause actual results to differ materially from current expectations. Such statements are subject to certain known and unknown risks and uncertainties, many of which are difficult to predict and are generally beyond AMD's control, that could cause actual results and other future events to differ materially from those expressed in, or implied or projected by, the forward-looking information and statements. Material factors that could cause actual results to differ materially from current expectations include, without limitation, the following: impact of government actions and regulations such as export regulations, import tariffs, trade protection measures, and licensing requirements; competitive markets in which AMD’s products are sold; the cyclical nature of the semiconductor industry; market conditions of the industries in which AMD products are sold; AMD’s ability to introduce products on a timely basis with expected features and performance levels; loss of a significant customer; economic and market uncertainty; quarterly and seasonal sales patterns; AMD's ability to adequately protect its technology or other intellectual property; unfavorable currency exchange rate fluctuations; ability of third party manufacturers to manufacture AMD's products on a timely basis in sufficient quantities and using competitive technologies; availability of essential equipment, materials, components (such as memory supply), substrates or manufacturing processes; ability to achieve expected manufacturing yields for AMD’s products; AMD's ability to generate revenue from its semi-custom SoC products; potential security vulnerabilities; potential security incidents including IT outages, data loss, data breaches and cyberattacks; uncertainties involving the ordering and shipment of AMD’s products; AMD’s reliance on third-party intellectual property to design and introduce new products; AMD's reliance on third-party companies for design, manufacture and supply of motherboards, software, memory and other computer platform components; AMD's reliance on Microsoft and other software vendors' support to design and develop software to run on AMD’s products; AMD’s reliance on third-party distributors and add-in-board partners; impact of modification or interruption of AMD’s internal business processes and information systems; compatibility of AMD’s products with some or all industry-standard software and hardware; costs related to defective products; failure to maintain an efficient supply chain as customer demand changes; AMD's ability to rely on third party supply-chain logistics functions; AMD’s ability to effectively control sales of its products on the gray market; impact of climate change on AMD’s business; AMD’s ability to realize its deferred tax assets; potential tax liabilities; current and future claims and litigation; impact of environmental laws, conflict minerals related provisions and other laws or regulations; evolving expectations from governments, investors, customers and other stakeholders regarding corporate responsibility matters; issues related to the responsible use of AI; restrictions imposed by agreements governing AMD’s notes, the guarantees of Xilinx’s notes and the revolving credit agreement; AMD’s ability to satisfy financial obligations under guarantees, leases and other commercial commitments; impact of acquisitions, joint ventures and/or investments on AMD’s business and AMD’s ability to integrate acquired businesses; impact of any impairment of the combined company’s assets; political, legal and economic risks and natural disasters; future impairments of technology license purchases; AMD’s ability to attract and retain key employees; and AMD’s stock price volatility. Investors are urged to review in detail the risks and uncertainties in AMD’s Securities and Exchange Commission filings, including but not limited to AMD’s most recent reports on Forms 10-K and 10-Q.
_________________________
1Based on AMD Performance Labs estimates as of July 2026, tokens-per-dollar performance was calculated using the Kimi K2 Thinking workload (32K input / 8K output) on an AMD Helios rackscale solution compared to an NVIDIA Vera Rubin NVL72 rack. Results reflect estimated aggregate throughput across low, medium, and high-interactivity operating points and hourly pricing projection of system GPUs based on market conditions. System configurations may vary by manufacturer and may produce different results. MI400-025
2 EPYC-068 - The AMD EPYC server CPU portfolio spans the industry’s broadest ranges of data center deployments, from general-purpose enterprise, cloud, telecom, SMB, and HPC systems to emerging AI environments including sandboxed agentic AI deployments and GPU head node servers. AMD EPYC 6th Generation platforms extend this breadth by uniquely combining high core and thread density of up to 512 threads, advanced memory bandwidth of up to 16 channels of 12.8 GT/s MRDIMM support, next-generation PCIe® Gen 6 connectivity, and select SKUs with boost frequencies up to 5 GHz.
3 EPYC-025D: As of July 2026, 6th Gen EPYC 9996 has 256 cores and 512 threads with SMT enabled which is higher than any other publicly disclosed 1P CPU
4 9xx6-012: Based on estimated performance data for Nvidia, Intel®, and AMD EPYC™ Server Processors for Agentic AI, the AMD EPYC9996 provides the most agents per rack at a 100Kw power envelope per rack.
Compared to the cores per rack of Nvidia Vera (88c) powered server racks:
- The AMD EPYC 9996 (256C) provides 2.08x the cores (and threads with SMT) per rack
- The AMD EPYC 9965 (192C) provides 1.86x the cores (and threads with SMT) per rack
- The Intel Xeon 6980P (128C) provides 1.24x the cores (and threads with SMT) per rack
Source: https://www.amd.com/content/dam/amd/en/documents/solutions/ai/methodology-description.pdf
Agent counts are estimates derived from available CPU thread resources used as a proxy under a consistent theoretical workload. Actual agent capacity and throughput will vary based on workload, model, memory, software, orchestration, and system configuration.
5 9xx6-013: Comparison based on published Top-of-stack core counts and 1Ku pricing for estimated highest Agents / CPU $ and threads / CPU $ AMD EPYC™ 9006 (512 threads), AMD EPYC™ 9005 (384 threads), and Intel® Xeon® 6 (256 threads) SKUs as of 7/22/2026. Threads derived as 2 threads per core (SMT). Intel and Xeon are trademarks of Intel Corporation or its subsidiaries. Source: https://www.amd.com/content/dam/amd/en/documents/solutions/ai/methodology-description.pdf Agent counts are estimates derived from available CPU thread resources used as a proxy under a consistent theoretical workload. Actual agent capacity and throughput will vary based on workload, model, memory, software, orchestration, and system configuration.
6 9xx6-014: Comparison based on published Top-of-stack core counts and CPU W, Default CPU Power for 6th Gen EPYC, and TDPs for 5th Gen EPYC, Intel® Xeon®, and Nvidia Vera for estimated Highest Agents / CPU W across AMD EPYC™ 9956 (400W Default CPU Power), AMD EPYC™ 9965 (500W TDP), Nvidia Vera (450W TDP), ARM AGI (300W TDP), and Intel® Xeon® 6980P (500W TDP) powered servers as of 7/22/2026. 2 threads per core (SMT). 1 thread per core for ARM AGI.
Starting with the 6th Gen AMD EPYC™ server processor family, AMD uses Default CPU Power to describe processor power consumption, succeeding AMD's historical TDP reference. Default CPU Power reflects total power consumed across the processor's compute and I/O dies for the stated performance target. Default CPU Power and TDP may both serve as processor power references for product comparison, platform planning, and performance-per-watt analysis. Agent counts are estimates derived from available CPU thread resources used as a proxy under a consistent theoretical workload. Actual agent capacity and throughput will vary based on workload, model, memory, software, orchestration, and system configuration. Intel Xeon TDP from ark.intel.com. Nvidia Vera TDP from https://developer.nvidia.com/blog/nvidia-vera-cpu-sets-a-new-standard-for-agentic-workloads-in-ai-factories/. ARM AGI Specifications from https://www.arm.com/products/cloud-datacenter/arm-agi-cpu#Specifications
7 MI400-020: Based on measurements and calculations by AMD Performance Labs in July 2026, for the AMD Instinct™ MI455X GPU to determine measured token throughput at high, medium and low interactivity points run on Deepseek V4 Flash with FP4 serving compared to AMD Instinct™ MI355X GPU. System manufacturers may vary configurations, yielding different results.
8 MI350P-007: Based on AMD internal testing (July 2026), on a (1x) AMD Instinct MI350P GPU vs (1x) NVIDIA H200 NVL GPU on the Llama 3.3 70B Instruct (FP8) online serving output-throughput per dollar (tok/s/USD) comparison at ISL/OSL 1024/1024 across concurrency levels 1, 4, 8, 16, 32, 64, 128, 256, 512; median of 3 runs per point. MI350P based server internal AMD estimated pricing as $327,238.40 USD. RTX_PRO_6000 based server public list price reported on OEM website as $265,928.24 USD as of 7/16/2026. Stated results are the peak per-concurrency ratios: MI350P served via AIMS silogenai/aim-instinct-meta-llama-llama-3-3-70b-instruct:0.12.0-rc6; H200 NVL via NVIDIA NIM nvcr.io/nim/meta/llama-3.3-70b-instruct:2.0.6; RTX PRO 6000 via NVIDIA NIM nvcr.io/nim/meta/llama-3.3-70b-instruct:2.0.6. Configuration: 8x AMD Instinct MI350P PCIe Card (CDNA4, gfx950, 128 CUs, 144 GB HBM3E, SPX compute / NPS1), vBIOS 113-350P-01-1K1-000A, GPU driver 6.19.13-2353916.24.04, ROCm 7.14.0 (AMD-SMI 26.5.0); host 2P AMD EPYC 9455 (48-core), Dell PowerEdge XE7745, BIOS 1.7.6, microcode 0xb002162, SMT Enabled, Ubuntu 24.04.4 LTS, Linux 6.8.0-124-generic || NVIDIA RTX PRO 6000: 8x NVIDIA RTX PRO 6000 Blackwell Server Edition, vBIOS 98.02.8D.00.01, GPU driver 595.45.04, CUDA 13.2; host 2P AMD EPYC 9455 (48-core), Dell PowerEdge XE7745, BIOS 1.6.4, microcode 0xb00215a, SMT Enabled, Ubuntu 24.04.4 LTS, Linux 6.8.0-124-generic. Sever manufacturers may vary configurations, yielding different results. Results may vary due to factors including system configurations, software versions and BIOS settings.
Contact:
Brandi Martina
AMD Communications
(512) 705-1720
Brandi.martina@amd.com
Liz Stine
AMD Investor Relations
(720) 652-3965
liz.stine@amd.com
Source: Advanced Micro Devices, Inc.
Released July 23, 2026

### [E1975] 新浪财经7x24 | 2026-07-23 19:05 UTC | 盘中
AMD 首席执行官：OpenAI 相关部署工作正按计划推进， OpenAI 已重金押注 AMD。
URL: https://wap.cj.sina.cn/pc/7x24/5005351
AMD 首席执行官：OpenAI 相关部署工作正按计划推进， OpenAI 已重金押注 AMD。

### [E1985] 新浪财经7x24 | 2026-07-23 19:07 UTC | 盘中
AMD 首席执行官：Anthropic 将通过公有云、新型云服务商，或自建部分数据中心采购使用 AMD 的 CPU 与 GPU 产品。
URL: https://wap.cj.sina.cn/pc/7x24/5005354
AMD 首席执行官：Anthropic 将通过公有云、新型云服务商，或自建部分数据中心采购使用 AMD 的 CPU 与 GPU 产品。

### [E1987] First Squawk | 2026-07-23 19:08 UTC | 盘中
AMD ADDED THAT OPENAI'S DEPLOYMENT IS ON TRACK AND SAID ANTHROPIC WILL USE AMD CPUS AND GPUS ACROSS CLOUDS, NEOCLOUDS, AND POTENTIALLY ITS OWN DATA CENTERS, UNDERSCORING STRONG ADOPTION OF AMD'S AI INFRASTRUCTURE.
URL: https://x.com/FirstSquawk/status/2080369502219633080
AMD ADDED THAT OPENAI'S DEPLOYMENT IS ON TRACK AND SAID ANTHROPIC WILL USE AMD CPUS AND GPUS ACROSS CLOUDS, NEOCLOUDS, AND POTENTIALLY ITS OWN DATA CENTERS, UNDERSCORING STRONG ADOPTION OF AMD'S AI INFRASTRUCTURE.

### [E2617] TechCrunch AI | 2026-07-23 20:33 UTC | 收盘后
AMD takes on Nvidia with its Helios AI rack-scale system
URL: https://techcrunch.com/2026/07/23/amd-takes-on-nvidia-with-its-helios-ai-rack-scale-system/
Chipmaker AMD is taking aim at competitor Nvidia with its latest hardware release: a rack-scale system designed to power computing needs of the world’s largest AI labs.
At the company’s sold-out Advancing AI conference in San Francisco on Thursday, AMD Chair and CEO Dr. Lisa Su promoted the new AI rack system known as Helios — along with its growing list of customers, including Microsoft — as the company prepares to ship it later this year. Su also pitched the company’s newest chips that are designed to feed the compute-hungry dragon that is the AI industry.
Rack systems combine many processors into a single high-powered unit. They are built for data centers, where they train and run AI models and other compute-intensive workloads.
Su called Helios the tech industry’s “highest performance AI rack,” adding that it was “built to train and run the most demanding frontier models in the world at massive scale.” The system will be deployed by leading AI companies at gigawatt-scale, the company said.
Nvidia has historically dominated this market with its Vera Rubin and Grace Blackwell rack-scale systems. AMD is clearly looking to get in on the action. And Helios’ performance metrics appear to give it a real chance, beating out Vera Rubin by a number of metrics, the Register reported.
Helios, which was first revealed in 2025 and shown onstage in January at CES 2026, already has several well-known customers, including OpenAI, Meta, Oracle, Anthropic, and Microsoft, all of which have plans to deploy the system. Microsoft CEO Satya Nadella said Monday that the company would expand its Azure infrastructure with Helios. Meanwhile, Anthropic and AMD announced a strategic partnership Wednesday for deploy up to two gigawatts of GPUs via the new rack system.
AMD also introduced Thursday its Venice-X CPU, which is designed for data centers and to handle high-computing workloads. The Venice-X is expected to launch in 2027.
During her remarks, Su commented on the trajectory of the chip industry, claiming that, by the year 2030, chips that power AI will become a massive part of the overall computing market. This’s because the industry is “seeing a step change in compute demand” driven largely by the rise of agentic AI, she said.
“When you ask the agent to do something, it actually has dozens of steps, and it has to reason, and it has to call tools, and it has to access data, and it has to keep doing it over and over until it solves the problem, and so you need lots of GPUs to do all that,” the executive said.
“We’re now expecting that by 2030, the AI accelerator market is going to reach about $1.4 trillion,” Su said. “What that means is, by the end of the decade, the AI accelerator market is going to approach the size of the entire semiconductor market today.”
“We do expect that GPUs are going to make up the vast majority of that market because the algorithms are still very much in their infancy, and we’re still continuing to see the workloads change, and that favors programmability in the overall silicon ecosystem,” she added.

### [E2618] TechCrunch AI | 2026-07-23 20:33 UTC | 收盘后
AMD takes on Nvidia with its Helios AI rack scale system
URL: https://techcrunch.com/2026/07/23/amd-takes-on-nvidia-with-its-helios-ai-rack-scale-system/
Chipmaker AMD is taking aim at competitor Nvidia with its latest hardware release: a rack-scale system designed to power computing needs of the world’s largest AI labs.
At the company’s sold-out Advancing AI conference in San Francisco on Thursday, AMD Chair and CEO Dr. Lisa Su promoted the new AI rack system known as Helios — along with its growing list of customers, including Microsoft — as the company prepares to ship it later this year. Su also pitched the company’s newest chips that are designed to feed the compute-hungry dragon that is the AI industry.
Rack systems combine many processors into a single high-powered unit. They are built for data centers, where they train and run AI models and other compute-intensive workloads.
Su called Helios the tech industry’s “highest performance AI rack,” adding that it was “built to train and run the most demanding frontier models in the world at massive scale.” The system will be deployed by leading AI companies at gigawatt-scale, the company said.
Nvidia has historically dominated this market with its Vera Rubin and Grace Blackwell rack-scale systems. AMD is clearly looking to get in on the action. And Helios’ performance metrics appear to give it a real chance, beating out Vera Rubin by a number of metrics, the Register reported.
Helios, which was first revealed in 2025 and shown onstage in January at CES 2026, already has several well-known customers, including OpenAI, Meta, Oracle, Anthropic, and Microsoft, all of which have plans to deploy the system. Microsoft CEO Satya Nadella said Monday that the company would expand its Azure infrastructure with Helios. Meanwhile, Anthropic and AMD announced a strategic partnership Wednesday for deploy up to two gigawatts of GPUs via the new rack system.
AMD also introduced Thursday its Venice-X CPU, which is designed for data centers and to handle high-computing workloads. The Venice-X is expected to launch in 2027.
During her remarks, Su commented on the trajectory of the chip industry, claiming that, by the year 2030, chips that power AI will become a massive part of the overall computing market. This’s because the industry is “seeing a step change in compute demand” driven largely by the rise of agentic AI, she said.
“When you ask the agent to do something, it actually has dozens of steps, and it has to reason, and it has to call tools, and it has to access data, and it has to keep doing it over and over until it solves the problem, and so you need lots of GPUs to do all that,” the executive said.
“We’re now expecting that by 2030, the AI accelerator market is going to reach about $1.4 trillion,” Su said. “What that means is, by the end of the decade, the AI accelerator market is going to approach the size of the entire semiconductor market today.”
“We do expect that GPUs are going to make up the vast majority of that market because the algorithms are still very much in their infancy, and we’re still continuing to see the workloads change, and that favors programmability in the overall silicon ecosystem,” she added.

### [E1431] 新浪财经7x24 | 2026-07-23 16:55 UTC | 盘中
AMD股价跌至盘中低点4%，管理层在公司活动上发表讲话。
URL: https://wap.cj.sina.cn/pc/7x24/5005227
AMD股价跌至盘中低点4%，管理层在公司活动上发表讲话。

### [E1965] 研报平权 | 2026-07-23 19:02 UTC | 盘中
不，我们还没有走出 CUDA 护城河时代。
但我们已经告别了过去几年我所经历的那种对 超威半导体 GPU 计算完全不感兴趣的状态。如今不断有人询问、甚至恳求获得一台配备 8倍 MI300X GPUs 的服务器，哪怕只用一天，因为他们想运行一次概念验证（PoC），看看它与 英伟达 相比表现如何。
他们期待我们能以某种方式拿出价值数百万的计算资源，闲置几个小时供人测试，再由他们决定是否继续。
现在，我们已经搭建了一个平台，通过将所有相关的资源配置工作自动化，让这类概念验证（PoC
URL: https://wx.zsxq.com/dweb2/index/topic_detail/22255421415281821
不，我们还没有走出 CUDA 护城河时代。
但我们已经告别了过去几年我所经历的那种对 超威半导体 GPU 计算完全不感兴趣的状态。如今不断有人询问、甚至恳求获得一台配备 8倍 MI300X GPUs 的服务器，哪怕只用一天，因为他们想运行一次概念验证（PoC），看看它与 英伟达 相比表现如何。
他们期待我们能以某种方式拿出价值数百万的计算资源，闲置几个小时供人测试，再由他们决定是否继续。
现在，我们已经搭建了一个平台，通过将所有相关的资源配置工作自动化，让这类概念验证（PoC）变得容易。我们缺少的是足够的计算资源来满足这些请求。
整个行业一直完全专注于由债务融资支持的长期合同。这意味着没有人拥有多余设备可供出租；即使有，他们也没有轻松接入和移出客户所需的自动化能力。这些概念验证（PoC）的成本太高，因此企业把我当作最后的求助对象。
所以，我们的业务陷入了困境：我们有客户需求，也有自动化能力，但没有计算资源。更重要的是，我们没有资金购买更多计算资源。
这就是我正在寻找投资者的原因。 #资讯#


## 研究交付要求

这是一条已经从整场材料语义拆出的独立催化，不要重新把它压回大盘总评。核实美股异动原因和传播时序；用结构化供应链、内部 KB 与公司披露坐实每个亚洲候选；逐腿查真实行情和本地市场 price-in；候选不成立也要逐条给出有证据的 AVOID。